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Scroll Title |
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anchor | Table_TS_ROC |
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title | Recommended operating conditions |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. | Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. | I/O input voltage for PS MIO banks | -0.2 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. | Supply voltage for PS DDR | 1.14 | 1.89 | V | See Xilinx DS187 datasheet. | I/O input voltage for PS DDR | -0.20 | VCCO_DDR + 0.20 | V | See Xilinx DS187 datasheet. | Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. | I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. | Storage Temperature | -40 | +125 | °C | See Xilinx DS187 datasheet. |
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Temprature Operating range: -40°C to +105°C.
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| Operating Temperature | -40 | +105 | °C |
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Physical Dimensions
Module size: 60 mm × 60 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 7 mm.
PCB thickness: 1.6 mm.
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