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  • This line was added.
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  • Formatting was changed.


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Design Name is always "TE Series Name" + Design name, for example "TE0720 Test Board"


Date

Version

Changes

Author

2024-06-183.1.18
  • Design flow → point 6 changed: the file boot.scr ... changed from required to optional
ma
2023-12-143.1.17
  • updated according to Vivado 2023.2
ma
2023-06-133.1.16
  • Design flow:
    • added alternative programming files in Petalinux
  • added chapter FSBL Patch in Software Design - Petalinux
ma
2023-06-013.1.15
  • removed u-boot.dtb from Design flow
ma
2023-06-013.1.14
  • expandable lists for revision history and supported hardware
wh
2023-05-253.1.13
  • updated according to Vivado 2022.2
ma
2023-02-083.1.12
  • removed content of
    • Special FSBL for QSPI programming
ma
2022-08-243.1.11
  • Modification from link "available short link"
ma
2022-01-253.1.10
  • removed u-boot.dtb from QSPI-Boot mode and SD-Boot mode. Is implemented in BOOT.bin
  • corrected Boot Source File in Boot Script-File
ma
2022-01-143.1.9
  • extended notes for microblaze boot process with linux
  • add u.boot.dtb to petalinux notes
  • add dtb to prebuilt content
  • replace 20.2 with 21.2
jh

2021-06-28

3.1.8

  • added boot process for Microblaze

  • minor typos, formatting

ma

2021-06-01

3.1.7

  • carrier reference note

jh

2021-05-04

3.1.6

  • removed zynq_ from zynq_fsbl

ma

2021-04-28

3.1.5

  • added macro "Scroll ignore" for suppression of horizontal dividing lines during .pdf-export

  • minor typos, formatting

ma

2021-04-27

3.1.4

  • Version History

    • changed from list to table

  • Design flow

    • removed step 5 from Design flow

    • changed link from TE Board Part Files to Vivado Board Part Flow

    • changed cmd shell from picture to codeblock

    • added hidden template for "Copy PetaLinux build image files", depending from hardware

    • added hidden template for "Power on PCB", depending from hardware

  • Usage update of boot process

  • Requirements - Hardware

    • added "*used as reference" for hardware requirements

  • all

    • placed a horizontal separation line under each chapter heading

    • changed title-alignment for tables from left to center

  • all tables

    • added "<project folder>\board_files" in Vivado design sources

ma


3.1.3

  • Design Flow

    • formatting

  • Launch

    • formatting

ma


3.1.2

  • minor typing corrections

  • replaced SDK by Vitis

  • changed from / to \ for windows paths

  • replaced <design name> by <project folder>

  • added "" for path names

  • added boot.src description

  • added USB for programming

ma


3.1.1

  • swapped order from prebuilt files

  • minor typing corrections

  • removed Win OS path length from Design flow, added as caution in Design flow

ma


3.1

  • Fix problem with pdf export and side scroll bar

  • update 19.2 to 20.2

  • add prebuilt content option



3.0

  • add fix table of content

  • add table size as macro

  • removed page initial creator



Custom_table_size_100

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Important General Note:

  • Export PDF to download, if vivado revision is changed!

  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)

      • Figure template (note: inner scroll ignore/only only with drawIO object):

        Scroll Title
        anchorFigure_xyz
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, use


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

        • Set column width manually (can be used for small tables to fit over whole page) or leave empty (automatically)


      • Scroll Title
        anchorTable_xyz
        titleText

        Scroll Table Layout
        orientationportrait
        sortDirectionASC
        repeatTableHeadersdefault
        sortByColumn1
        sortEnabledfalse
        cellHighlightingtrue

        Example

        Comment

        1

        2



  • ...

Overview

Scroll Ignore
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scroll-officetrue
scroll-chmtrue
scroll-docbooktrue
scroll-eclipsehelptrue
scroll-epubtrue
scroll-htmltrue


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Notes :

Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via Vitis.

Refer to http://trenz.org/te0803-info for the current online version of this manual and other available documentation.

Key Features

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Notes :

  • Add basic key futures, which can be tested with the design


Excerpt
  • Vitis/Vivado 20222023.2

  • QSPI

  • Custom Carrier (minimum PS Design with available module components only)

  • Modified FSBL (some additional outputs only)

Revision History

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Notes :

  • add every update file on the download

  • add design changes on description

Expand
titleExpand List
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titleDesign Revision History

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Date

Vivado

Project Built

Authors

Description

20232024-0908-142820222023.2TE0803-test_board-vivado_20222023.2-build_84_2023091412475620240823075240.zip
TE0803-test_board_noprebuilt-vivado_20222023.2-build_84_2023091412475620240823075240.zip
Manuela StrückerJohn Hartfiel
  • 20222023.2 update
  • new assembly variants
  • board files: fixed PS refc clk rounding issue
2023-09-142022.2TE0803-test_board-vivado_2022.2-build_8_20230914124756.zip
TE0803-test_board_noprebuilt-vivado_2022.2-build_8_20230914124756.zip
Manuela Strücker
  • 2022.2 update
  • new assembly variants
2022-10-172022-10-172021.2.1TE0803-test_board-vivado_2021.2-build_18_20221017093148.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_18_20221017093148.zip
Manuela Strücker
  • script update
2022-08-302021.2.1TE0803-test_board-vivado_2021.2-build_15_20220830131430.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_15_20220830131430.zip
Manuela Strücker
  • new assembly variants
2022-04-052021.2TE0803-test_board-vivado_2021.2-build_11_20220405100116.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_11_20220405100116.zip
Manuela Strücker
  • 2021.2 update
2021-09-062020.2TE0803-test_board-vivado_2020.2-build_7_20210906104518.zip
TE0803-test_board_noprebuilt-vivado_2020.2-build_7_20210906104536.zip
Manuela Strücker
  • 2020.2 update
  • update document style

2020-04-06

2019.2

TE0803-test_board-vivado_2019.2-build_9_20200406081019.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_9_20200406081036.zip

John Hartfiel

  • new assembly variants

2020-03-25

2019.2

TE0803-test_board-vivado_2019.2-build_8_20200325082253.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_8_20200325082311.zip

John Hartfiel

  • script update

2020-01-23

2019-2

TE0803-test_board-vivado_2019.2-build_3_20200123070036.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_3_20200123070049.zip

John Hartfiel

  • 2019.2 update

  • Vitis support

  • FSBL SI programming procedure update 

2019-5-06

2018.3

TE0803-test_board_noprebuilt-vivado_2018.3-build_05_20190506161948.zip

TE0803-test_board-vivado_2018.3-build_05_20190506161936.zip

John Hartfiel

  • custom FSBL

  • new assembly variants

2018-10-26

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_03_20181026141705.zip

TE0803-test_board-vivado_2018.2-build_03_20181026141651.zip

John Hartfiel

  • new assembly variant

2018-08-14

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180814103119.zip

TE0803-test_board-vivado_2018.2-build_02_20180814103105.zip

John Hartfiel

  • new assembly variant

2018-07-13

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180713085721.zip

TE0803-test_board-vivado_2018.2-build_02_20180713085704.zip

John Hartfiel

  • additional notes for FSBL generated with Win SDK

  • changed *.bif

2018-05-17

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_09_20180517152118.zip

TE0803-test_board-vivado_2017.4-build_09_20180517152103.zip

John Hartfiel

  • new assembly variant

2018-04-11

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_07_20180411081821.zip

TE0803-test_board-vivado_2017.4-build_07_20180411081757.zip

John Hartfiel

  • bugfix TE0803-01-04EG board part file

2018-02-13

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_06_20180213120257.zip

TE0803-test_board-vivado_2017.4-build_06_20180213120229.zip

John Hartfiel

  • new assembly variant

2018-02-05

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180205101915.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180205101943.zip

John Hartfiel

  • new assembly variant

2018-01-31

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180131124202.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180131124215.zip

John Hartfiel

  • new assembly variant

2018-01-18

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180118160549.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180118160604.zip

John Hartfiel

  • rework Board Part Files

2017-11-16

2017.2

TE0803-test_board-vivado_2017.2-build_05_20171116152716.zip

TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171116154619.zip

John Hartfiel

  • Update Board Part CSV File with new Flash assembly variants

2017-11-14

2017.2

TE0803-test_board-vivado_2017.2-build_05_20171114090712.zip

TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171114090725.zip

John Hartfiel

  • Initial release



Release Notes and Know Issues

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Notes :
  • add known Design issues and general notes for the current revision
  • do not delete known issue, add fixed version time stamp if issue fixed


Scroll Title
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titleKnown Issues

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IssuesDescriptionWorkaroundTo be fixed version
Xilinx SoftwareIncompatibility of board files for ZynqMP with eMMC activated between 2021.2 and 2021.2.1 patch, see Xilinx Forum Requestuse corresponding board files for the Vivado versions--
QSPI FlashFlash programming is not supported with boot mode QSPI or SD. If flash programming fails, configure device for JTAG boot mode and try again or
use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2)
--


Requirements

Software

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Notes :

  • list of software which was used to generate the design


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titleSoftware

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SoftwareVersionNote
Vitis20222023.2needed, Vivado is included into Vitis installation



Hardware

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Notes :

  • list of hardware which was used to generate the design
  • mark the module and carrier board, which was used tested with an *
Basic description of TE Board Part Files is available on TE Board Part Files.

Complete List is available on "<project folder>\board_files\*_board_files.csv"

Design supports following modules:


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2eg64MB3eg3cg64MB2eg128MB2cg128MB3cg3eg4gbREV02|4GB128MB4evREV02|4eg4cg256MB5ev2gb2GB5evi_2gbREV012GBNA4gb4GB1 mm connectors4eg3eg4cg128MB4eg4eg1 mm connectors4egi_4gb4GB4ev2gb2GB4ev1 mm connectors4eg2_4gb4GB1 mm connectors5ev5ev_iNA3egli3eg4evi_4gb4GB2i_2gb2GB4eg2_4eg_2iNA5eg2gb2GBNA5ev512MB4eg3eg4gb4GB3eg_8gb8GB2cgREV042eg2gbREV042GB3cgREV043egREV044egREV041 mm connectors4egREV04128MB4eg_i4eg8gbREV038GB4eg8gbREV038GB4eg8gb8GB4eg8gb8GB4ev4ev4gb4GB1 mm connectors4evi_4evREV034ev2_4gb4GB2i_4gb4GB5eg5ev5evi_4gb4GB2gb2GB4eg2gb2GB4eg2gbREV032GB64MB4cg2gb2cg4ev4gbREV034GB1 mm connectors3cg2gbREV032GB4cg2gb2GB4ev_2gb2GB3cg4cg2eg128MB3eg4gb4GB4cg4ev3cg5ev
Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0803-01-02EG02CG-1E2cg_2gbREV012GB64MBNANANA
TE0803-01-02CG-1E1EA2cg_2gbREV012GB128MBNANANA
TE0803-01-03EG02EG-1E2eg_2gbREV012GB64MBNANANA
TE0803-01-03CG02EG-1E1EA2eg_2gbREV012GB128MBNANANA
TE0803-01-02EG03CG-1EA1E3cg_2gbREV012GB64MBNANANA
TE0803-01-02CG03CG-1EA3cg_2gbREV012GB128MBNANANA
TE0803-01-03EG-1EA1E3eg_2gbREV012GB64MBNANANA
TE0803-01-03CG03EG-1EA3eg_2gbREV012GB128MBNANANA
TE0803-0201-03EG04CG-1EB1EA4cg_2gbREV012GB128MBNANANA
TE0803-01-04CG-1EA1EB4cg_2gbREV012GB256MBNANANA
TE0803-0201-04EV04EG-1EA4eg_2gbREV012GB128MBNANANA
TE0803-01-04EV-1E34ev_2gbREV012GB128MBNA1 mm connectorsNA
TE0803-01-04EG05EV-1EA5ev_2gbREV012GB128MBNANANA
TE0803-01-04CG05EV-1EB1IA5ev_i_2gbREV012GB128MBNANANA
TE0803-0102-05EV03EG-1EA1EB3eg_4gbREV02|REV014GB128MBNANANA
TE0803-0102-05EV04EG-1IA1E34eg_4gbREV024GB128MBNA1 mm connectorsNA
TE0803-02-04EV-1E31EA4ev_2gbREV02|REV012GB128MBNANANA
TE0803-02-04EG04EV-1E34ev_4gbREV024GB128MBNA1 mm connectorsNA
TE0803-03-2AE11-A2cg_2gbREV032GB128MBNANANA
TE0803-03-2BE11-A2eg_2gbREV032GB128MBNANANA
TE0803-03-3AE11-A3cg_2gbREV032GB128MBNANANA
TE0803-03-3BE113AE11-AAK3cg_2gbREV032GB128MBNANANA
TE0803-03-4AE113AE10-AR3cg_0_2gbREV032GBNANANANAPS MIO 3.3V, not compatible to trenz carrier
TE0803-03-4BE113BE11-A3eg_2gbREV032GB128MBNANANA
TE0803-03-4BE213BE21-LA3eg_4gbREV034GB128MBNANANA
TE0803-03-4BI213BE31-A3eg_8gbREV038GB128MBNANANAdual die ddr
TE0803-03-4DE113BI21-A3eg_i_4gbREV034GB128MBNANANA
TE0803-03-4DE213RI21-LA3eg_li_4gbREV034GB128MBNANANA
TE0803-03-4GE214AE11-LA4cg_2gbREV032GB128MBNANANA
TE0803-03-5DE114BE11-A4eg_2gbREV032GB128MBNANANA
TE0803-03-5DI214BE21-AL4eg_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-3RI214BI21-A4eg_i_4gbREV034GB128MBNANANA
TE0803-03-3BI214BI21-AX4eg_i_4gbREV034GB128MBNANANAU41 replaced with diode
TE0803-03-4DI214BI61-LA4eg_8gbREV038GB128MBNA1 mm connectorsNAdual die ddrNA
TE0803-03-4GI114BI61-AX4eg_8gbREV038GB128MBNANANAdual die ddr
TE0803-03-4GE114DE11-A4ev_2gbREV032GB128MBNANANA
TE0803-03-4GI214DE21-AL4ev_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-5BE114DE21-ALZ4ev_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-5DI244DI21-AD4ev_i_4gbREV034GB128MBNA
NANA
TE0803-03-4BI214DI21-XL4ev_i_4gbREV034GB128MBNA1 mm connectorsNAU41 replaced with diode
TE0803-03-3BE214GE11-A4eg_2_2gbREV032GB128MBNANANA
TE0803-03-3BE314GE21-A*L4eg_2_4gbREV034GB128MBNA1 mm connectorsNAdual die ddr
TE0803-0403-2AE114GI11-A4eg_2i_2gbREV032GB128MBNANANA
TE0803-0403-2BE114GI21-A4eg_2i_4gbREV034GB128MBNANANA
TE0803-0403-3AE115BE11-A5eg_2gbREV032GB128MBNANANA
TE0803-0403-3BE115DE11-A5ev_2gbREV032GB128MBNANANA
TE0803-0403-4BE215DI21-LA5ev_i_4gbREV034GB128MBNANANA
TE0803-0403-4BI215DI24-A5ev_i_4gbREV034GB512MBNANANA
TE0803-03-S0034ev_2gbREV032GB128MBNANACAO: TE0803-03-4DE11-A
TE0803-03-S0054eg_2gbREV032GB128MBNANACAO: TE0803-03-4BI1?-A
TE0803-04-2AE11-A2cg_2gbREV042GB128MBNANANA
TE0803-04-2BE11-A2eg_2gbREV042GB128MBNANANA
TE0803-04-2BE11-AK2eg_2gbREV042GB128MBNANANA
TE0803-04-3AE10-R3cg_0_2gbREV042GBNANANAPS MIO 3.3V, not compatible to trenz carrier
TE0803-04-3AE11-A3cg_2gbREV042GB128MBNANANA
TE0803-04-4BI21-X-3AE11-AK3cg_2gbREV042GB128MBNANANA
TE0803-04-3BE11-A3eg_2gbREV042GB128MBNANANA
TE0803-04-3BE21-A3eg_4gbREV044GB128MBNANAU41 replaced with diodeNA
TE0803-0304-4BI613BE21-AL3eg_4gbREV044GB128MBNANAdual die ddrNA
TE0803-0304-4BI614AE11-XA4cg_2gbREV042GB128MBNANAdual die ddrNA
TE0803-04-4BI614AE11-AAK4cg_2gbREV042GB128MBNANAdual die ddrNA
TE0803-04-4BI614AE11-XAZ4cg_2gbREV042GB128MBNANAdual die ddrNA
TE0803-04-4DE114BE11-A4eg_2gbREV042GB128MBNANANA
TE0803-04-4DE214BE11-LAK4eg_2gbREV042GB128MBNANANA
TE0803-04-4DI214BE21-L4eg_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-0304-4DI214BI21-DA4eg_i_4gbREV044GB128MBNANANA
TE0803-04-4DI214BI21-DX4eg_i_4gbREV044GB128MBNANANAU41 replaced with diode
TE0803-04-4GE214BI61-LA4eg_8gbREV048GB128MBNA1 mm connectorsNAdual die ddrNA
TE0803-04-4GI214BI61-AX4eg_8gbREV048GB128MBNANANAdual die ddr
TE0803-04-5BE114DE11-A4ev_2gbREV042GB128MBNANANA
TE0803-04-5DE114DE11-AAK4ev_2gbREV042GB128MBNANANA
TE0803-04-5DI214DE11-AAZ4ev_2gbREV042GB128MBNANANA
TE0803-0304-4DE21-S003L4ev_4gbREV044GB128MBNA1 mm connectorsNACAO
TE0803-04-034DE21-S006LZ4ev_4gbREV044GB128MBNA1 mm connectorsCAONA
TE0803-04-4BE114DI21-AD4ev_i_4gbREV044GB128MBNA
NACAO
TE0803-0304-4DI21-S005L4ev_i_4gbREV044GB128MBNANA1 mm connectorsNACAO: TE0803-03-4BI1?-A
TE0803-04-4GE21-S009L4eg_2_4gbREV044GB128MBNA1 mm connectorsNA
CAO: TE0803-04-4GE214GE81-LTE0803-04-S0114eg_2_4gbREV044GB128MBNA1 mm connectorsCAO: TE0803-04-4GE25-LNA
TE0803-04-4AE114GI21-A4eg_2i_4gbREV042GB4GB128MBNANANA
TE0803-04-S0125BE11-A5eg_2gbREV042GB128MBNANACAONA
TE0803-0304-4DE215DE11-LZA5ev_2gbREV042GB128MBNANANA
TE0803-0304-3AE115DI21-AKA5ev_i_4gbREV044GB128MBNANANA
TE0803-04-4AE11-AKS0064ev_4gbREV044GB128MBNANA1 mm connectorsCAO: TE0803-04-4DE21-LNA
TE0803-04-4DE11-AZS0094eg_2_4gbREV044GB128MBNANA1 mm connectorsCAO: TE0803-04-4GE21-LNA
TE0803-04-S013S0105ev_2gbREV042GB128MBNANANACAO: TE0803-04-5DE11-A
TE0803-04-S014S0114eg_2_4gbREV044GB64MBNA1 mm connectorsCAO: TE0803-04-4GE2?4GE25-LZL
TE0803-04-S016S0122cg_2gbREV042GB128MBNANANA
TE0803-04-S017S0133cg_2gbREV042GB128MBNANANA
TE0803-04-S018S0144eg_2_4gbREV044GB64MBNA1 mm connectorsNACAO: TE0803-04-4GE2?-S020LZ
4cg_2gbREV042GB128MBNANANATE0803-04-3BE21-LS0164cg_2gbREV042GB128MBNANANA
TE0803-04-4AE11-AZS0172eg_2gbREV042GB128MBNANANA
TE0803-04-4DE21-LZS0184eg_2_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-04-3AE11-AKS0204cg_2gbREV042GB128MBNANANA
TE0803-04-S0224eg_2_4gbREV044GB128MBNA1 mm connectorsCAO: TE0803-04-4GE21-LZ
TE0803-04-S0234eg_2_4gbREV044GB128MBNA1 mm connectorsCAO: TE0803-04-4GE81-L
TE0803-04-4BE11-AK4eg_2gbREV042GB128MBNANANATE0803-04-S0265ev_i_4gbREV044GB128MBNANACAO: TE0803-04-5DI21-A
TE0803-04-2BE11-AK2eg_2gbREV042GB128MBNANANATE0803-04-S010S0273cg_2gbREV042GB128MBNANACAO:TE0803-04-5DE113AE11-A

*used as reference


Note: Design contains also Board Part Files for TE0803+TEBF0808 configuration, this board part files are not used for this reference design.

Design supports following carriers:

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Carrier Model

Notes

Custom PCB

use simple Board Part files, if MIO connected is different to TEBF0808

TEBF0808*

Used as reference carrier. Important: CPLD Firmware REV07 or newer is recommended

TEBT0808-01

Change UART0 to UART1 (MIO68...69) and regenerate design

*used as reference

Additional HW Requirements:

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Additional Hardware

Notes

---

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*used as reference

Content

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Notes :

  • content of the zip file

For general structure and usage of the reference design, see Project Delivery - AMD devices

Design Sources

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TypeLocationNotes
Vivado<project folder>\block_design
<project folder>\constraints
<project folder>\ip_lib
<project folder>\board_files
Vivado Project will be generated by TE Scripts
Vitis<project folder>\sw_libAdditional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation



Additional Sources

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Type

Location

Notes

---

---

---


Prebuilt

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  • prebuilt files
  • Template Table:

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      File

      File-Extension

      Description

      BIF-File*.bifFile with description to generate Bin-File
      BIN-File*.binFlash Configuration File with Boot-Image (Zynq-FPGAs)
      BIT-File*.bitFPGA (PL Part) Configuration File
      Boot Script-File*.scr

      Distro Boot Script file

      DebugProbes-File*.ltxDefinition File for Vivado/Vivado Labtools Debugging Interface

      Debian SD-Image

      *.img

      Debian Image for SD-Card

      Diverse Reports---Report files in different formats
      Device Tree*.dtsDevice tree (2 possible, one for u-boot and one for linux)
      Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux
      LabTools Project-File*.lprVivado Labtools Project File

      MCS-File

      *.mcs

      Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)

      MMI-File

      *.mmi

      File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)

      OS-Image*.ubImage with Linux Kernel (On Petalinux optional with Devicetree and RAM-Disk)
      Software-Application-File*.elfSoftware Application for Zynq or MicroBlaze Processor Systems

      SREC-File

      *.srec

      Converted Software Application for MicroBlaze Processor Systems





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File

File-Extension

Description

BIF-File

*.bif

File with description to generate Bin-File

BIN-File

*.bin

Flash Configuration File with Boot-Image (Zynq-FPGAs)

BIT-File

*.bit

FPGA (PL Part) Configuration File

Diverse Reports

---

Report files in different formats

Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux

LabTools Project-File

*.lpr

Vivado Labtools Project File

Software-Application-File

*.elf

Software Application for Zynq or MicroBlaze Processor Systems


Download

Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.

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Reference Design is available on:

Design Flow

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Notes :

  • Basic Design Steps

  • Add/ Remove project specific description


Note

Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.

Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.

See also:

The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.

TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality

Note

Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")


  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:

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    title_create_win_setup.cmd/_create_linux_setup.sh
    ------------------------Set design paths----------------------------
    -- Run Design with: _create_win_setup
    -- Use Design Path: <absolute project path>
    --------------------------------------------------------------------
    -------------------------TE Reference Design---------------------------
    --------------------------------------------------------------------
    -- (0)  Module selection guide, project creation...prebuilt export...
    -- (1)  Create minimum setup of CMD-Files and exit Batch
    -- (2)  Create maximum setup of CMD-Files and exit Batch
    -- (3)  (internal only) Dev
    -- (4)  (internal only) Prod
    -- (c)  Go to CMD-File Generation (Manual setup)
    -- (d)  Go to Documentation (Web Documentation)
    -- (g)  Install Board Files from Xilinx Board Store (beta)
    -- (a)  Start design with unsupported Vivado Version (beta)
    -- (x)  Exit Batch (nothing is done!)
    ----
    Select (ex.:'0' for module selection guide):


  2. Press 0 and enter to start "Module Selection Guide"

  3. Createproject and follow instructions of the product selection guide, settings file will be configured automatically during this process.
    • optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"

      Note

      Note: Select correct one, see also Vivado Board Part Flow

      Important: Use Board Part Files, which did not ends with *_tebf0808


  4. Create hardware description file (.xsa file) for PetaLinux project and export to prebuilt folder

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    titlerun on Vivado TCL (Script generates design and export files into "<project folder>\prebuilt\hardware\<short name>")
    TE::hw_build_design -export_prebuilt


    Info

    Using Vivado GUI is the same, except file export to prebuilt folder.


  5. Generate Programming Files with Vitis

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    titlerun on Vivado TCL (Script generates applications and bootable files, which are defined in "test_board\sw_lib\apps_list.csv")
    TE::sw_run_vitis -all
    TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)


    Note

    TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis


Launch

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Note:

  • Programming and Startup procedure

Programming

Note

Check Module and Carrier TRMs for proper HW configuration before you try any design.

Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.

Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging

Get prebuilt boot binaries

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
  2. Press 0 and enter to start "Module Selection Guide"
    1. Select assembly version
    2. Validate selection
    3. Select create and open delivery binary folder

      Info

      Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated


QSPI-Boot mode

  1. Connect JTAG and power on carrier with module
  2. Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"

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    titlerun on Vivado TCL (Script programs BOOT.bin on QSPI flash)
    TE::pr_program_flash -swapp hello_te0803


SD-Boot mode

This does not work, because SD controller is not selected on PS.

JTAG

Load configuration and Application with Vitis Debugger into device

Usage

QSPI Boot:

  1. Prepare HW like described on section Programming

  2. Connect UART USB (most cases same as JTAG)

  3. Select QSPI as Boot Mode

    Info

    Note: See TRM of the Carrier, which is used.


  4. Power On PCB

    Expand
    titleboot process

    1. ZynqMP Boot ROM loads FSBL from QSPI into OCM,

    2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR,


System Design - Vivado

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Note:

  • Description of Block Design, Constrains... BD Pictures from Export...

Block Design

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PS Interfaces

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  • optional for Zynq / ZynqMP only

  • add basic PS configuration

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Type

Note

DDR


QSPI

MIO

UART0

MIO, please select other one, if you have connected UART to second controller or other MIO

SWDT0..1


TTC0..3



Constrains

Basic module constrains

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set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design]
set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]

Design specific constrain

Not needed.

Software Design - Vitis

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Note:

  • optional chapter separate

  • sections for different apps

For Vitis project creation, follow instructions from:

Vitis


Application

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----------------------------------------------------------

FPGA Example

----------------------------------------------------------

scu

MCS Firmware to configure SI5338 and Reset System.

srec_spi_bootloader

TE modified 20222023.2 SREC

Bootloader to load app or second bootloader from flash into DDR

Descriptions:

  • Modified Files: blconfig.h, bootloader.c
  • Changes:
    • Add some console outputs and changed bootloader read address.
    • Add bugfix for 2018.2 qspi flash

xilisf_v5_11

TE modified 20222023.2 xilisf_v5_11

  • Changed default Flash type to 5.

----------------------------------------------------------

Zynq Example:

----------------------------------------------------------

fsbl

TE modified 20222023.2 FSBL

General:

  • Modified Files: main.c, fsbl_hooks.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_fsbl_hooks.h/.c (for hooks and board)

  • General Changes: 
    • Display FSBL Banner and Device ID

Module Specific:

  • Add Files: all TE Files start with te_*
    • READ MAC from EEPROM and make Address accessible by UBOOT (need copy defines on uboot platform-top.h)
    • CPLD access
    • Read CPLD Firmware and SoC Type
    • Configure Marvell PHY


----------------------------------------------------------

ZynqMP Example:

----------------------------------------------------------

zynqmp_fsbl

TE modified 20222023.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name

Module Specific:

  • Add Files: all TE Files start with te_*
    • Si5338 Configuration
    • ETH+OTG Reset over MIO

zynqmp_pmufw

Xilinx default PMU firmware.

----------------------------------------------------------

General Example:

----------------------------------------------------------

hello_te0820

Hello TE0820 is a Xilinx Hello World example as endless loop instead of one console output.

u-boot

U-Boot.elf is generated with PetaLinux. Vitis is used to generate Boot.bin.

Template location: "<project folder>\sw_lib\sw_apps\"

zynqmp_fsbl

TE modified 20222023.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name

hello_te0803

Hello TE0803 is a Xilinx Hello World example as endless loop instead of one console output.

Additional Software

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Note:

  • Add description for other Software, for example SI CLK Builder ...

  • SI5338 and SI5345 also Link to:

No additional software is needed.

Appx. A: Change History and Legal Notices

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Document Change History

To get content of older revision go to "Change History" of this page and select older document revision number.

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  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro (date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

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Date

Document Revision

Authors

Description

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infoTypeCurrent version
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infoTypeModified by
typeFlat

  • Release 2023.2
  • new assembly variants

2023-09-14

v.34

Manuela Strücker

  • Release 2023 2022.2
  • new assembly variants
2022-10-17v.33Manuela Strücker
  • script update
2022-09-06v.32Manuela Strücker
  • new assembly variants
2022-07-15v.30Manuela Strücker
  • Release 2021.2
2021-09-09v.25Manuela Strücker
  • Release 2020.2
2020-04-06v.24John Hartfiel
  • new assembly variants

2020-03-25

v.23

John Hartfiel

  • Script update

2020-01-23

v.22

John Hartfiel

  • Release 2019.2

2019-05-07

v.21

John Hartfiel

  • Release 2018.3

2018-10-26

v.18

John Hartfiel

  • new assembly variant

2018-08-14

v.16

John Hartfiel

  • new assembly variant

2018-07-13

v.15

John Hartfiel

  • Release 2018.2

2018-05-18

v.14

John Hartfiel

  • new assembly variant

2018-04-11

v.13

John Hartfiel

  • bugfix board part file

2018-04-03

v.11

John Hartfiel

  • new assembly variant

2018-01-18

v.6

John Hartfiel

  • Release 2017.4

2017-11-16

v.4

John Hartfiel

  • Update assembly versions with new Flash size

2017-11-14

v.3

John Hartfiel

  • Release 2017.2


All

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IN:Legal Notices




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