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Refer to "https://shopwiki.trenz-electronic.de/endisplay/Download/?path=Trenz_Electronic/TE0808"PD/TE0808+TRM for downloadable version of this manual and the rest of available documentation. |
The Trenz Electronic TE0808 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, max. 8 GByte up to 8 GBytes of DDR4 SDRAM with via 64-Bit width databus connectionbit wide data bus, max. 512 MByte Flash memory for configuration and operation, 20 Gigabit transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is Os are provided via rugged high-speed stacking connections. All this in a compact 5.2 x 7.6 cm form factor, at the most competitive price.
Note |
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Important Information for TE0808 boards which are equipped with ES1 or ES2 silicon: Erratas and functional restrictions may exist, please check Xilinx documentation and contact your local Xilinx FAE for restrictions. |
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Figure 1: TE0808-04 Block Diagram.
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Each connector has a specific arrangement of the signal pins, which are grouped together in categories related to their functionalities and to their belonging to particular units of the Zynq UltrascaleUltraScale+ MPSoC like I/O - banks, interfaces and Gigabit transceivers
or to the on-board peripherals.
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Bank | Type | B2B Connector | Schematic Names / Connector Pins | I/O Signal CountSignals | LVDS Pairs Count | VCCO Bank Voltage | Notes |
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47 | HD | J3 | B47_L1_P ... B47_L12_P | 24 I/O'sOs | 12 | VCCO47 | VCCO max. 3.3V |
48 | HD | J3 | B48_L1_P ... B48_L12_P | 24 I/O'sOs | 12 | VCCO48 | VCCO max. 3.3V |
64 | HP | J4 | B64_L1_P ... B64_L24_P B_64_T0 ... B_64_T3 | 52 I/O's | 24 | VCCO64 | VCCO max. 1.8V |
65 | HP | J4 | B65_L1_P ... B65_L24_P B_65_T0 ... B_65_T3 | 52 I/O'sOs | 24 | VCCO65 | VCCO max. 1.8V |
66 | HP | J1 | B66_L1_P ... B66_L24_P B_66_T0 ... B_66_T3 | 48 I/O'sOs | 24 | VCCO66 | VCCO max. 1.8V |
500 | MIO | J3 | MIO13 ... MIO25 | 13 I/O'sOs | - | PS_1V8 | user User configurable I/O's Os on B2B |
501 | MIO | J3 | MIO26 ... MIO51 | 26 I/O'sOs | - | PS_1V8 | user User configurable I/O's Os on B2B |
502 | MIO | J3 | MIO52 ... MIO77 | 26 I/O'sOs | - | PS_1V8 | user User configurable I/O's Os on B2B |
Table 2: B2B connector pin-outs of available PL and PS banks of the TE0808-04 SoM.
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JTAG access is provided through the MPSoC's PS configuration bank 503 with bank voltage ' PS_1V8'.
JTAG Signal | B2B Connector Pin |
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TCK | J2-120 |
TDI | J2-122 |
TDO | J2-124 |
TMS | J2-126 |
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The Xilinx Zynq UltraScale+ MPSoC's PS configuration bank 503 control signal pins are accessible through B2B - connector J2.
For further information about the particular control signals and how to use and evaluate them, refer to the Xilinx Zynq UltraScale+ MPSoC TRM and UltraScale Architecture Configuration - User Guide.
Signal | B2B Connector Pin | Function |
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DONE | J2-116 | PL configuration completed. |
PROG_B | J2-100 | PL configuration reset signal. |
INIT_B | J2-98 | PS is initialized after a power-on reset. |
SRST_B | J2-96 | System reset. |
MODE0 ... MODE3 | J2-109/J2-107/J2-105/J2-103 | 4-bit boot mode pins. For further information about the boot - modes refer to the Xilinx Zynq UltraScale+ MPSoC TRM |
ERR_STATUS / ERR_OUT | J2-86 / J2-88 | ERR_OUT signal is asserted for accidental loss of power, an error, or an exception in the MPSoC's Platform Management Unit (PMU)-. ERR_STATUS indicates a secure lock-down state. |
PUDC_B | J2-127 | Pull-up during configuration (pulled-up to PL_1V8). |
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Quad SPI Flash memory ICs U7 and U17 are connected to the Zynq MPSoC PS QSPI0 interface via PS MIO bank 500, pins MIO0 ... MIO5 and MIO7 ... MIO12.
MIO | Signal Schematic Name | U7 Pin | MIO | Signal Schematic Name | U17 Pin | |
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0 | SPI Flash -SCK/M4CLK | B2 | 7 | SPI Flash -SCKCS | C2 | |
1 | SPI Flash-DQ1/M1Flash IO1 | D2 | 8 | SPI Flash -DQ0/M0IO0 | D3 | |
2 | SPI Flash -DQ2/M2IO2 | C4 | 9 | SPI Flash -DQ1/M1IO1 | D2 | |
3 | SPI Flash -DQ3/M3IO3 | D4 | 10 | SPI Flash -DQ2/M2IO2 | C4 | |
4 | SPI Flash -DQ0/M0IO0 | D3 | 11 | SPI Flash -DQ3/M3IO3 | D4 | |
5 | SPI Flash -SCKCS | C2 | 12 | SPI Flash -SCK/M4CLK | B2 |
Table 7: PS MIO pin assignment of the Quad SPI Flash memory ICs.
The boot source device and mode of the Zynq UltraScale+ MPSoC can be selected via 4 dedicated pins , which generate a 4-bit code to select the boot mode. The pins are accessible on B2B connector J2:
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Table 8: Boot mode pins on B2B connector J2.
Following boot modes are possible on the TE0808 UltraScale+ module by generating the corresponding 4-bit code by the pins ' PS_MODE0 ' ... ' PS_MODE3 ' (little-endian alignment):
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For functional details see ug1085 - Zynq UltraScale+ TRM (Boot Modes Section).
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Date | Revision | Contributors | Description | ||||||||||
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| Jan Kumann |
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2017-08-15 | v.12 | Vitali Tsiukala | Changed signals count in the B2B connectors table | ||||||||||
2017-08-15 | v.11 | John Hartfiel, Ali Naseri |
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2017-02-06 | V1 | Jan Kumann | Initial document |
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