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  1. Xilinx XA7Z020-1CLG484Q (Automotive)
  2. Programmable Oscillator
  3. 2 x ARM Cortex-A9 MPCore
  4. 2 x 100 MBit Ethernet transceiver (PHY)
  5. 512 MByte DDR3L DDR3 SDRAM, 16-bit-wide 
  6. 16 MByte QSPI Flash memory (with XiP support)
  7. CAN transceiver (PHY)
  8. 12 V power supply with watchdog
  9. On-board high-efficiency DC-DC converters
  10. System management and power sequencing
  11. eFUSE bit-stream encryption
  12. AES bit-stream encryption
  13. Temperature compensated RTC (real-time clock)
  14. Three user LEDs
  15. Evenly-spread supply pins for good signal integrity


Initial Delivery State

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titleInitial delivery state of programmable devices on the module.

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Storage device name

Content

Notes

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OTP Flash areaEmptyNot programmed.


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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

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    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
13JM148VCCO_13
500JM143.3V
33JM3343.3V
35JM3203.3V
35JM2223.3V
501JM238VMIO1MIO1 VREF is connected to resistor divider to support HSTL18

JTAG Interface

JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.

JTAG Signal

B2B Pin

TMSJM2-12
TDIJM2-10
TDOJM2-8
TCKJM2-6


PS7 UART

There is no fixed mapping for PS7 UART, if needed it can be mapped to free pins from MIO1 Bank or via EMIO to PL pins.

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On-board QSPI flash memory S25FL127SABMFV10 is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

RTC I2C

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LED

DesignatorColorConnected toActive LevelIO Standard
D9GreenDONELownot applicable
D8REDMIO7Highnot applicableLVCMOS33
D4GreenPL pin V18HighLVCMOS33

512 Mbyte DDR3L SDRAM


Ethernet

There are two 100 MBit Extreme Temperature Ethernet PHY's DP83848YB on the board. Datasheet is available from TI, Literature number SNLS208H. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz source is provided from MEMS Oscillator. All LED outputs have on-board pull-ups. Outputs to Magnetics have also required termination resistors on board.

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ETH1ETH2PullupNotes
CTREFJ3.-57J3.-25
Magnetics center tap voltage
TD+J3.-58J3.-28on-board
TD-J3.-56J3.-26on-board
RD+J3.-52J3.-22on-board
RD-J3.-50J3.-20on-board
LED1J3.-55J3.-23on-board
LED2J3.-53J3.-21on-board
LED3J3.-51J3.-19on-board
POWERDOWN/INTL21R20on-chipIt is recommended to configure FPGA I/O as input with Pullup or as output driving 1 if Interrupt not used.
RESET_NM15R16on-chipIt is recommended to configure FPGA I/O as input with Pullup or as output (active low PHY Reset).

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series, for example: 4 x 5 SoM LSHM B2B Connectors

    Include Page
    PD:4 x 5 SoM LSHM B2B Connectors
    PD:4 x 5 SoM LSHM B2B Connectors

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Technical Specifications

Absolute Maximum RatingsTechnical Specifications

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ParameterMinMaxUnitsReference Document











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