Skip to end of metadata
Go to start of metadata

Table of Contents


The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available. 

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA Audio
    • Intel 9-pin Power-/Reset-Button, Power-/HD-LED
  • On-board Power- / Reset-Switches
  • 2x Configuration 4-bit DIP-switches
  • 2x Optional 4-wire PWM fan connectors
  • PCIe Slot - one PCIe lane (16 lane connector)
  • CAN FD Transceiver (10 Pin IDC connector and 6-pin header)
  • 4x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x  Microchip 24AA025E48T-I/OT)
  • Dual SFP+ Connector (2x1 Cage)
  • 1x DisplayPort (single lane)
  • 1x SATA Connector
  • 2x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0))
  • 1x USB3.0 on-board connector with two ports
  • FMC HPC Slot (FMC_VADJ max. VCCIO)
  • FMC Fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator SI5338A
  • 2x SMA coaxial connectors for clock signals
  • MicroSD- / MMC-Card Socket (bootable)
  • 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit)
  • 2x System Controller CPLDs Lattice MachXO2 1200 HC
  • 1x Samtec FireFly (4 GT lanes bidirectional)
  • 1x Samtec FireFly connector for reverse loopback
  • 2x JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLDs
  • 20-pin ARM JTAG Connector (PS JTAG0)
  • 3x PMOD connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TEBF0808-04 Block Diagram

Block Diagram description of depicted on-board peripherals

On-board PeripheralB2BMPSoC Unit /
SoM peripheral
DescriptionTRM Section
FMC HPC J5, 24 LVDS pairs (48 I/O's)J1PL Bank (FMC_VADJ)

PL I/O-bank pins, differential pairs

FMC HPC Connector
FMC HPC J5, GTH InterfaceJ1MGT Bank10 MGT LanesFMC HPC Connector
SFP+ 2x1 Cage J14J1MGT Bank2 MGT Lanes to dual SFP+ ConnectorMGT Interfaces SFP+ and FireFly
SMA Coax J33J1On-module PLLSMA Coaxial Connector to on-module
PLL Clock Input pin
Programmable PLL Clock Generator
  • 10 LVDS pairs (20 I/O's)
  • 1 LVDS Clock to PL Bank
  • 2 MGT Clocks to MGT Banks


MGT Bank

PL I/O-bank pins, differential pairs

1 clock capable PL bank pin-pair

2 MGT clock input pin-pairs

FMC HPC Connector 
Programmable PLL Clock Generator

24-bit Audio Codec U3J3PL Bank (1.8 V)PL I/O-bank pins to on-board
24-bit Audio Codec
Intel-PC Compatible Headers and FAN Connectors
24-bit Audio Codec
10 I/O's to SC CPLD U17J3PL Bank (1.8 V)

PL I/O-bank pins to on-board
System Controller CPLD U17

System Controller CPLDs
8 I/O's to SC CPLD U39J3PL Bank (1.8 V)

PL I/O-bank pins to on-board
System Controller CPLD U39

System Controller CPLDs
SDIO Interface, SD- / MMC-Card MuxJ3PS MIOSDIO interface connected to
SD- / MMC-Card socket
MIO Bank Interfaces
SDIO Port Expander
Board Peripheral's I²C Interfaces
muxed to MPSoC I²C
J3PS MIOMPSoC I²C interface configured as
master connected to on-board slaves
MIO Bank Interfaces 
8-Channel I²C Switches
4 MIO to SC CPLD U17J3PS MIOFunctionality depending on MPSoC and
CPLD firmware
System Controller CPLDs

Functionality depending on MPSoC and
CPLD firmware

System Controller CPDLs
Ethernet PHY RGMIIJ3PS MIOEthernet PHY U12 connected per RGMII

MIO Bank Interfaces
Gigabit Ethernet PHY

eMMC FlashJ3PS MIOeMMC Flash memory interface on PS bankMIO Bank Interfaces 
eMMC Memory
USB2.0 PHY ULPIJ2PS MIOUSB2.0 PHY U9 connected per ULPIMIO Bank Interfaces
High-speed USB ULPI PHY
SAMTEC FireFly Connector J6/J15J2MGT BankMGT Lanes to Samtec FireFly connectorMGT Interfaces SFP+ and FireFly
JTAG Interface via XMOD Header J12J2PS ConfigMPSoC USB programmable JTAG interface

MIO Bank Interfaces
JTAG Interface


MIO Bank Interfaces
PS GT Bank Interfaces

4-port USB3.0 Hub--USB3.0 (2.0 compatible) Hub with 4 portsMIO Bank Interfaces
4-port USB3.0 Hub
USB3.0 / RJ45 GbE Connector J7,
USB3.0 Connector J8
--2-port USB3.0 / RJ45 GbE Connector (stacked)MIO Bank Interfaces
25 SoM Control Signals to
SC CPLDs U17 / U39
J2On-module DC-DC
converter, PLL clock
Control Signals, e.g.  "Enable"- / "Power Good"-
signals of DC-DC-converter and further on-module

Power-On Sequence Diagram
Programmable PLL Clock Generator

150 MHz Osci Clock InputJ2-150 MHz SATA interface MGT clockOscillators

Signals DONE, INIT_B, SRST_B, ...
to SC CPLD U39

J2PS ConfigMPSoC control signal for PS- / PL configurationSystem Controller CPLDs

SATA Connector J31
PCIe Connector J1
DisplayPort J13

J2PSGTConnectors of the MGT based data interfacesPS GT Bank Interfaces

PLL Clock Output to

  • PCIe Interface
  • On-board PLL U35
  • MGT Bank (B2B J3)
J2On-module PLL
clock generator

Reference clock signals of the on-module
programmable PLL clock generator

Programmable PLL Clock Generator
4 I/O's to PMOD P2 via IC U33J4PL Bank (FMC_VADJ)PL user I/O's accessible on PMOD connector P2CAN FD Interface and PMOD Connectors
3 I/O's to SC CPLD U17 via IC U32J4PL Bank (FMC_VADJ)PL user I/O's routed to System Controller
System Controller CPLDs
  • 46 LVDS pairs (92 I/O's)
  • 1 LVDS Clock to PL Bank

PL I/O-bank pins, differential pairs

1 clock capable PL bank pin-pair

FMC HPC Connector
Programmable PLL Clock Generator

Table 1: Description of depicted on-board peripherals

Main Components

Figure 2: TEBF0808-04 Carrier Board

  1. PMOD connector, P2
  2. MicroSD Card socket (on bottom side), J16
  3. DisplayPort connector, J13
  4. USB3.0 A 2x , RJ45 1x (stacked), J7
  5. SFP+ 2x1 cage, J14
  6. PCIe x16 connector (one PCIe lane connected), J11
  7. FMC HPC connector, J5
  8. FMC-Fan connector 5V, J19
  9. USB3.0 connector, J8
  10. PC-BEEPER 4-pin header, J23
  11. SMA coaxial connector (SI5338A clock output), J32
  12. SMA coaxial connector (clock input to MPSoC module), J33
  13. MMC Card socket, J27
  14. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J4
  15. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J1
  16. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J3
  17. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J2
  18. CAN bus 6-pin header, J29
  19. CAN bus 10-pin connector, J24
  20. ARM JTAG  20-pin connector, J30
  21. ATX-24 power supply connector, J20
  22. 4-Wire PWM fan connector, J35
  23. JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for access to MPSoC module, J12
  24. JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for access to System Controller CPLDs, J28
  25. Power Jack 2.1mm 12V, J25
  26. 4-bit DIP-switch, S5
  27. Power Button, S1
  28. Samtec FireFly connector  for reverse loopback, J21/J22
  29. Samtec FireFly connector (4 GT lanes bidirectional), J6/J15
  30. SATA header, J31
  31. 4-Wire PWM fan connector, J26
  32. I²C interface of programmable on-module PLL (10-pin header), J17
  33. Reset Button, S2
  34. INTEL HDA 9-pin header, J9
  35. Intel front panel (PWR-/RST-Button, HD-/PWR-LED) 9-pin header, J10
  36. Samtec FireFly connector J6/J15 I²C interface (3-pin header), J34
  37. 4-bit DIP-switch, S4
  38. PMOD connector, P3
  39. PMOD connector, P1
  40. Battery Holder CR1220, B1

Initial Delivery State

Storage device name



User configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT)

Not programmed

USB3.0 HUB Configuration EEPROM (Microchip 24LC128-I/ST)Not programmed-
Si5338A programmable PLL NVM OTPNot programmed-

Table 2: Initial Delivery State of the flash memories

Signals, Interfaces and Pins

FMC HPC Connector

The FMC (FPGA Mezzanine Card) connector J5 with high pin count (HPC) provides as an ANSI/VITA 57.1 standard a modular interface to the MPSoCs FPGA and exposes numerous of its I/O pins for use by other mezzanine modules and expansion cards.

The connector supports single ended (VCCIO: FMC_VADJ) and differential signaling as the I/O's are routed from the FPGA banks as LVDS-pairs to the FMC connector.

Figure 3: FMC HPC Connector

I/O Signal CountLVDS-pairs countVCCO bank VoltageReference Clock Input from FMC ConnectorNotes


bank's VREF-pin connected to FMC connector
pin J5-H1 (VREF_A_M2C)

1 LVDS clock from FMC connector J5 (pins J5-G2, J5-G3)
to clock capable PL bank pin-pair



1 LVDS clock from FMC connectorJ5 (pins J5-H4, J5-H5)
to clock capable PL bank pin-pair

bank's VREF-pin connected to FMC connector
pin J5-H1 (VREF_A_M2C)

Table 3: FMC connector pin-outs of available logic banks of the MPSoC

The MGT-banks have also clock input-pins which are exposed to the FMC connector. Following MGT-lanes are available on the FMC connectors J5:

Schematic Names of the MGT SignalsB2B Connector PinsFMC Connector Pins

B228_RX3_P, B228_RX3_N
B228_TX3_P, B228_TX3_N

B228_RX2_P, B228_RX2_N
B228_TX2_P, B228_TX2_N

B228_RX1_P, B228_RX1_N
B228_TX1_P, B228_TX1_N

B228_RX0_P, B228_RX0_N
B228_TX0_P, B228_TX0_N

pins J1-51, J1-53
pins J1-50, J1-52

pins J1-57, J1-59
pins J1-56, J1-58

pins J1-63, J1-65
pins J1-62, J1-64

pins J1-69, J1-71
pins J1-68, J1-70

pins J5-A10, J5-A11
pins J5-A30, J5-A31

pins J5-A6, J5-A7
pins J5-A26, J5-A27

pins J5-A2, J5-A3
pins J5-A22, J5-A23

pins J5-C6, J5-C7
pins J5-C2, J5-C3

B229_RX3_P, B229_RX3_N
B229_TX3_P, B229_TX3_N

B229_RX2_P, B229_RX2_N
B229_TX2_P, B229_TX2_N

B229_RX1_P, B229_RX1_N
B229_TX1_P, B229_TX1_N

B229_RX0_P, B229_RX0_N
B229_TX0_P, B229_TX0_N

pins J1-27, J1-29
pins J1-26, J1-28

pins J1-33, J1-35
pins J1-32, J1-34

pins J1-39, J1-41
pins J1-38, J1-40

pins J1-45, J1-47
pins J1-44, J1-46

pins J5-B12, J5-B13
pins J5-B32, J5-B33

pins J5-B16, J5-B17
pins J5-B36, J5-B37

pins J5-A18, J5-A19
pins J5-A38, J5-A39

pins J5-A14, J5-A15
pins J5-A34, J5-A35

B230_RX1_P, B230_RX1_N
B230_TX1_P, B230_TX1_N

B230_RX0_P, B230_RX0_N
B230_TX0_P, B230_TX0_N

pins J1-15, J1-17
pins J1-14, J1-16

pins J1-21, J1-23
pins J1-20, J1-22

pins J5-B4, J5-B5
pins J5-B24, J5-B25

pins J5-B8, J5-B9
pins J5-B28, J5-B29

Table 4: FMC connector pin-outs of available MGT lanes of the MPSoC

The FMC connector provides pins for reference clock output to the Mezzanine module and clock input to PL banks of the MPSoC:

Clock Signal Schematic Name
FMC Connector PinsDirectionClock SourceNotes
B228_CLK0J5-D4 / J5-D5inFMC Connector J5Extern MGT clock
B229_CLK0J5-B20 / J5-B21inFMC Connector J5Extern MGT clock
FMCCLK2J5-K4 / J5-K5outCarrier Board PLL SI5338A U35, CLK2Clock signal to Mezzanine module
FMCCLK3J5-J2 / J5-J3outCarrier Board PLL SI5338A U35, CLK3Clock signal to Mezzanine module
B64_L14_P / B64_L14_NJ5-H4 / J5-H5inFMC Connector J5Extern LVDS clock to PL bank
B48_L6_P / B48_L6_NJ5-G2 / J5-G3inFMC Connector J5Extern LVDS clock to PL bank

Table 5: FMC connector pin-outs for reference clock output

The FMC connector provides further interfaces like JTAG and I²C interfaces:

Interfaces I/O Signal CountPin schematic Names / FMC PinsConnected toNotes

FMC_TCK, pin J5-D29

FMC_TMS, pin J5-D33

FMC_TDI, pin J5-D30

FMC_TDO, pin J5- D31

SC CPLD U17, bank 1


TRST_L, pin J5-D34 pulled-up to 3V3_PER


FMC_SCL, pin J5-C30

FMC_SDA, pin J5-C31

I²C Switch U16

I²C-lines pulled-up to 3V3_PER

Control Lines4FMC_PRSNT_M2C, pin J5-H2I²C I/O Expander U38

'PG' = 'Power Good'-signal

'C2M' = carrier to (Mezzanine) module

'M2C' = (Mezzanine) module to carrier

FMC_PG_C2M, pin J5-D1 (3V3_PER pull-up)SC CPLD U39, bank 0
FMC_PG_M2C, pin J5-F1 (3V3_PER pull-up)I²C I/O Expander U38
FMC_CLK_DIR, pin J5-B1 (pulled-down to GND)SC CPLD U17, bank 1

Table 6: FMC connector pin-outs of available interfaces to the System Controller CPLD

Several VCCIO voltages are available on the FMC connector to operate the I/O's on different voltage levels:

VCCIO Schematic NameFMC Connector J5 PinsNotes
12VC35/C37extern 12V power supply
3V3_PERD32/D36/D38/D40/C393.3V peripheral supply voltage
FMC_VADJH40/G39/F40/E39adjustable FMC VCCIO voltage, supplied by DC-DC converter U8

Table 7:  Available VCCIO voltages on FMC connector

MIO Bank Interfaces

The TEBF0808 carrier board provides several interfaces, which are configured on the MIO banks 500 .. 503 of the Zynq Ultrascale+ MPSoC.

Following table contains the assignment of the MIO pins to the configured interfaces:

MIOConfigured asSystem Controller CPLDNotes
0..12Dual QSPI-Dual Flash Memory on TE0808 / TE0803 SoM; Bootable
13..23SD0: eMMC-eMMC Memory U2; Bootable
24, 25-CPLD (U39) MUXED-
26..29-CPLD (U17 MUXEDBootable JTAG (PJTAG0)
30force reboot after FSBL-PLL config for PCIeCPLD (U39) MUXED-
31PCIe resetCPLD (U39) MUXED-
32-CPLD (U39) MUXED-
33-CPLD (U39) MUXED-
34..37-CPLD (U39) MUXED-
38, 39I2C0--
40forwarded to PWRLED_P / LED_PCPLD (U39) MUXED-
42, 43UART0CPLD (U39) MUXED-
45..51SD1: SD-Bootable MikroSD / MMC Card
64..75GEM3-Ethernet RGMII
76, 77MDC / MDIO -Ethernet RGMII

Table 8:  MIO Assignment

Following interfaces are provided by the MIO bank of the Zynq Ultrascale+ MPSoC:

  • 4x USB3.0 Superspeed ports (downward compatible to USB2.0 Highspeed)
  • SDIO port with muxed MikroSD and MMC Card socket
  • Gigabit Ethernet interface connected per RGMII
  • eMMC interface
  • Master I²C interface to on-board peripherals

The block-diagram below visualizes the interfaces of the MIO bank at the Zynq Ultrascale+ MPSoC and their associated on-board peripherals.

Figure 4: TEBF0808 MIO Interfaces

PS GT Bank Interfaces

The PS GT Bank 505 provides beside the USB3.0 Lane also following interfaces:

  • SATA (PS GT bank, MGT2 Lane)
  • DisplayPort (PS GT bank, MGT3 Lane, only TX-pair routed)
  • PCI Express (PS GT bank, MGT0 Lane)

FunctionMGT LaneSchematic Names / B2B pinsRequired Ref ClockClock SourceComment

PCI_TX_N, pin J2-67
PCI_TX_P, pin J2-69

PCI_RX_N, pin J2-70
PCI_RX_P, pin J2-72

100 MHzclock signal of SoM's prog. PLL

single lane PCIe connector

clock signal routed on carrier board to PCIe connector J1


USB3_TXUP_N, pin J2-61
USB3_TXUP_P, pin J2-63

USB3_RXUP_N, pin J2-64
USB3_RXUP_P, pin J2-66

100 MHzclock signal of SoM's prog. PLL

clock signal routed on-module,
Optional (not equipped) 100 MHz osci. U6 is possible (Configurable on Zynq PS).


SATA_TX_N, pin J2-55
SATA_TX_P, pin J2-57

SATA_RX_N, pin J2-58
SATA_RX_P, pin J2-60

150 MHzOn-board oscillator U23

optional: clock signal of SoM's prog. PLL

DP.0PS 3

DP0_TX_N, pin J2-49
DP0_TX_P, pin J2-51

27 MHzclock signal of SoM's prog. PLL

DisplayPort GT SERDES clock signal,
routed on-module to MGT bank

Table 9:  PS GT Lane Assignment

Following block diagram shows the wiring of the MGT Lanes of the PS GT bank 505 to the particular high speed data interfaces:

Figure 5: TEBF0808 PS GT Bank 505 Interface

Follwowing table contains a brief description of the control and status signals of PCIe interface:

Signal Schematic NameFPGA DirectionDescriptionLogic
WAKEInputLink reactivationLow active
PERSTInputPCI Express reset inputLow active
PRSNT1InputReference pin for PCIe card lane size-
PRSNT2InputPCI Express ×1 cardsconnect to PRSNT1
PRSNT3InputPCI Express ×4 cardsconnect to PRSNT1
PRSNT4InputPCI Express ×8 cardsconnect to PRSNT1
PRSNT5InputPCI Express ×16 cardsconnect to PRSNT1
PCIE_I²CBiDir2-wire PCIE System Management Bus-

Table 10: Description of MGT Connectors Control and Status Signals

MGT Interfaces SFP+ and FireFly

The TEBF0808 carrier board provides the high speed MGT interface connectors "SFP+" (Enhanced small form-factor pluggable) and Samtec "FireFly". This connectors are capable of data transmission rates up to 10 Gbit/s with SFP+ and 28 Gbit/s with FireFly.

FunctionMGT LaneSchematic Names / B2B pinsRequired Ref ClockClock SourceComment
FireFlyMGT Lanes 0..3

B128_RX3_N, B128_RX3_P, pins J2-28, J2-30
B128_TX3_N, B128_TX3_P, pins J2-25, J2-27

B128_RX2_N, B128_RX2_P, pins J2-34, J2-36
B128_TX2_N, B128_TX2_P, pins J2-31, J2-33

B128_RX1_N, B128_RX1_P, pins J2-40, J2-42
B128_TX1_N, B128_TX1_P, pins J2-37, J2-39

B128_RX0_N, B128_RX0_P, pins J2-46, J2-48
B128_TX0_N, B128_TX0_P, pins J2-43, J2-45

-clock signal of SoM's prog. PLLclock signal on-module routed to MGT bank

B230_RX2_P, pin J1-9
B230_RX2_N, pin J1-11

B230_TX2_P, pin J1-8
B230_TX2_N, pin J1-10

125 / 156.25 MHzclock signal of SoM's prog. PLLclock signal routed on carrier board to MGT bank

B230_RX3_P, pin J1-3
B230_RX3_N, pin J1-5

B230_TX3_P, pin J1-2
B230_TX3_N, pin J1-4

125 / 156.25 MHzclock signal of SoM's prog. PLLclock signal routed on carrier board to MGT bank

Table 11:  MGT Lane Assignment

Following block diagram show the wiring of the MGT lanes to the particular interface connectors:

Figure 6: TEBF0808 MGT Interfaces

As shown on the block diagram, the FireFly connector pair J21, J22 provides four reversed looped back MGT lanes. To test any of the on-board MGT lanes or of an extern device, 4 RX/TX differential pairs are bridged on the connector, hence the transmitted data on these MGT lanes flows back to their sources in a loop-back circuit without intentional processing or modification.

Follwowing table contains a brief description of the control and status signals of the MGT lanes incorporating SFP+ and Samtec FireFly connectors:

Signal Schematic NameConnector TypeFPGA DirectionDescriptionLogic
SFPx_TX_DISABLESFP+OutputSFP Enabled / DisabledLow active
SFPx_LOSSFP+InputLoss of receiver signalHigh active
SFPx_RS0SFP+OutputFull RX bandwidthLow active
SFPx_RS1SFP+OutputReduced RX bandwidthLow active
SFPx_M-DEF0SFP+InputModule present / not presentLow active
SFPx_TX_FAULTSFP+InputFault / Normal OperationHigh active
SFPx_I²CSFP+BiDir2-wire Serial Interface-
FFx_MPRSFireFlyOutputdepending on connected module-
FFx_MSELFireFlyOutputdepending on connected module-
FFx_INTLFireFlyInputModule interrupt line-
FFx_RSTLFireFlyOutputModule reset line-
FFx_I²CFireFlyBiDir2-wire Serial Interface-

Table 12: Description of MGT Connectors Control and Status Signals

CAN FD Interface and PMOD Connectors

On the carrier board there is a CAN FD (CAN with Flexible Data-Rate) interface available which is accessible on the CAN headers J24 (10-pin IDC connector) or J29 (6-pin header), which are connected to the CAN FD transceiver U30.

Additionally the carrier board provides PMOD connectors with GPIO and I²C interface:

PMODInterfaceConnected toNotes
P1I²C8-channel I²C Switch U27Accessible on MPSoC's I²C interface through I²C switch U27
P2GPIOHP Bank of MPSoC (4 I/O's, B65_T0 ... B65_T3),
System Controller CPLD U17 (4 I/O's, EX_IO1 ... EX_IO4)
Voltage translation via IC U33 with direction control,
only singled-ended signaling possible
P3I²C8-channel I²C Switch U27Accessible on MPSoC's I²C interface through I²C switch U27

Table 13:  PMOD Pin Assignment

Figure 7: TEBF0808 CAN Interfaces, PMOD

Intel-PC Compatible Headers and FAN Connectors

The TEBF0808 carrier board provides with its Mini-ITX form factor the possibility to encase the boa rd in a PC Enclosure. For this purpose, the board is equipped with several Intel-PC compatible headers to connect them to the PC Enclosure.

Headers are available for following PC front panel elements

  • Reset Button
  • Power Button
  • Power LED
  • Hard Disc (HD) LED
  • Intel High Definition Audio (HDA) Jacks

Following table gives an overview about the particular headers and a description about their functionalities:

HeaderPin NameFunctionalityConnected toNotes

Pin 1, HD LED+
Pin 3, HD LED-
Pin 2, PWRLED+
Pin 4, PWRLED-
Pin 5, GND
Pin 7, RSTSW
Pin 6, PWRSW
Pin 8, GND
Pin 9, +5V DC

HD LED Anode
HD LED Cathode
Power LED Anode
Power LED Cathode
Reset Switch
Power Switch
5V DC Supply

SC CPLD U39Reset and Power switch-pins are also
connected to switch buttons S1 and S2

Pin 1, PORT1L
Pin 3, PORT1R
Pin 9, PORT2L
Pin 5, PORT2R
Pin 2, GND

Microphone Jack Left
Microphone Jack Right
Audio Out Jack Left
Audio Out Jack Right
Jack Detect / Mic in
24-bit Audio Codec U3-
J23Pin 1, 3V3SB
Pin 4, S1
3.3V DC Supply
PC compatible Beeper

Pin 1, GND
Pin 2, 12V
Pin 3, F1SENSE
Pin 4, F1PWM

12V DC Supply
SC CPLD U394-wire PWM FAN connector

Pin 1, GND
Pin 2, 12V
Pin 3, F2SENSE
Pin 4, F2PWM

12V DC Supply

4-wire PWM FAN connector

optional load switch U48 to turn off/on FAN
with pin F2_EN


Pin 1, GND
Pin 2, 5V

5V DC Supply
Load Switch Q3 (5V DC)2-wire FAN connector

Fan off/on switchable by signal 'FAN_FMC_EN'
on SC CPLD U39

Table 14: PC compatible Headers

Figure 8: TEBF0808 PC Compatible Headers

JTAG Interface

The TEBF0808 carrier board provides several JTAG interfaces to program both the System Controller CPLDs and the Zynq Ultrascale+ MPSoC.

Therefore, the board is equipped with two JTAG/UART headers, which have 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM and the System Controller CPLDs can be programmed via USB interface.

The System Controller CPLDs will be programmed by the XMOD-Header J28 in a cascaded JTAG chain as visualized in Figure 9. To program the System Controller CPLDs, the JTAG interface of these devices have to be activated by DIP-switch S4-3.
The 4 GPIO/UART pins (XMOD1_A/B/E/G) of the XMOD-Header J28 are routed to the System Controller CPLD U17.

XMOD-Header J12 is designated to program the Zynq Ultrascale+ MPSoC via USB interface, the 4 GPIO/UART pins (XMOD2_A/B/E/G) of this header are routed to the System Controller CPLD U39.

Figure 9: TEBF0808 JTAG interfaces

Further JTAG interfaces of the TEBF0808 carrier board are the ARM JTAG 20-pin IDC connector J30 and on the FMC Connector J5. This JTAG interfaces are connected to the System Controller CPLD U17, hence the logical processing and forwarding of the JTAG signals depend on the SC CPLD firmware. The documentation of the firmware of the SC CPLD U17 contains detailed information on this matter.

On-board Peripherals

System Controller CPLDs

The TEBF0808 is equipped with two System Controller CPLDs - Lattice Semiconductor LCMXO2-1200HC (MachXO2 Product Family) - with the schematic designators U17 and U39.

The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic of the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

Both System Controller CPLDs are connected to the Zynq Ultrascale+ MPSoC through MIO, PL IO-bank pins and I²C interface. The CPLDs are connected with each other through the IO pins SC_IO0 ... SC_IO8.

The functionalities and configuration of the pins depend on the CPLDs' firmware. The documentations of the firmware of SC CPLD U17 and SC CPLD U39 contains detailed information on this matter.

Following block diagram visualizes the connection of the SC CPLDs with the Zynq Ultrascale+ MPSoC via PS (MIO), PL bank pins and I²C interface.

Figure 10: TEBF0808 System Controller CPLDs

Programmable PLL Clock Generator

The TEBF0808 carrier board is equipped with a Silicon Labs I2C programmable quad PLL clock generator Si5338A (U35). It's output frequencies can be programmed by using the I2C bus with address 0x70.

A 25 MHz (U7) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Once running, the frequency and other parameters can be changed by programming the device using the I2C-bus connected through I²C switch U16 between the Zynq module (master) and reference clock signal generator (slave).

Si5338A (U35) InputSignal Schematic NameNote



Clock signal of SoM's prog. PLL


reference clock signal from oscillator SiTime SiT8008BI (U7)

25.000000 MHz fixed frequency.


pin put to GNDLSB (pin 'IN4') of the default I²C-adress 0x70 not activated.


pins not connected / put to GND

not used, differential feedback input
Si5338A (U35) Output
Signal Schematic NameNote



Clock signal to SC CPLD U17 (single-ended signaling)



Clock signal to SC CPLD U17 (single-ended signaling)

negative complementary signal 'SC_CLK1_N' put out to SMA Coax J33



Clock signal routed to FMC connector J5, pins J5-K4 / J5-K5



Clock signal routed to FMC connector J5, pins J5-J2 / J5-J3

Table 15: Pin description of PLL clock generator Si5338A

Figure 11: Clocking Configuration of TEBF0808 Carrier Board

Si5338 OTP ROM is not programmed by default at delivery, so it is customers responsibility to either configure Si5338 during FSBL or then use SiLabs programmer and burn the OTP ROM with customer fixed clock setup.

Si5338 OTP can only be programmed two times, as different user configurations may required different setup, TEBF0808 is normally shipped with blank OTP.
For more information Si5338 at SiLabs.

Refer to the TE0808 / TE0803 TRM for the configuration and for the internal routing of the on-module multi-channel PLL clock generator signals to the clock input pins of the MGT banks.


The TEBF0808 carrier board is equipped several on-board oscillators to provide the Zynq Ultrascale+ MPSoC's PS and PL banks and the on-board peripherals with reference clock-signals:

Clock SourceSchematic NameFrequencyClock Input Destination
SiTime SiT8008BI oscillator, U10USB0_RCLK52.000000 MHzUSB 2.0 transceiver PHY U9, pin 26
SiTime SiT8008BI oscillator, U13ETH_CLK25.000000 MHzGigabit Ethernet PHY U12, pin 34
SiTime SiT8008BI oscillator, U7-25.000000 MHzQuad PLL clock generator U35, pin 3
DSC1123 oscillator, U23B505_CLK1150.0000 MHzPS GT Bank, dedicated for SATA interface

DSC1123 oscillator, U6

optional, not equipped

B505_CLK0100.0000 MHzPS GT Bank, dedicated for USB interface

Silicon Labs 570FBB000290DG, U45

optional, not equipped

B47_L5 (LVDS)250.MHzPL Bank clock capable input pins
SiTime SiT8008BI oscillator, U25CLK_CPLD24.576000 MHzSystem Controller CPLD U35, pin 128

Table 16: Reference clock signal oscillators

High-speed USB ULPI PHY

USB PHY (U9) is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq Ultrascale+ PS USB0. I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U10).

PHY PinConnected toNotes
ULPIPS bank MIO52 ... MIO63Zynq Ultrascale+ USB0 MIO pins are connected to the PHY
REFCLK-52MHz from on board oscillator (U9)
REFSEL[0..2]-All pins set to GND selects the external reference clock frequency (52.000000 MHz)
RESETBSC CPLD U17Low active USB PHY Reset (pulled-up to PS_1.8V).
DP, DM4-port USB3.0 Hub U4USB2.0 data lane
CPEN-External USB power switch active-high enable signal
VBUS5VConnected to USB VBUS via a series of resistors, see schematic
ID-For an A-device connect to the ground. For a B-device, leave floating

Table 17: USB PHY interface connections

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U12) is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY RGMII interface is connected to the Zynq Ultrascale+ Ethernet0 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U13). The 125MHz PHY output clock (PHY_CLK125M) is routed to System Controller CPLD U17, pin 70.

PHY PinConnected toNotes
PHY LED0..1SC CPLD U17, pin 67,86see schematic for details, forwarded to RJ45 GbE MagJack J7
PHY_LED2 / INTn:SC CPLD U17, pin 85Active low interrupt line
PHY_CLK125MSC CPLD U17, pin 70125 MHz Ethernet PHY clock out
CONFIGSC CPLD U17, pin 65Configuration of PHY address LSB and VDDO level
RESETnSC CPLD U17, pin 62Active low reset line
RGMIIPS bank MIO64 ... MIO75Reduced Gigabit Media Independent Interface
SGMII-Serial Gigabit Media Independent Interface
MDIRJ45 GbE MagJack J7Media Dependent Interface

Table 18: Ethernet PHY interface connections

8-Channel I²C Switches

All on-board and on-module peripherals with accessible I²C interface are muxed to the I²C interface of the Zynq Ultrascale+ MPSoC as master.

For this purpose, the TEBF0808 carrier board is equipped with two 8-channel I²C switches provided by TCA9548A from Texas Instruments, together creating up to 16 switched I²C channels.

Refer to the data sheet of the TCA9548A chip how to address and and transmit data to the I²C slave devices through this switches.

The I2C bus works internally on-module with reference voltage 1.8V, it is connected to the MPSoC I2C interface via PS MIO bank (pins MIO38, MIO39) configured as master.

MIOSignal Schematic NameNotes
38I2C_SCL1.8V reference voltage
39I2C_SDA1.8V reference voltage

Table 19: MIO-pin assignment of the module's I2C interface

I2C addresses for on-board slave devices are listed in the table below:

I²C Slave Devices connected to MPSoC I²C InterfaceI²C
I²C Slave AddressSchematic Names of I²C Bus Lines
8-channel I²C switch U16-0x73I2C_SDA / I2C_SCL
8-channel I²C switch U27-0x77I2C_SDA / I2C_SCL
SC CPLD U39, bank 2, pins 52 (SDA), 50 (SCL)-User programmableI2C_SDA / I2C_SCL
I²C Slave Devices connected to 8-channel I²C Switch U16I²C
I²C Slave AddressSchematic Names of I²C Bus Lines
On-board Quad programmable PLL clock generator U35 Si533800x70MCLK_SDA / MCLK_SCL
8-bit I²C IO Expander U4410x26SFP_SDA / SFP_SCL
PCIe Connector J12module dependentPCIE_SDA / PCIE_SCL
SFP+ Connector J14A3module dependentSFP1_SDA / SFP1_SCL
SFP+ Connector J14B4module dependentSFP2_SDA / SFP2_SCL
Configuration EEPROM U4250x54MEM_SDA / MEM_SCL
Configuration EEPROM U3650x52MEM_SDA / MEM_SCL
Configuration EEPROM U4150x51MEM_SDA / MEM_SCL
Configuration EEPROM U2250x50MEM_SDA / MEM_SCL
8-bit I²C IO Expander U3850x27MEM_SDA / MEM_SCL
FMC Connector J56module dependentFMC_SDA / FMC_SCL
USB3.0 Hub configuration EEPROM U570x51USBH_SDA / USBH_SCL
I²C Slave Devices connected to 8-channel I²C Switch U27I²C
I²C Slave AddressSchematic Names of I²C Bus Lines
PMOD Connector P10module dependentPMOD_SDA / PMOD_SCL
24-bit Audio Codec U310x38A_I2C_SDA / A_I2C_SCL
FireFly Connector J152module dependentFFA_SDA / FFA_SCL
FireFly Connector J223module dependentFFB_SDA / FFB_SCL
On-module Quad programmable PLL clock generator Si5345 (TE0808)40x69PLL_SDA / PLL_SCL
SC CPLD U17, bank 3, pins 13 (SDA), 14 (SCL)5User programmableSC_SDA / SC_SCL
8-bit I²C IO Expander U3460x24FF_E_SDA / FF_E_SCL
PMOD Connector P37module dependentEXT_SDA / EXT_SCL

Table 20:  On-board peripherals' I2C-interfaces device slave addresses

Configuration EEPROMs

The TEBF0808 carrier board contains several EEPROMs for configuration and general user purposes. The EEPROMs are provided by Microchip and all have I²C interfaces:

EEPROM ModellSchematic DesignatorMemory DensityPurpose
24LC128-I/STU30128 Kbituser
24AA025E48T-I/OTU362 Kbituser
24AA025E48T-I/OTU412 Kbituser
24AA025E48T-I/OTU422 Kbituser
24LC128-I/STU5128 KbitUSB3.0 Hub U4 configuration memory

Table 21:  On-board configuration EEPROMs overview

4-port USB3.0 Hub

On the carrier board there are up to 4 USB3.0 Super Speed ports available, which are also downward compatible to USB2.0 High Speed ports. The USB3.0 ports are provided by Cypress Semiconductor CYUSB3324 4-port USB3.0 Hub controller U4. The pin-strap configuration option of the USB3.0 Hub is disabled, so this controller gets the configuration data and parameter from the configuration EEPROM U5. The I²C interface of the EEPROM and the controller is also accessible by the Zynq Ultrascale+ MPSoC through I²C switch U16.

On the Upstream-side, this controller is connected to the MGT1 lane of MPSoC's PS GT bank to establish the USB3.0 data lane. For the USB2.0 interface, the controller is connected to the on-board USB2.0 PHY U9. The USB2.0 PHY is connected per ULPI interface (MIO pins 52..63) to MPSoC's MIO bank.

The USB3.0 Hub controller has also an ARM Cortex-M0 controller integrated, refer to the data sheet for further features and programmable options.

CAN FD Transceiver

On-board CAN FD (Flexible Data Rate) transceiver is provided by Texas Instruments TCAN337. This controller is the physical layer of the CAN interface and is specified for data rates up to 1 Mbps. The controller has many protection features included to ensure CAN network robustness and to eliminate the need for additional protection circuits. Refer to the data sheet of this transceiver for more details and specifications.

The transceiver is connected to System Controller CPLD U17, means it works on this interface with 3.3V VCCIO. The logical signal processing of the CAN interface depends on the current firmware ot the SC CPLD U17.

eMMC Memory

The TEBF0808 carrier board is equipped with embedded MMC memory connected to the PS MIO bank (MIO13 ... MIO23) of the Zynq Ultrascale+ MPSoC. The memory is provided by MTFC4GACAJCN-4M from Micron Technology. It has a memory density of 32 Gbit (4 GByte) and is sectored into 8 banks a 4 Gbit.

24-bit Audio Codec

For high resolution digital audio signal processing, the TEBF0808 carrier board is equipped with the Analog Devices 24-bit Audio Codec chip ADAU1761 with the schematic designator U3. The Audio Codec chip is connected to the Intel High Defintion Audio (Intel HDA) compatible 9-pin header J9 with single-ended signaling for analog stereo audio signal input and output. It supports also MIC / Jack detect. Its I²C control interface is accessible by the Zynq Ultrascale+ MPSoC through I²C switch U27.

The 24-bit Audio Codec provides numerous features and is also fully programmable with its dedicated graphical tool from the manufacturer. Refer to the data sheet of this chip for more detail information and specifications.

SDIO Port Expander

Due to the different signaling voltage levels of the MicroSD and MMC Card interfaces (3.3V) and the PS MIO bank of the Zynq Ultrascale+ MPSoC (1.8V), there is voltage-translation necessary, which is fullfilled by the SDIO port expander Texas Instruments TXS02612, U15. This IC also muxes the MikroSD and the MMC Card sockets to the SDIO port of the MPSoC, which is controlled by the signal 'SEL_SD' of the System Controller CPLD U39. The SC CPLD U39 also controls the load switches to enable the card sockets J16 and J27 and to report the card detect signal both of the sockets to the MPSoC (see schematic).


There are two 4-bit DIP-witches present on the TEBF0808 carrier board to configure options and set parameters. The following section describes the functionalities of the particular switches.

DIP-switch S4

Table below describes the functionalities of the switches of DIP-switch S4 at their single positions:

DIP-switch S4Position ONPosition OFFNotes
S4-1PUDC_B is LowPUDC_B is HIGHInternal pull-up resistors during configuration are enabled at ON-position,
means I/O's are 3-stated until configuration of the FPGA completes. 
S4-2xxnot connected
S4-3SC CPLDs' JTAG enabledSC CPLDs' JTAG disabledJTAG interface is enabled on both SC CPLDs, as this CPLDs are
configured in a casdaced JTAG chain.
S4-4DC-DC converter U18 (5V) enabledDC-DC converter U18 (5V) not manually enabledIn OFF-position, the DC-DC-converter will be still enabled by the
Enable-signal ('5V_EN') of SC CDPD U39 (wired-OR circuit).

Table 22: DIP-switch S4 functionality description

DIP-switch S5

DIP-switch S5 located close to PWR push-button is connected to the two System Controller CPLDs, its functionalities depend on the current firmware of the CPLDs.

The DIP-switch is connected to SC CPLD U17 and U39 as fellows:

DIP-switch S5Signal Schematic NameConnected toFunctionalityCPLD Documentation
S5-1SC_SW1SC CPLD U39, pin 133set 2-bit code for boot mode selection

TEBF0808 Slave CPLD

Section: Boot Mode

S5-2SC_SW2SC CPLD U39, pin 138
S5-3SC_SW3SC CPLD U17, pin 6user defined

TEBF0808 Master CPLD

S5-4SC_SW4SC CPLD U17, pin 5set FMC_VADJ: 1.8V at ON-position, 1.2V at OFF-position

Table 23: DIP-switch S5 connection to SC CPLDs

The boot mode of the mounted Ultrascale+ Zynq MPSoC module will be set in current SC CPLD U39 firmware version as described in the table below:

ONONDefault, boot from SD/microSD or SPI Flash if no SD is detected
OFFONBoot from eMMC
ONOFFBoot mode  PJTAG0
OFFOFFBoot mode main  JTAG

Table 23: DIP-switch S5 boot mode selection

On-board LEDs

The TEBF0808 carrier board is equipped with several LED to signal current states and activities. The functionality of the LEDs D4 ... D7 depends on the current firmware of the SC CPLDs U17 and U39.

LEDColorDescription and Notes
D4greenStatus LED, connected to SC CPLD U17
D5redStatus LED, connected to SC CPLD U17
D6greenStatus LED, connected to SC CPLD U39
D7redStatus LED, connected to SC CPLD U39
D1redSFP+ interface status LED, connected to SC CPLD U17
D8greenSFP+ interface status LED, connected to SC CPLD U17
D9redSFP+ interface status LED, connected to SC CPLD U17
D10greenSFP+ interface status LED, connected to SC CPLD U17

LED is on if all USB3.0 and USB 2.0 ports are in the suspend state and is
off when either of the ports comes out of the suspend state.

Table 24: On-board LEDs functionality description

Power and Power-On Sequence

Power Consumption

The maximum power consumption of a module mainly depends on the design which is running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power Distribution Dependencies

All on-board voltages of the TEBF0808 are generated out of the extern applied 12V power supply.

There are following dependencies how the initial 12V power supply is distributed to the on-board DC-DC converters, which power up further DCDC converters and the particular on-board voltages:

 Figure 12: Power Distribution Diagram

Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row).

Power-On Sequence Diagram

The power-on sequence of the on-board DC-DC converters depens on the current firmware of the System Controller CPLD U39.

Following diagram visualizes the connection of the DC-DC converter control signals ('Enable', 'Power-Good') with System Controller CPLD U39, which enables the particular on-board voltages.

Figure 13: Power-On Sequence Utilizing DCDC Converter Control Signals

As shown in Figure 13, the DIP switch S4-4 has to be closed if using only 12V single power supply through 12V power jack J25, otherwise the 5V voltage level will not be enabled to generate the 3V3SB voltage to power up the SC CPLD U39 and starting the power-on sequence.
By using an ATX-24 power connector on J20, there is usually also a 5V supply voltage provided, hence the DIP switch S4-4 is not relevant in this case of power supply.

The TEBF0808 carrier board manages both the power-on sequence of the mounted TE0808 / TE0803 SoM and the on-board DC-DC converters via System Controller CPLD U39.

The power-on sequence of the TE0808 / TE0803 SoM is managed by utilizing the SoM's DC-DC converter control signals ('Enable', 'Power-Good'), so the DC-DC converters of the SoM dedicated to the particular Power Domains of the Zynq Ultrascale+ MPSoC will be powerer-up in a specific sequence to meet the recommended criteria to power up the Xilinx Zynq Ultrascale+ MPSoC properly.

To avoid any damages to the MPSoC module, check for stabilized on-board voltages in steady state before powering up the MPSoC's I/O bank voltages VCCOx. All I/O's should be tri-stated during power-on sequence.

Core voltages and main supply voltages of the Zynq Ultrascale+ MPSoC have to reach stable state and the "Power Good"-signals of the SoM have to be asserted before other voltages like bank's I/O voltages (VCCOx) can be powered up.

It is important that all PS and PL I/Os are tri-stated at power-on until the "Power Good"-signals are logically high, meaning that all on-module voltages have become stable and module is properly powered up.

Adjustable PL Bank VCCO Voltage FMC_VADJ

The carrier board VCCO voltage 'FMC_VADJ' supplying the PL IO-banks of the MPSoC is provided by DC-DC converter U8 and selectable by the pins 'FMC_VID0' ... 'FMC_VID2' of the System Controller CPLD U17.




Table 25: Bit patterns for fixed values of the FMC_VADJ voltage

Note: These pins of the DC-DC converter U8 are hard-wired to initialiy fix the voltage to 1.8V (see schematic).

Power Rails

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes



Pin 151, 153, 155, 157, 159

FMC_VADJOutPin 90, 120-
PL_1V8InPin 91, 121not connected



Pin 138, 140, 142, 144, 153, 154, 155, 156, 157, 158, 159, 160

PS_BATTOutPin 125-
DDR_1V2InPin 135not connected
PS_1V8InPin 99not connected



Pin 157, 158, 159, 160

FMC_VADJOutPin 15, 16-
1.8VOutPin 43, 44-
PLL_3V3OutPin 152-
SI_PLL_1V8InPin 151connected to testpoint
PS_1V8InPin 147, 148not connected
J43.3V_MODOutPin 58, 59, 105, 106-

Table 26: Power pin description of B2B Module Connector.

FAN DesignatorVCC / VCCIODirectionPinsNotes
J3512VOutPin 2FAN2 Header


OutPin 2FAN1 Header


OutPin 2FMC FAN Header

Table 27: Power pin description of FAN Connector

FMC DesignatorVCC / VCCIODirectionPinsNotes



Pin C35, G37

3.3V_PEROutPin D32, D36, D38, D40, C39-
FMC_VADJOutPin E39, G39, H40, F40adjustable FMC VCCIO

Table 28: Power pin description of FMC Connector

Main Power ATX + LED/RST DesignatorVCC / VCCIODirectionPinsNotes

Pin 10, 11

ATX-24 Connector
5VSBINInPin 9-
J2512VInPin 1

12V Power Jack

Attention: optional, use only if ATX-24 Connector is not connected

J105VOutPin 9Power-/HD-LED/Reset Header

Table 29: Power pin description of ATX-24 Connector and Power-/HD-LED/Reset Header

PMOD DesignatorVCC / VCCIODirectionPinsNotes
P13.3V_PEROutPin 6, 12-
P23.3V_PEROutPin 6, 12-
P33.3V_PEROutPin 6, 12-

Table 30: Power pin description of PMOD Connector

XMOD / JTAG DesignatorVCC / VCCIODirectionPinsNotes


OutPin 5XMOD Header
1.8VOutPin 6-
J283.3VSBOutPin 5, 6XMOD Header
J303.3VSBOutPin 1ARM JTAG Header

Table 31: Power pin description of XMOD/JTAG Connector

Peripheral DesignatorVCC / VCCIODirectionPinsNotes
J233.3VSBOutPin 1PC Compatible BEEPER



Pin A2, A3, B1, B2, B3

PCIe Connector

Pin A9, A10, B8, B10


J295VOutPin 5CAN-Bus Header
J13DP_TX_PWROutPin 20Display-Port Connector
J14A3.3V_PCIOutPin T15, T16SFP+ 2x1 Connector
J14B3.3V_PCIOutPin L15, L16SFP+ 2x1 Connector
J153.3V_PEROutPin 1, 10FireFly Connector
J223.3V_PEROutPin 1, 10FireFly Connector
J7AVBUS4OutPin U1USB3.0 Connector
J7BVBUS3OutPin U10USB3.0 Connector


OutPin 19USB3.0 Header
VBUS2OutPin 1-
J163.3V_SD_AOutPin 4MicroSD Card Socket
J273.3V_SD_BOutPin 4MMC Card Socket
B1VBATTInPin +Battery Holder

Table 32: Power pin description of Peripherals' Connector

B2B connectors

5.2 x 7.6 cm UltraSoM+ modules use four Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.
  • 4x REF-192552-02 (160-pins)
    • ST5 Mates with SS5

5.2 x 7.6 cm UltraSoM+ carrier use four Samtec Razor Beam LP Socket Strip (SS5) on the top side.

  • 4x REF192552-01 (160-pins)
    • SS5 Mates with ST5
  • Board-to-Board Connector 160-pins, 80 contacts per row
  • Ultrafine .0197" (0.50 mm) pitch
  • Narrow body design saves space on board
  • Lead style -03.5
  • Samtec 28+ Gbps Solution
  • Mates with: ST5
  • Insulator Material: Liquid Crystal Polymer, schwarz
  • Operating Temperature Range: -55°C bis +125°C
  • Lead-Free Solderable: Yes
  • RoHS Konform: Yes

Connector Stacking height

When using the standard type on baseboard and module, the mating height is 5 mm.

Other mating heights are possible by using connectors with a different height:

Order numberREF numberSamtec NumberTypeContribution to stacking heightComment
27219REF192552-01SS5-80-3.50-L-D-K-TRBaseboard connector3.5mm

Standard connector used on carrier

27018REF-189545-02 SS5-80-3.00-L-D-K-TRBaseboard connector3 mm 

Assembly option on request

27220REF-192552-02 ST5-80-1.50-L-D-P-TRModule connector1.5 mm

Standard connector used on modules

27017REF-189545-01 ST5-80-1.00-L-D-P-TRModule connector1 mm

Assembly option on request


The module can be manufactured using other connectors upon request.

Current Rating

Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row).

Connector Speed Ratings

The connector speed rating depends on the stacking height:

Stacking height

Speed rating

4 mm, Single-Ended13GHz/26Gbps
4 mm, Differential13.5GHz/27Gbps
5 mm, Single-Ended13.5GHz/27Gbps
5 mm, Differential20GHz/40 Gbps
Speed rating.

The SS5/ST5 series board-to-board spacing is currently available in 4mm (0.157"), 4.5mm (0.177") and 5mm (0.197") stack heights.

The data in the reports is applicable only to the 4mm and 5mm board-to-board mated connector stack height.

Manufacturer Documentation

  File Modified
PDF File hsc-report-sma_st5-ss5-04mm_web.pdf 30 05, 2017 by Susanne Kunath
PDF File hsc-report-sma_st5-ss5-05mm_web.pdf 30 05, 2017 by Susanne Kunath
PDF File REF-192552-01.pdf 13 11, 2017 by John Hartfiel
PDF File REF-192552-02.pdf 13 11, 2017 by John Hartfiel
PDF File ss5.pdf 13 11, 2017 by John Hartfiel
PDF File ss5-st5.pdf 13 11, 2017 by John Hartfiel
PDF File ss5-xx-x.xx-x-d-k-tr-mkt.pdf 13 11, 2017 by John Hartfiel
PDF File st5.pdf 13 11, 2017 by John Hartfiel
PDF File st5-xx-x.xx-x-d-p-tr-mkt.pdf 13 11, 2017 by John Hartfiel

Technical Specifications

Absolute Maximum Ratings




Notes / Reference Document

Power supply voltage (12V nominal)11.412.6VANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
Battery Voltage VBATT-0.52VXilinx DS925 data sheet
Voltage on pins of PMOD P2-0.53.75VMachXO2 Family Data Sheet

Storage temperature (ambient)




Marvell 88E1512 datasheet

Table 33: Board absolute maximum ratings.

Assembly variants for higher storage temperature range are available on request.

Recommended Operating Conditions

ParameterMinMaxUnitNotes / Reference Document
Power supply voltage (12V nominal)11.412.6VANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
Battery Voltage VBATT1.21.5VXilinx DS925 data sheet
Voltage on pins PMOD P23.1353.6VMachXO2 Family Data Sheet

Table 34: Board recommended operating conditions.

Please check TRM TE0808 / TE0803 and Xilinx datasheet DS925 for complete list of absolute maximum and recommended operating ratings for the mounted UltraSoM+.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Extended grade: 0°C to +85°C.

The carrier board itself is capable to be operated at industrial grade temperature range.

Please check the operating temperature range of the mounted UltraSOM+ modules, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

  • Module size: 170 mm × 170 mm.  Please download the assembly diagram for exact numbers

  • Mating height with standard connectors: 5 mm

  • PCB thickness: 1.844 mm ± 10%

  • Highest part on PCB: approx. 32 mm. Please download the step model for exact numbers

All dimensions are given in millimeters.


Figure 14: Board physical dimensions drawing.

Revision History

Hardware Revision History



Link to PCNDocumentation Link
-04Current available board revision-TEBF0808-04
-03Second production release-TEBF0808-03
-02First production release-TEBF0808-02

Table 35: Board hardware revision history.

Hardware revision number is written on the PCB board together with the module model number separated by the dash.

Figure 15: Board hardware revision number.

Document Change History




  • System Controller links fixed
2019-09-03v.96Thomas Steffens
  • correction EEPROM Designator
  • correction typ U25 CLK


v.89Martin Rohrmüller
  • Typo



John Hartfiel
  • Typo correction Table 13
  • Typo correction Table 9
2017-11-15v.86Ali Naseri
  • DIP-switches section revised and updated



Ali Naseri
  • updated B2B connector max. current rating
    per pin



John Hartfiel
  • rework B2B section


Ali Naseri
  • added additionally MGT lanes information


Ali Naseri
  • added Power Rails section



John Hartfiel
  • update document change history
  • published
2017-08-28v.69Ali Naseri
  • Initial document



  • --

Table 36: Document change history.


Data Privacy

Please also note our data protection declaration at

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.



Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).


Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

  • No labels