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Overview

The Trenz Electronic TE0703 carrier board provides functionality for development, evaluation and testing purposes of Trenz 4 x 5 cm SoMs (System on Module). 

The carrier board is equipped with a broad range of various components and connectors for different configuration setups and needs. On-module functional components and multipurpose I/Os of the SoM's PL and PS logic are connected via board-to-board connectors to the carrier board components and connectors for easy user access.

See page "4 x 5 SoM Carriers" for more information about the SoM's supported by the TE0703 Carrier Board.

Refer to http://trenz.org/te0703-info for the latest online version of this manual and other available documentation.

Key Features

  • On Board:
    • System Controller (SC) (LCMXO2-1200HC-4TG144I1))
    • Mini USB for JTAG and UART connection (FTDI FT2232H), compatible with AMD and other vendor development tools
    • SDIO port expander with voltage-level translation
    • 4 x User LEDs
      • D1 and D2 are connected to the SC, their function depends on the firmware
      • D3 and D4 are connected to the SC and the 4 x 5 SoM and can be directly controlled by it
    • 1 x User push button: Connected to the SC, the function is firmware depend
    • 4 User DIP switches
      • JTAG selection
      • MIO0 (readable signal by SC and SoM)
      • 2 "mode" bits
  • Interface:
    • Trenz 4 x 5 SoM socket: 3 x Samtec LSHM series high-speed connectors
    • Micro SD card connector - Zynq SDIO0 bootable SD port
    • 2 x VG96 backplane connectors (mounting holes and solder pads)
    • Mini or Normal USB for SoM USB-OTG connection 1)
    • RJ45 GbE connector
  • Power:
    • Overvoltage-, undervoltage- and reversed- supply-voltage-protection
    • Barrel jack (2.1 mm) for 5V power supply input
  • Dimension:
    • 100 mm x 64.5 mm
  • Notes

1) Depends on assembly variant

Block Diagram




TE0703 block diagram

Main Components

TE0703 main components
  1. System Controller (SC), U5
  2. USB-to-JTAG/UART-FTDI, U4
  3. SDIO Port Expander, U2
  4. I²C Repeater, U7
  5. Power Input Protection, U11
  6. DCDC, U3
  7. USB Power Supply Switch, U1
  8. Push button, S1
  9. 4x Dip Switches, S2
  10. LED, D1 (red), D2 (green)
  11. LED, D3 (red), D4 (green)
  12. Ethernet jack, J14
  13. Samtec Razor Beam™ LSHM-150/130 B2B connector, JB1, JB2, JB3
  14. VG96 Connector assembly option, J1, J2
  15. +5V power jack, J13
  16. microSD Card Socket, J3
  17. Bank IO Voltages jumper, J5, J8, J9, J10
  18. Voltage selection jumper for microSD Card IO, J11
  19. Jumper Batterie Voltage , J7
  20. Mini USB Type B jack (FTDI), J4
  21. USB Host Connector, either a USB A jack, J6 or a Micro USB, J12

Initial Delivery State

Storage device name

Content

Notes

EEPROMAMD programmer license

Do not overwrite!

System ControllerFirmwareVisit TE0703 Firmware for further information.
Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignator

InterfaceIO CNTNotes
VG96J1JB1 - IO

48 SE / 24 DIFF


Pin HeaderJ7JB1 - Battery Voltage1
RJ-45 Ethernet
J14JB1 - Ethernet8 
RJ-45 EthernetJ14U5 - ETH LED4 
VG96J2JB2 - IO66 SE / 33 DIFF
VG96J1JB3 - IO36 SE / 18 DIFF
USB Type A1)J6JB3 - USB 2.0 OTG3

Micro USB1) Type A/B

J12JB3 - USB 2.0 OTG3
VG96J2SC - IO18
B2BJB2SC - JTAG4
B2BJB2SC - Reset1
Mini USB Type BJ4FTDI - USB 2.02
B2BJB1SC - UART2
B2BJB1SC - MIO2
microSD Card socket 2)J3SC - SD6
microSD Card socket 2)J3JB1 - SD6
VG96J1SC - I²C2
VG96J1JB1 - I²C2

1) Depending on the variant only one of the USB connectors is assembled.
2) Depending on firmware microSD Card socket is connected to the SC or SoM.

Board Connectors

Test Points

Test PointSignalNotes
TP15VIN
TP25VIN
TP3VIN
TP4VIN
TP53.3V
TP63.3V
TP7VCCIOA
TP8VCCIOA
TP9VCCIOB
TP10VCCIOB
TP11VCCIOC
TP12VCCIOC
TP13VCCIOD
TP14VCCIOD
TP15M1.8VOUT
TP16M1.8VOUT
TP17M3.3VOUT
TP18M3.3VOUT
TP19VBat
TP20VBat
TP21VCCJTAG
TP22VCCJTAG
TP233.3V_SD
TP243.3V_SD
TP25USB-VBUS_R
TP26USB-VBUS_R
TP27ETH-VCC
TP28ETH-VCC
TP29Vbus
TP30Vbus


Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorConnected ToNotes

System Controller

U5
  • B2B
  • SD Port Expander
  • FTDI
  • Push button
  • DIP Switch
  • LEDs
Visit TE0703 CPLD Firmware for further information.

FTDI

U4
  • SC

EEPROM

U10
  • FTDI

Preprogrammed with AMD programmer license. Do not overwrite!

Oscillator

U6
  • FTDI


SD IO Port Expander

U2
  • SC
  • Via B2B connector JB1 to SoM
  • microSD Card J3

On board peripherals

Configuration and System Control Signals

Connector.Pin

Signal Name

Direction1)Description
S1S1IN

Push button 2)

S2.8CM1IN

DIP Switch 2)

S2.7CM0IN

DIP Switch 2)

S2.6JTAGENIN

DIP Switch 2)

S2.5MIO0IN

DIP Switch 2)

J5.2VCCIOAOUTSoM IO Bank supply 3)
J8.2VCCIOBOUTSoM IO Bank supply 3)
J9.2VCCIOCOUTSoM IO Bank supply 3)
J10.2VCCIODOUTSoM IO Bank supply 3)
J7.2VBATOUTModule battery power supply
J11.2EN_3.3V_SDINSD Card IO Voltage Select
J3.9SD_CDINSD Card socket Detect
JB3.54VBUS_V_ENINEnables USB Host Bus Voltage
JB2.17RESINOUTReset signal
JB1.27EN1OUTPower enable signal
JB1.29PGOODINOUTPower good and/or Boot mode select signal 2)
JB1.31MODEINOUTBoot mode select signal 2)
JB1.8NOSEQINOUT

Power Management and/or Select JTAG target on the SoM 2)

JB1.90PROGMODEINOUTSelect JTAG target on the SoM 2)
JB1.91 / JB1.86MIO14 / MIO15INOUTUART to SoM 2)
JB1.100 / 98MIO12 / MIO13INOUTOptional UART to SoM 2) 4)
J2A.X16 / J2A.X17X16 / X17INOUTOptional UART to SoM 2) 4)
J1A.A1 / J1A.A2MIO10-SCL / MIO10
MIO10-SDA / MIO11
INOUTI2C bus 2)

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) Firmware dependent. Refer to TE0703 CPLD - CC703S for further information.
3) Select 1.8V or 3.3V via jumper. Refer to 4 x 5 Module Integration Guide for further information.
4) Optional USB to UART available.

Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name/ Schematic NameConnector.PinDirection1)Notes
5VIN J13.1IN
5VIN J2A.A1 / J2A.A2OUT
3.3V

J1C.C31 / J2C.C31 /
JB1.2 /  JB1.4/  JB1.6/  JB1.14/  JB1.16 /
JB2.1 / JB2.3 / JB2.5 / JB2.7

OUT
USB-VBUSJ6.1 / J12.1 / JB3.56OUT

M1.8VOUT

JB1.40 / J11.1IN

M1.8VOUT

J5.3 / J8.3 / J9.3 / J10.3 /
J11.1
OUT

M3.3VOUT

JB2.9 / JB2.11IN

M3.3VOUT

J5.1 / J8.1 / J9.1 / J10.1 /
J1C.C32 / J2C.C32
OUT

VBAT

J7.2IN

VCCJTAG

JB2.92IN

ETH-VCC

JB1.13IN

ETH-VCC

J14A.1OUT
VCCIOAJB1.10 / JB1.12 / J1B.B1OUT

Selection via J5 2)

VCCIOB

JB2.2 / JB2.4 / J1B.B32

OUT

Selection via J8 2) 

VCCIOCJB2.6 / J2B.B32
OUT

Selection via J9 2)

VCCIODJB2.8 / JB2.10 / J2B.B1OUT

Selection via J10 2)

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) Select 1.8V or 3.3V via jumper. Refer to 4 x 5 Module Integration Guide for further information.

Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/down

Description

Notes
0---Configuration signal setup.See Configuration and System Control Signals.
15VIN5V (± 5 %)-Main Power supply.

Main module power supply. 3 A recommended. Power consumption depends mainly on design and cooling solution.

2M3.3VOUT / M1.8VOUT3.3 V (± 3 %) / 1.8 V (± 3 %)-

SoM generated voltages.

Availability signals operational module readyness to apply voltages to module banks.
Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz



Technical Specifications

Absolute Maximum Ratings *)

Power Rail / Schematic NameDescriptionMinMaxUnit
5VIN

Main input power supply

-0.360V
VCCIOA 1) 2)

Module power supply.

--V
VCCIOB 1) 2)Module power supply.--V
VCCIOC 1) 2)

Module and Carrier power supply.

-0.53.75V
VCCIOD 1) 2)Module power supply.--V
M1.8VOUT

Module and carrier power supply.

-0.31.95V
M3.3VOUT

Module and carrier power supply.

-0.3

3.6

V
VBAT 1)Module battery power supply.--V
VCCJTAG

JTAG Reference Voltage

-0.53.75V
ETH-VCCPower supply for ETH connection.--V

1) Module-dependent.
2) Voltage is intended to be supplied by M1.8VOUT or M3.3VOUT but can also be supplied externally via VG96 connection.

Absolute maximum ratings

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can differ depending on assembly variant. Voltage range should be mostly the same during variants (exceptions are possible, depending on custom request).

Temperature Range:

This carrier board is capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to 85 °C.

The Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Voltage Rails:

Power Rail / Schematic NameDescriptionMinMaxUnitNotes
5VIN

Main input power supply

4.755.25V
VCCIOA 1) 2)

Module power supply.

-

-

V


VCCIOB 1) 2)Module power supply.--V
VCCIOC 1) 2)

Module and Carrier power supply.

1.14

3.6

V


VCCIOD 1) 2)Module power supply.--V
M1.8VOUT

Module and carrier power supply.

1.7461.854V
M3.3VOUT

Module and carrier power supply.

3.2013.399V
VBAT 1)Module battery power supply.--V

VCCJTAG

JTAG Reference Voltage

1.143.6V
ETH-VCCPower supply for ETH connection.--V

1) Module-dependent.
2) Voltage is intended to be supplied by M1.8VOUT or M3.3VOUT but can also be supplied externally via VG96 connection.

Recommended operating conditions.

Physical Dimensions

  • Carrier size: 100 mm x 64.5 mm. Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm. 

PCB thickness: 1.64 mm ± 10 %.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0703 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

The hardware revision number is on the PCB adjacent to the module identifier, separated by a dash.

Board hardware revision number.

Hardware Revision History


DateRevisionChangesDocumentation Links
2023-0907

1. Changed DCDC EN6347QI ( U3 ) to MPM3860GQW-Z.
2. Changed load switch TPS27081ADDCR ( Q1 ) to MP5077GG-Z.
3. Changed clock SiT8008AI-73-XXS-12.000000E ( U6 ) to SiT8008BI-73-XXS-12.000000E.
4. Changed SD Card connector ( J3 ) from 504077-1891 to MEM2052-00-195-00-A.
5. Changed USB connector ( J12 ) from 629105150521 to 629105150921.
6. Changed pin header ( J7 ) from two pins to three pins and added jumper J20 .
7. Added testpoints TP1 ... TP30 .
8. Changed voltage rating for 1 uF capacitors ( C38 , C39 ) from 6.3 V to 16 V.
9. Changed voltage rating for 47 μF capacitor ( C48 ) from 6.3 V to 10 V and size from 1206 to 0805.
10. Changed tolerance for 22 μF capacitor ( C22 ) from 10 % to 20 % and size from 1206 to 0805.
11. Changed resistor values for 10 kOhm resistors ( R10 , R14 , R24 , R27 , R37 , R38 ) to 12 kOhm.
12. Changed resistor values from 4.7 kOhm to 5.1 kOhm for resistors R17 ... R20 .
13. Changed fiducials.
14. Named Q1 enable signal to " EN_3.3V_SD ".
15. Added decoupling capacitors:
15.1 C55 , C57 ... C61 for U5.
15.2 C62 ... C64 for J3.
15.3 C65 for U1.
16. Added pull-up resistor R43 for " USB_OC ".
17. Removed VG96 from BOM.
18. Removed S/N Track-it pad.
19. Added UKCA logo.
20. Changed address on silkscreen.
21. Updated components from library.
22. Updated revision history.
23. Updated documentation.
24. Updated power overview.

REV07 Documentation

PCN-20230705

2019-04

06 

1. microSD card connector ( J3 ) changed to industrial
2. changed PB ( S1 ) to industrial
3. replaced input power protection
4. added jumper ( J11 ) to select SD level shifter voltage on FPGA side
5. added power switch for SD level shifter supply voltages to ensure power sequenzing of level shifter
6. replaced R5 and VBUS capacitors, add 0Ohm resistors to OTG-ID
7. replaced jumpers by SMD versions, moved VBAT to other position
8. routing lenght of diff pairs B34_L17, B34_L15, B34_L21, B34_L13, B34_L10, B34_L20 changed
9. Replaced R31 by 953K and R25 by 147K

10. Added SD IO voltage selection jumper

11. TE0703-06 Under Voltage Protection Change. Replaced R31 by 953kOhm and R35 by 147kOhm

12. Set S/N Track-it pad not fitted

REV06 Documentation

PCN-20190826

PCN-20190104

2016-11

05

1. Added Jumpers for VCCIO Voltage strapping
2. Changed PWR connector to SMD type
3. Changed FTDI from FT2232HQ to FT2232H-56Q
4. Changed Micro SD card socket from SCHD3A0100 to Molex 104031-0811
5. Added series resistors 10K to FLED0, FLED1 and connect to CPLD
6. Added Track-it™ Traceability Pad
7. Remove R43
8. Replaced MagJack connector from WE7499111446 to TRJG4820G4NL

9. Changed micro-USB
10. U8 MP5010ADQ-LF-Z replaced to MP5010BDQ-LF-Z

REV05 Documentation

PCN-20161122

2014-12

04

Corrected FTDI EEPROM connection

REV04 Documentation

2014-08

03

Added VCCIO strapping resistors

REV03 Documentation

2013-12

02

First series boards

REV02 Documentation

-

01

Prototypes

REV01 Documentation
Hardware Revision History

 

Document Change History

Date

Revision

Contributors

Description

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  • Updated to TRM template v.4.2
  • Updated/Reworked the whole TRM content

2023-09-04  

v.45ED
  • Updated to REV07
2022-09-23v.44Mohsen Chamanbaz
  • Changing in the dip-switches table because of updating of CPLD firmware (CPLD Firmware REV03)
2019-10-07v.43Martin Rohrmüller
  • updated to REV06
  • updated to TRM style 2.12

2018-06-13

v.29

Ali Naseri
  • updating operating conditions
2017-02-07v.28John Hartfiel
  • Add DIP setting description
2017-11-09v.26John Hartfiel
  • add B2B connector section
2017-02-21

v.19

Jan Kumann
  • New block diagram.
2017-02-02

v.16

Jan Kumann
  • New board image with silk screen pin markings for VG96 connectors J1 and J2.
2016-12-22

v.14

Jan Kumann
  • Block diagram added.
2016-12-08
v.10

Jan Kumann

  • Document structure revised.
2016-12-05

v.5

John Hartfiel
  • Corrected Boot Mode table.
2016-09-06

v.1

Jan Kumann, John Hartfiel

  • Initial document.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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