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Table 1: Initial state of programmable devices on delivery of the module. |
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MODE Signal State | Boot Mode |
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High or open | QSPI |
Table 2: Boot Process
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FPGA Bank | B2B Connector | I/O Signal Count | Voltage Level | Notes |
---|---|---|---|---|
13 | JM1 | 48 | VCCO_13 | |
500 | JM1 | 4 | 3.3V | |
33 | JM3 | 34 | 3.3V | |
35 | JM3 | 20 | 3.3V | |
35 | JM2 | 22 | 3.3V | |
501 | JM2 | 38 | VMIO1 | MIO1 VREF is connected to resistor divider to support HSTL18 |
Table 3: Boot Process
JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.
JTAG Signal | B2B Pin |
---|---|
TMS | JM2-12 |
TDI | JM2-10 |
TDO | JM2-8 |
TCK | JM2-6 |
Table 4: JTAG pins connection
There is no fixed mapping for PS7 UART, if needed it can be mapped to free pins from MIO1 Bank or via EMIO to PL pins.
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Chip/Interface | IC | PS7 Peripheral | |
---|---|---|---|
SPI Flash | S25FL127SABMFV10 | QSPI0 | 16 MByte Flash |
I2C EEPROM | 24LC64 | I2C0 | 8 KByte EEPROM |
RTC I2C | RV-3029 | I2C0 | |
RTC Interrupt | RV-3029 | GPIO - MIO0 | |
User LED | LED Green | GPIO - MIO7 |
Table 5: On board Peripherals
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MIO Pin | Schematic | U13 Pin | Notes |
---|---|---|---|
MIO1 | SPI_CS | A1 | |
MIO2 | SPI_DQ0/M0 | A2 | |
MIO3 | SPI_DQ1/M1 | F6 | |
MIO4 | SPI_DQ2/M2 | E4 | |
MIO5 | SPI_DQ3/M3 | A3 | |
MIO6 | SPI_SCK/M4 | A4 |
Table 6: Quad SPI interface MIOs and pins
Supply Voltage: 2.7V to 3.6V
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MIO Pin | Schematic | U7 Pin | Notes |
---|---|---|---|
MIO15 | SDA | 5 | On-board RTC, and EEPROM |
MIO14 | SCL | 4 | On-board RTC, and EEPROM |
Table 7: I2C interface MIOs and pins
The Microchip Technology Inc. 24LC64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with standby and active currents of only 1 μA and 3 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24LC64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.
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MIO Pin | Schematic | U11 Pin | Notes |
---|---|---|---|
MIO15 | SDA | 3 | On-board RTC, and EEPROM |
MIO14 | SCL | 1 | On-board RTC, and EEPROM |
Table 8: I2C EEPROM interface MIOs and pins
LEDs
Schematic | Color | Connected to | Active Level | IO Standard |
---|---|---|---|---|
D9 | Green | DONE | Low | not applicable |
D8 | RED | MIO7 | High | not applicable |
D4 | Green | PL pin V18 | High | LVCMOS33 |
Table 9: On-board LEDs.
512 Mbyte DDR3L SDRAM
The TE0728 SoM has two 512 GByte volatile DDR3 SDRAM IC for storing user application code and data.
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Schematic | ETH1 | ETH2 | Pullup | Notes |
---|---|---|---|---|
CTREF | J3-57 | J3-25 | Magnetics center tap voltage | |
TD+ | J3-58 | J3-28 | on-board | |
TD- | J3-56 | J3-26 | on-board | |
RD+ | J3-52 | J3-22 | on-board | |
RD- | J3-50 | J3-20 | on-board | |
LED1 | J3-55 | J3-23 | on-board | |
LED2 | J3-53 | J3-21 | on-board | |
LED3 | J3-51 | J3-19 | on-board | |
POWERDOWN/INT | L21 | R20 | on-chip | It is recommended to configure FPGA I/O as input with Pullup or as output driving 1 if Interrupt not used. |
RESET_N | M15 | R16 | on-chip | It is recommended to configure FPGA I/O as input with Pullup or as output (active low PHY Reset). |
Table 10: Ethernet PHY to Zynq SoC connections.
It is recommended to add IOB TRUE constraint for the MII Interface pins.
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MIO Pin | Schematic | U16 Pin | Notes |
---|---|---|---|
MIO8 | D | 1 | |
MIO9 | R | 4 |
Table 11: CAN Tranciever interface MIOs
Schematic | B2B | Pull up/down | Notes |
---|---|---|---|
CANH | J1-2 | on-board | |
CANL | J1-4 | on-board |
Table 12: CAN Tranciever pins
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IC | Description | Frequency | Used as |
---|---|---|---|
U14 | MEMS Oscillator | 50 MHz | PS PLL clock |
U5 | MEMS Oscillator | 25 MHz | Ethernet PHY Clock |
U7 | RTC (internal oscillator) | 32.768 KHz | Used by RTC, CLKOUT of RTC not connected |
Table 13: Oscillators.
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Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
Table 14: Power Consumption.
* TBD - To Be Determined
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Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
---|---|---|---|---|---|
VIN | 1,3 | - | - | Input | |
VMIO | - | 2 | - | I/O | |
3.3V | 19 | 4 | 25,57 | Output | |
1.8V | - | 5 | - | Output |
Table 14: Module power rails.
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
500 | VCCO_MIO0_500 | 3.3V | |
501 | VCCO_MIO1_500 | 3.3V | |
502 | VCCO_DDR_502 | 1.5V | |
13 HR | VCCO_13 | 3.3V | Supplied by the carrier board. JM1 |
33 HR | VCCO_33 | 3.3V | Supplied by carrier board. JM3 |
34 HR | VCCO_34 | 3.3V | |
35 HR | VCCO_35 | 3.3V | Supplied by the carrier board. JM2,JM3 |
Table 15: Zynq SoC bank voltages.
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Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
VCCPINT | PS internal logic supply voltage | -0.5 | 1.1 | V |
VCCPAUX | PS auxiliary supply voltage | -0.5 | 2.0 | V |
VCCPLL | PS PLL supply | -0.5 | 2.0 | V |
VCCO_DDR | PS DDR I/O supply voltage | -0.5 | 2.0 | V |
VPREF | PS input reference voltage | -0.5 | 2.0 | V |
VCCO_MIO0 | PS MIO I/O supply voltage for HR I/O banks | -0.5 | 3.6 | V |
VCCO_MIO1 | PS MIO I/O supply voltage for HR I/O banks | 1.71 | 3.45 | V |
Table 16: PS absolute maximum ratings.
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
VCCINT | PL internal logic supply voltage | -0.5 | 1.1 | V |
VCCPAUX | PL auxiliary supply voltage | -0.5 | 2.0 | V |
VCCPLL | PL PLL supply | -0.5 | 1.1 | V |
VPREF | PL input reference voltage | -0.5 | 2.0 | V |
VCCO | PL supply voltage for HR I/O banks | -0.5 | 3.6 | V |
VIN | I/O input voltage for HR I/O banks | 1.71 | 3.45 | V |
Table 16: PL absolute maximum ratings.
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Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. |
Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS MIO banks | -0.2 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for PS DDR | 1.14 | 1.89 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS DDR | -0.20 | VCCO_DDR + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. |
Storage Temperature | -65 | 150 | °C | See Xilinx DS187 datasheet. |
CAN Transceiver Temperature | -40 | 125 | °C | See Texas Instrument sn65hvd230q-q1 datasheet. |
SPI Flash Memory | -40 | 85 | °C | See Cypress S25FL127S datasheet. |
DDR3 SDRAM Temperature | -40 | 95 | °C | See Nanya NT5CC256M16CP-DIA datasheet. |
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Table 17: Absolute Maximum Ratings..
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Commercial grade: 0°C to +70°C.
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Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. |
Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS MIO banks | -0.2 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for PS DDR | 1.14 | 1.89 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS DDR | -0.20 | VCCO_DDR + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. |
Storage Temperature | -65 | 150 | °C | See Xilinx DS187 datasheet. |
Table 18: Recommended operating conditions.
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Schematic | Color | Connected to | Active Level | IO Standard |
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D9 | Green | DONE | Low | not applicable |
D8 | RED | MIO7 | High | not applicable |
D4 | Green | PL pin V18 | High | LVCMOS33 |
The TE0728 SoM has two 512 GByte volatile DDR3 SDRAM IC for storing user application code and data.
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