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See page "4 x 5 cm carriers" to get information about the SoM's supported by the TE0703 Carrier Board.

 

Block Diagram

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Main Components

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  1. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
  2. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
  3. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
  4. Micro SD card socket with detect switch, J3
  5. LED indicators D1 and D2
  6. Mini-USB type B connector, J4
  7. LED indicators D3 and D4
  8. Configuration DIP switches, S2 (see table under "DIP switches" section)
  9. User push button (Reset), S1
  10. External connector (VG96) placeholder, J1
  11. External connector (VG96) placeholder, J2
  12. VCCIO voltage selection jumper block, J5, J8, J9 and J10 (see "Power and Power-On Sequence" section)
  13. Trxcom 1000Base-T Gigabit RJ45 Magjack, J14
  14. USB type A receptacle, J6 (optional micro USB 2.0 type B receptacle available, J12)
  15. 5V power connector jack, J13

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  • 2 x VG96 backplane connectors (mounting holes and solder pads)
  • SDIO port expander with voltage-level translation
  • Micro SD card socket, can be used to boot system
  • 4 x user LED's, 2 x red and 2 x green
  • Mini-USB connector (USB JTAG and UART interface)
  • 1 x user-push button routed to CPLD. By default it is configured as system reset button.
  • RJ45 Gigabit Ethernet socket with 4 integrated LED's.
  • USB Host Connector
  • Barrel jack for 5 V Power Supply input
  • 4 A High-Efficiency Power SoC DC-DC Step-Down Converter(Enpirion EN6347) for 3.3 V Power Supply
  • Trenz 4x5 Module Socket (3 x Samtec LSHM series connectors)
  • USB JTAG and UART Interface (FTDI FT2232H), compatible with Xilinx Tools (also with many other tools)
  • 2 x User configurable DIP switches

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Micro SD Card Socket

Micro SD Card card socket is not directly wired connected to the B2B connector pins, but through a Texas Instruments TXS02612 SDIO port expander, which is needed Port Expander for voltage translation due to the different voltage levels of the Micro SD Card and MIO bank 501 of the Xilinx Zynq 7000 chip. The Micro SD Card card has 3.3 V signalling, but the MIO Bank 501 on the Xilinx Zynq 7000 chip is set to 1.8 V3V signal voltage level while Xilinx Zynq MIO bank uses 1.8V for VCCIO.

Dual channel USB UART/FIFO

TE0703 has on-board USB 2.0 High Speed dual high-speed USB-to-multipurpose UART/FIFO FT2232HQ controller from FTDI. Channel A can only be used in simple UART mode, Channel channel B can be used as in UART, FIFO, JTAG (MPSSE) or High Speed Serial high-speed serial modes. An standard 256 Byte EEPROM to store custom Configuration settings for FT2232H is available. EEPROM settings can be changed using FTDI provided tools that -byte serial EEPROM is available for storing custom configuration settings of the FT2232H chip. Contents of this EEPROM can be programmed with the FTDI provided software tools which can be downloaded from FTDI website. See FTDI website for more information.

Ethernet 

On-board ethernet Ethernet jack J14 pins are routed to B2B connector JB1. Ethernet jack J14 LED's are all routed to CPLD Bank LEDs PHY_LED1 and PHY_LED2 are both routed to System Controller CPLD bank 1.

USB Interface

TE0703 board has two physical USB sockets:

  • J4 as mini-USB type B socket wired to the on-board FTDI FT2232H chip.
  • J6 as USB type A wired to B2B connector JB3 (actual USB transceiver present on the SoM used depends on the SoM model used).

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JTAG Interface

JTAG access to the System Controller CPLD and Xilinx Zynq chip on the SoM is provided via Minimini-USB JTAG Interface interface (FTDI FT2232H) and controlled by DIP switch S2-3. JTAG pins are routed signals from System Controller CPLD to the JB2 connector are routed as follows:

JTAG Signal

B2B JB2 Connector Pin

TCKJB2-100
TDOJB2-98
TDIJB2-96
TMSJB2-94

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LEDs

There are four LED's on-board LEDs:

LEDColorDescription
D1RedFTDI UART receive activity.
D2GreenFTDI UART transmit activity.
D3RedCPLD signal FL_0.
D4GreenCPLD signal FL_1.

LED's LEDs D3 and D4 are also connected to the B2B connector JB2 pins FLED1 and FLED2 respectively and can be controlled by 4x5 SoM FPGA modulefirmware.

DIP switches

SwitchONOFFNotes
S2-1User configurable, routed to CPLDUser configurable, routed to CPLD 
S2-2User configurable, routed to CPLDUser configurable, routed to CPLD 
S2-3JTAG enabled for B2B connector JB2JTAG enabled for CPLD 
S2-4 Boot from SD CardBoot from QSPI flash on module
Used as CARD Detect - as the SD card connector has no CD pin

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Power supply with minimum current capability of 3A for system startup is recommended.

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Recommended Operating Conditions

Parameter

MinMax

Units

Reference document

Supply voltage VCC

4.75

5.25

V

 
Operating temperature

0

+70

°C

 
Note
Assembly variants for higher storage temperature range are available on request.

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Physical Dimensions

  • Board size:  PCB 100mm 100 mm ×  64.5mm5 mm. Notice that the mini-USB -B jack on the left and ethernet RJ-45 jack on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm106 mm. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8mm8 mm

  • PCB thickness: 1.65mm65 mm

  • Highest parts on the PCB are USB type A jack and ethernet RJ-45 jack, approximately 15mm15 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

 

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Operating Temperature Ranges

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Date

Revision

Contributors

Description

2017-02-21
Jan KumannNew block diagram.
2017-02-02

V16

Jan KumannNew board image with silk screen pin markings for VG96 connectors J1 and J2.
2016-12-22

V14

Jan KumannBlock diagram added.
2016-12-08
V10

Jan Kumann

Document structure revised.
2016-12-05

V5

John HartfielCorrected Boot Mode table.
2016-09-06

V1

Jan Kumann, John Hartfiel

Initial document.

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