Page History
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| Module Variant | Zynq UltraScale+ MPSoC | DDR4 | Junction Temperature | Operating Temperature Range |
|---|---|---|---|---|
| TE0808-04-09EG-1EA | XCZU9EG-1FFVC900E | 2GB | 0°C - 100°C | Extended Temperature Range |
| TE0808-04-09EG-1EB | XCZU9EG-1FFVC900E | 4GB | 0°C - 100°C | Extended Temperature Range |
| TE0808-04-09EG-1ED(1) | XCZU9EG-1FFVC900E | 4GB | 0°C - 100°C | Extended Temperature Range |
| TE0808-04-09EG-2IB | XCZU9EG-2FFVC900I | 4GB | -40°C - 100°C | Industrial Temperature Range |
(1) Note: Lower B2B connector profile,check distance bolt of between module and carrier
Table 19: Differences between variants of Module TE0808-04
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| Date | Revision | Contributors | Description | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| John Hartfiel |
| |||||||||
| 2017-08-28 | v.14 | Jan Kumann |
| ||||||||
| 2017-08-15 | v.12 | Vitali Tsiukala | Changed signals count in the B2B connectors table | ||||||||
| 2017-08-15 | v.11 | John Hartfiel, Ali Naseri |
| ||||||||
| 2017-02-06 | V1v.1 | Jan Kumann | Initial document |
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