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Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TEBF0808/REV04 for downloadable version of this manual and additional technical documentation of the product. |
The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, MGT interfaces and connectors are accessible, for the front panel elements there are also Intel-PC compatible headers available.
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| Module Connector (B2B) Designator | VCC / VCCIO | Direction | Pins | Notes |
|---|---|---|---|---|
| J1 | 3.3V_MOD, | Out | Pin 151, 153, 155, 157, 159 | - |
| FMC_VADJ | Out | Pin 90, 120 | ||
| VREF_A_M2C | Out | Pin 108 | ||
| J2 | 3.3V_MOD | Out | Pin 138, 140, 142, 144, 153, 154, 155, 156, 157, 158, 159, 160 | - |
| PS_BATT | Out | Pin 125 | ||
| DDR_1V2 | In | Pin 135 (not connected to board) | ||
| J3 | 3.3V_MOD | Out | Pin 157, 158, 159, 160 | - |
| FMC_VADJ | Out | Pin 15, 16 | ||
| 1.8V | Out | Pin 43, 44 | ||
| PLL_3V3 | Out | Pin 152 | ||
| SI_PLL_1V8 | In | Pin 151 | ||
| J4 | 3.3V_MOD | Out | Pin 58, 59, 105, 106 | - |
| VREF_A_M2C | Out | Pin 15, 88 |
Table 26: Power pin description of B2B Module Connector
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