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Template Revision 2.3

TRM Name always "TE Series Name" +TRM, for example "TE0720 TRM"

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Important General Note:

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Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

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Figure template:

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Table template:

  • Layout macro can be use for landscape of large tables

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anchorTable_tablename
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The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

  • <type>_<main section>_<name>

    • type: Figure, Table
    • main section:
      • "OV" for Overview
      • "SIP" for Signal Interfaces and Pins,
      • "OBP" for On board Peripherals,
      • "PWR" for Power and Power-On Sequence,
      • "B2B" for Board to Board Connector,
      • "TS" for Technical Specification
      • "VCP" for Variants Currently in Production
      •  "RH" for Revision History
    • name: custom, some fix names, see below
  • Fix names:
    • "Figure_OV_BD" for Block Diagram

    • "Figure_OV_MC" for Main Components

    • "Table_OV_IDS" for Initial Delivery State

    • "Table_PWR_PC" for Power Consumption

    • "Figure_PWR_PD" for Power Distribution
    • "Figure_PWR_PS" for Power Sequence
    • "Figure_PWR_PM" for Power Monitoring
    • "Table_PWR_PR" for Power Rails
    • "Table_PWR_BV" for Bank Voltages
    • "Table_TS_AMR" for Absolute_Maximum_Ratings

    • "Table_TS_ROC" for Recommended_Operating_Conditions

    • "Figure_TS_PD" for Physical_Dimensions
    • "Table_VCP_SO" for TE_Shop_Overview
    • "Table_RH_HRH" for Hardware_Revision_History

    • "Figure_RH_HRN" for Hardware_Revision_Number
    • "Table_RH_DCH" for Document_Change_History

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Note for Download Link of the Scroll ignore macro:

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Table of Contents

Table of Contents

Overview

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Notes :

Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive Zynq-7020 FPGA, two 100 Mbit Ethernet transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. 

Within the complete module only Automotive components are installed.

All this in a compact 6 x 6 cm form factor, at the most competitive price.

Refer to http://trenz.org/te0728-info for the current online version of this manual and other available documentation.

Key Features

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    • Note:

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Depending on the customer design, additional cooling might be required.

Block Diagram

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anchorFigure_OV_BD
titleTE0728 block diagram

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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below

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anchorFigure_OV_MC
titleTE0728 main components

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Initial Delivery State

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module.

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Storage device name

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Content

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Notes

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Quad SPI Flash

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Empty

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Pre-programmed globally unique, 48-bit node address (MAC)

Control Signals

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  • Overview of Boot Mode, Reset, Enables,

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

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JTAG Interface

JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.

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JTAG Signal

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B2B Pin

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There is no fixed mapping for PS7 UART, if needed it can be mapped to free pins from MIO1 Bank or via EMIO to PL pins.

Recommended mapping for primary (console, debug) UART are MIO52, MIO53 for all cases when MIO1 is not used for off-board Gigabit ETH PHY.

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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16 MByte Quad SPI Flash Memory

On-board QSPI flash memory S25FL127SABMFV10 is used to store initial FPGA configuration. Datasheet is provided in Texas Instruments. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.

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Supply Voltage: 2.7V to 3.6V

 Temperature Range:

  • Industrial (-40°C to +85°C)
  • Industrial Plus (-40°C to +105°C)
  • Automotive AEC-Q100 Grade 3 (-40°C to +85°C)
  • Automotive AEC-Q100 Grade 2 (-40°C to +105°C)

RTC I2C

The RV-3029-C3 is an ultra miniature Real-Time-Clock Module with embedded Crystal. This RTC has an I2C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy of ± 6ppm from -40°C to +85°C and ± 8ppm from -40°C to +125°C.

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 I2C

EEPROM

The Microchip Technology Inc. 24LC64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with standby and active currents of only 1 μA and 3 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24LC64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.

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LEDs

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512 Mbyte DDR3L SDRAM

The TE0728 SoM has two 512 GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: NT5CC256M16DP Nanya
  • Supply voltage: 1.35V
  • Speed: 1600 Mbps
  • NOR Flash
  • Temperature: -40°C ~95°C 

 Configuration of the DDR3 memory controller in the FPGA should be done using the MIG tool in the Xilinx Vivado Design Suite IP catalog.

Ethernet

There are two 100 MBit Extreme Temperature Ethernet  DP83848-EP are provided by Texas Instrument on the board. Datasheet is provided TI website, Literature number SNLS208H. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz source is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.

PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.

Both PHY's must be operated in MII Mode, other modes are not supported. It is possible to use PS ENET0 or ENET1 via EMIO routing or Ethernet IP Cores implemented in PL Fabric.

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It is recommended to add IOB TRUE constraint for the MII Interface pins.

When connecting the PHY's to Zynq PS ETH0, ETH1 EMIO GMII Interfaces it is recommended to use GMII to MII Wrap IP Core. This IP core maps the EMIO GMII to external MII Interface.

CAN Transceiver

The SN65HVD230Q,  controller area network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is avaiable in Texas Instrumens website. They are intended for use in applications employing the CAN serial communication physical layer in accordance with the ISO 11898 standard. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps. Temperature must be in range of -40°C ~125°C .

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The TPS3808G01-Q1 microprocessor supervisory circuits monitor system voltages from 0.4 V to 5 V, asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the useradjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.

The TPS3808G01-Q1 device uses a precision reference to achieve 0.5% threshold accuracy for VIT ≤ 3.3 V. The reset delay time can be set to 20 ms by disconnecting the CT pin, 300 ms by connecting the CT pin to VDD using a resistor, or can be useradjusted from 1.25 ms to 10 s by connecting the CT pin to an external capacitor. The TPS3808G01-Q1 has a very low typical quiescent current of 2.4 μA, so it is well suited for battery-powered applications. 

Low Dropout Linear Regulator

The TPS74801-Q1 low-dropout (LDO)  provides an easy-to-use robust power management  solution for a wide variety of applications. User programmable soft-start minimizes stress on the input power source by reducing capacitive inrush current on start-up. The soft-start is monotonic and well- suited for powering many different types of Monitoring or Provides a Sequencing Signal processors and ASICs. The enable input and power for Other Supplies good output allow easy sequencing with external regulators. This complete flexibility permits the user to configure a solution that meets the sequencing Voltage Startup requirements of FPGAs, DSPs, and other applications with special start-up requirements.

A precision reference and error amplifier deliver 2% accuracy over load, line, temperature, and process. The device is stable with any type of capacitor greater than or equal to 2.2 μF, and is fully specified SON-10 and 5 x 5 QFN-20 Packages from –40°C to 105°C for the DRC package, and from –40°C to 125°C for the RGW package.

Clock Sources

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Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3.5 A for system startup is recommended.

Power Consumption

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* TBD - To Be Determined

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anchorFigure_PWR_PD
titlePower Distribution
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Power-On Sequence

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anchorFigure_PWR_PS
titlePower Sequency
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The PS and PL power supplies are fully independent. PS power supplies (VCCPINT, VCCPAUX, VCCPLL, VCCO_DDR, VCCO_MIO0, and VCCO_MIO1) can be powered before or after any PL power supplies. The PS and PL power regions are isolated to prevent damage. The recommended power-on sequence is VCCPINT, then VCCPAUX and VCCPLL together, then the PS VCCO supplies (VCCO_MIO0, VCCO_MIO1, and VCCO_DDR) to achieve minimum current draw and ensure that the I/Os are 3-stated at power-on. The PS_POR_B input is required to be asserted to GND during the power-on sequence until VCCPINT, VCCPAUX and VCCO_MIO0 have reached minimum operating levels to ensure PS eFUSE integrity.

Voltage Monitor Circuit

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B2B Connector

JM1 Pin

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B2B Connector

JM2 Pin

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B2B Connector

JM3 Pin

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1.8V

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Bank Voltages

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Bank          

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Voltage

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VCCO_MIO1_500

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Supplied by the carrier board. JM2,JM3

Board to Board Connectors

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Processing System(PS)

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Programmable Logic(PL)

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Technical Specifications

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anchorTable_TS_AMR
titleModule absolute maximum ratings.

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Absolute Maximum Ratings

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See Nanya NT5CC256M16CP-DIA datasheet.

Recommended Operating Conditions

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anchorTable_TS_AMR
titleRecommended Operating Conditions.

Commercial grade: 0°C to +70°C.

Industrial and automotive grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
VIN supply voltage3.560VTPS54260-Q1 datasheets.
Supply voltage for PS MIO banks1.713.465VSee Xilinx DS187 datasheet.
I/O input voltage for PS MIO banks-0.2VCCO_MIO + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for PS DDR1.141.89VSee Xilinx DS187 datasheet.
I/O input voltage for PS DDR-0.20VCCO_DDR + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for HR I/Os banks1.143.465VSee Xilinx DS187 datasheet.
I/O input voltage for HR I/O banks-0.20VCCIO + 0.20VSee Xilinx DS187 datasheet.
Storage Temperature-65150°CSee Xilinx DS187 datasheet.

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anchorFigure_TS_PD
titlePhysical dimensions drawing

Physical Dimensions

  • Module size: 60 mm × 60 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

  • PCB thickness: 1.6 mm.

Variants Currently In Production

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anchorTable_VCP_SO
titleTrenz Electronic Shop Overview

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Revision History

Hardware Revision History

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anchorTable_RH_HRH
titleHardware Revision History

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anchorFigure_RH_HRN
titleHardware Revision Number

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

Document Change History

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    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

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anchorTable_RH_DCH
titleDocument change history.

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Page info
infoTypeModified date
dateFormatyyyy-MM-dd
typeFlat

Page info
infoTypeCurrent version
prefixv.
typeFlat
showVersionsfalse

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Page info
infoTypeModified by
typeFlat
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  • change list

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Disclaimer

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