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Refer to httpshttp://wiki.trenz-electronic.de/display/PD/TEBF0808+TRMorg/tebf0808-info for the current online version of this manual and other available documentation.

The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available. 

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  • update links

v.89Martin Rohrmüller
  • Typo

v.88
John Hartfiel
  • Typo correction Table 13
  • Typo correction Table 9
2017-11-15v.86Ali Naseri
  • DIP-switches section revised and updated

2017-11-13

v.82

Ali Naseri
  • updated B2B connector max. current rating
    per pin

2017-11-13

v.80

John Hartfiel
  • rework B2B section
2017-10-19

v.79

Ali Naseri
  • added additionally MGT lanes information

2017-10-18

v.75
Ali Naseri
  • added Power Rails section

2017-08-29

v.70



John Hartfiel
  • update document change history
  • published
2017-08-28v.69Ali Naseri
  • Initial document

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