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Table of Contents

Overview


The Trenz Electronic TE0703 Carrier Board is a base-board for 4 x 5 SoMs, which exposes the MIO- and the PS/PL-pins of the SoM to accessible connectors and provides a whole range of on-board-components to test and evaluate Trenz Electronic 4 x 5 SoMs.

See page "4 x 5 cm carriers" to get information about the SoM's supported by the TE0703 Carrier Board.

Refer to http://trenz.org/te0703-info for the current online version of this manual and other available documentation.

Key Features

  • On Board:
    • USB JTAG and UART interface (FTDI FT2232H), compatible with Xilinx tools (also with many other tools)
    • SDIO port expander with voltage-level translation
    • 4 x User LEDs
      • D1 and D2 are connected to the carrier controller, their function depends on the firmware
      • D3 and D4 are connected to the 4 x 5 module B2B connector pins, and are directly controlled by the module
    • 1 x User push button
      • Connected to "intelligent Carrier Controller (iCC)" and can be used as module reset button. Other usage possible, actual function depend on the code loaded into iCC.
    • 4A high efficiency power SoC DC-DC step-down converter with integrated inductor (Enpirion EN6347) for 3.3V power supply
    • 4 User DIP switches
      • Enable/disable update of the "intelligent Carrier Controller"
      • MIO0 (readable signal by iCC and module)
      • 2 "mode" bits
  • Interface:
    • Trenz 4 x 5 module socket (3 x Samtec LSHM series connectors
    • Micro SD card connector - Zynq SDIO0 bootable SD port
    • 2 x VG96 backplane connectors (mounting holes and solder pads)
    • Mini USB connector (USB JTAG and UART interface)
    • RJ45 GbE connector
    • USB host connector
  • Power:
    • Barrel jack for 5V power supply input
  • Dimension:
    • 100 mm x 64.5 mm

Block Diagram

TE0703 block diagram

Main Components

TExxxx main components
  1. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
  2. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
  3. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
  4. Micro SD card socket with detect switch, J3
  5. LED indicators D1 and D2
  6. Mini-USB type B connector, J4
  7. LED indicators D3 and D4
  8. Configuration DIP switches, S2 (see table under "DIP switches" section)
  9. User push button (Reset), S1
  10. External connector (VG96) placeholder, J1
  11. External connector (VG96) placeholder, J2
  12. VCCIO voltage selection jumper block, J5, J8, J9 and J10 (see "Power and Power-On Sequence" section)
  13. Trxcom 1000Base-T Gigabit RJ45 Magjack, J14 with 4 integrated LEDs
  14. USB type A receptacle, J6 (optional micro USB 2.0 type B receptacle available, J12)
  15. 5V power connector jack, J13
  16. SD IO voltage (VCCA) selection jumper J11

Initial Delivery State

Storage device name

Content

Notes

FTDI chip configuration EEPROM U10Xilinx License

Do not overwrite, see warning in related section

System Controller CPLD U5SC CPLD Firmware-
Initial delivery state of programmable devices on the module

Board is shipped in following configuration:

  • VCCIO voltage selection jumpers are all set to 1.8 V.
  • SD IO Voltage jumper J11 is set to 1.8V.
  • S1 switch configured as reset button in CPLD.
  • Two VG96 backplane connectors are not soldered to the board, but they are included in the package as separate components.
  • S2 DIP switches are configured as follows:

SwitchPositionDescription
S2-1ONMode control MC1.
S2-2ONFPGA access on module (need also S2-3 ON)

S2-3

ONFPGA access on module (need also S2-2 ON)
S2-4OFFBoot mode set to QSPI.
Initial delivery state DIP switches

Different delivery configurations are available upon request.

Configuration Signals

The configuration signals are managed by the CPLD and therefore Firmware dependet. Standart configuration is given below.

Control signal

Switch /Button/ LED /Pin

Signal Schematic NamesConnecte toFunctionalityNotes
Module  JTAG selectDip switche S2-2CM0SC CPLD pin 75

ON: Module JTAG access ( if S2-3 ON)

OFF: Module CPLD JTAG access ( if S2-3 ON)

TE0703 CPLD - CC703S#CC703S-JTAG
Module JTAG selectSC CPLD pin 104PROGMODEB2B JB1 pin 90Module JTAG select: Module CPLD high or SoC/FPGA JTAG low ; via CPLD firmware linked to CM0TE0703 CPLD - CC703S#CC703S-JTAG
Carrier CPLD JTAG enable

Dip switch S2-3

JTAGEN

SC CPLD pin 120

ON: SoM JTAG access

OFF: Carrier SC CPLD JTAG access

TE0703 CPLD - CC703S#CC703S-JTAG
Select boot modeDip switche S2-4MIO0

SC CPLD pin 94

and B2B JB1 pin 88

ON: Boot from SD Card

OFF: Boot from QSPI flash on module

TE0703 CPLD - CC703S#CC703S-BootMode
Boot Mode is also module dependent
Select boot modeSC CPLD pin 83

MODE

B2B JB1 pin 31SD-CARD (Zynq) or QSPI-Flash; via CPLD firmware linked to MIO0TE0703 CPLD - CC703S#CC703S-BootMode
Boot Mode is also module dependent
ResetS1S1SC CPLD pin114global resetTE0703 CPLD - CC703S#CC703S-Reset
ResetSC CPLD pin 119RESINB2B JB2 pin 17via CPLD firmware linked to S1TE0703 CPLD - CC703S#CC703S-Reset
Moduel enableSC CPLD pin 81

EN1

B2B JB1 pin 27Module power enablepulled up by CPLD
Disable CPLD power ManagementSC CPLD pin 78NOSEQB2B JB1 pin 8Disable CPLD power managementpulled up by CPLD
Disable Card detect pinDip switche S2-1

CM1

SC CPLD pin 76

ON: Force CD Pin to module to GND

OFF: Set CD Pin to module to SD CD Pin

TE0703 CPLD - CC703S#CC703S-SD
SD Card detectSD Card Socket J3 pin 9SD_CDSC CPLD pin93Low if Card detectedTE0703 CPLD - CC703S#CC703S-SD
SD SelectorSC CPLD pin 113SD_SELU2 pin 24FIXed to GND: Select SD Card  (CPLD SD port not used)TE0703 CPLD - CC703S not used
Boot process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the B2B connector: 

B2B ConnectorInterfacesI/O Signal CountNotes
JB1User IO48 single ended or 24 differentialAvailable on J1
I²C2MIO10, MIO11, available on J1
SD IO6-
primary UART2MIO14, MIO15; CPLD Firmware dependent
secondary UART2MIO12, MIO13; CPLD Firmware dependent
GbE PHY_MDIO8-
Control Signals7including MIO0 and MIO9; CPLD Firmware dependent
VBAT1-
JB2User IO36 single ended or 18 differentialAvailable on J1
USB OTG5Including USB-VBUS and VBUS_V_EN
JB3User IO66 single ended or 33 differentialAvailable on J2
LEDs2-
JTAG4-
Control Signal1Reset
General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors

Micro SD Card Socket

Micro SD card socket is connected to the B2B connector through a Texas Instruments TXS02612 SDIO port expander for voltage translation. The Micro SD card has 3.3V signal voltage level while most 4 x 5 modules use 1.8V for the SD card interface.

Connected ToSignal NameNotes
U5-93SD-CDManaged CPLD Firmware
JB1-28SD-DAT0-
JB1-26SD-CMD-
JB1-24SD-CCLK-
JB1-22SD-DAT1-
JB1-20SD-DAT2-
JB1-18SD-DAT3-
SD Card interface signals and connections


USB Interface

TE0703 board has two physical USB sockets:

  • J4 as mini-USB type B socket wired to the on-board FTDI FT2232H chip.
  • J6 as USB type A wired to B2B connector JB3 (USB transceiver used depends on the SoM model used). Instead of J6, a micro USB connector J12 can be assembled

USB ConnectorSignalConnected to
J4DL_NU4-7
DL_PU4-8
J6 or J12OTG-D_PJB3-48
OTG-D_NJB3-50
(J12 only)OTG-IDJB3-52
USB Signals

Ethernet 

On-board Ethernet jack J14 pins are routed to B2B connector JB1. Ethernet jack J14 LED signals PHY_LED1, PHY_LED2, PHYLED1R and PHYLED2R are all routed to System Controller CPLD bank 1.

Ethernet PHY connection

MagJackSignalB2B
J14A-2PHY_MDI0_PJB1-3
J14A-3PHY_MDI0_NJB1-5
J14A-4PHY_MDI1_PJB1-9
J14A-5PHY_MDI1_NJB1-11
J14A-6PHY_MDI2_PJB1-15
J14A-7PHY_MDI2_NJB1-17
J14A-8PHY_MDI3_PJB1-21
J14A-9PHY_MDI3_NJB1-23
J14BPHY_LED1U5-86
J14BPHY_LED1RU5-92

J14C

PHY_LED2U5-85
J14CPHY_LED2RU5-91
Ethernet Signals

External VG96 Connector I/Os

I/O signals connected to the B2B connector: 

B2B ConnectorInterfacesI/O Signal CountNotes
J1User IO48 single ended or 24 differentialFrom JB1 (group1)
User IO36 single ended or 18 differentialFrom JB3 (group2)
I²C2
J2User IO48 single ended or 24 differentialFrom JB2 (group4)
User IO18 single ended or 9 differentialFrom JB2 (group3)
CPLD User IO18 single endedIncluding UART 2 on X16, X17; CPLD Firmware dependent
General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors

On-board Peripherals

USB to JTAG and UART bridge

TE0703 has on-board USB JTAG and UART solution based on UART/FIFO controller from FTDI (U4). FTDI EEPROM is pre-programmed with license code to support Xilinx programming tools.

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

JTAG and UART signals along with some more FTDI IOs are routed to the CPLD. See CPLD Firmware TE0703 CPLD - CC703S#CC703S for further description.

Signal

B2B Connector Pin

Note
M_TCKU5-131CPLD Firmware dependent TE0703 CPLD - CC703S#CC703S, dependent on Dip switches linked to Module JTAG Port on JB2.
M_TDIU5-136
M_TDOU5-137
M_TMSU5-130
FT_B_TXU5-139CPLD Firmware dependent TE0703 CPLD - CC703S#CC703S, linked to Module primary UART on JB1.
FT_B_RXU5-138
ADBUS7U5-142CPLD Firmware dependent TE0703 CPLD - CC703S#CC703S, currently not used.
ADBUS4U5-143
ACBUS4U5-141
ACBUS5

U5-140

BDBUS2U5-133
BDBUS3U5-132
BDBUS4U5-128
BDBUS5U5-127
BDBUS6U5-126
BDBUS7U5-125
BCBUS0U5-122
BCBUS1U5-121
JTAG pins connection

CPLD

TE0703-06 has a Lattice LCMXO2-1200HC as a system controller. for further function description see Firmware TE0703 CPLD - CC703S#CC703S,

SD IO Levelshifter

SD IO levelshifter (U2) is used in congntion with jumper J11 to select the correct SD IO interface voltage of the SoM. 

I2C Repeater

For power squenz reasons the I2C bus is routed via a repater (U7) to to ensure no IOs of the SoM are driven before M3.3VOUT is up.

LEDs

There are four on-board LEDs. D3 and D4 are  connected to the B2B connector JB2 pins FLED1 and FLED2 respectively and can be read by CPLD firmware. See TE0703 CPLD - CC703S#CC703S-LED.

LEDColorSignalConnected toDescription
D1RedULED1U5-117FTDI UART receive activity.
D2GreenULED2U5-115FTDI UART transmit activity.
D3RedFLED1JB2-99Module LED, CPLD can read status via signal FL_0 connected via 10K.
D4GreenFLED2JB2-90Module LED, CPLD can read status via signal FL_1 connected via 10K.
On-board LEDs

DIP switches

DIP switch settings are CPLD Firmware dependent, default firmware:

SwitchONOFFNotes
S2-1Force CD Pin to module to GNDset CD Pin to module to SD CD PinTE0703 CPLD - CC703S#CC703S-SD
S2-2Module FPGA  JTAG access ( if S2-3 ON)Module CPLD JTAG access ( if S2-3 ON)TE0703 CPLD - CC703S#CC703S-JTAG
S2-3Module FPGA/CPLD  JTAG access (  depends on S2-3)Carrier CPLD  JTAG accessTE0703 CPLD - CC703S#CC703S-JTAG
S2-4 Boot from SD Card (set Pin to GND)Boot from QSPI flash on module (set Pin to VDD)

TE0703 CPLD - CC703S#CC703S-BootMode
Boot Mode also depends on module.

Dip-Switches

Mode status is displayed on TE0703 LEDs, see TE0703 CPLD - CC703S#CC703S-LED.

Jumper

TE0703-06 has 5 Voltage selection jumpers. Select 1.8V or 3.3V in accordenc of the attached module capabilities and your needs. Refer to the 4 x 5 Module Integration Guide for VCCIO voltages options.

Power RailJumper

1.8V

3.3VNotes
VCCIOAJ51-22-3-
VCCIOBJ81-22-3-
VCCIOCJ91-22-3-
VCCIODJ101-22-3-
VCCAJ111-22-3SD IO level shifter voltage selection (module side), compare with TRM of attached Module
Jumpers

TE0703 Jumper Settings

Take care of the VCCO voltage ranges of the  particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges.

It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM.

Power

Power supply with minimum current capability of 3A for system startup is recommended.

Power Supply

Single power supply with minimum current capability of 3A at 5V for system startup is recommended.

Power Consumption

Power Input PinMax Current
VIN (power connector jack J13)4A
Power Consumption

Typical power consumption for TE0703-05 + TE0715-01 module with SD micro card inserted, Ethernet connected and link up, system booted into Linux prompt and idling is 5V / 0.55A.

Power-On Sequence

It is not allowed to feed any voltage to any external I/O pin before there is no power indication on M3.3VOUT pins. Presence of 3.3V on B2B JB2 connector pins 9 and 11 indicates that module is properly powered up and ready.

If any of the VCCIOA, VCCIOB, VCCIOC or VCCIOD will be powered through external connectors J1 or J2, then corresponding VCCIO jumper should also be removed.

Power Rails

Power Rail Name

Connector-Pin

DirectionNotes
5VINJ13-1in5 V power input
VIN- -5 V power input after protection
3.3VJB1-2, 4, 6, 14, 16outGeneratet from VIN by DCDC U3,  constant 3.3V rail
M1.8VOUTJB1-40 in1.8V from Module.
M3.3VOUTJB2-9, 11in3.3V from Module.
VCCIOAJB1-10, 12outUse jumper J5  to source by M1.8VOUT or M3.3VOUT.
VCCIOBJB2-2 ,4outUse jumper J8  to source by M1.8VOUT or M3.3VOUT.
VCCIOCJB2-6outUse jumper J9  to source by M1.8VOUT or M3.3VOUT.

VCCIOD

JB2-8, 10outUse jumper J10  to source by M1.8VOUT or M3.3VOUT.
VCCA--SD IO leveshifter voltge on Module side. Use jumper J11 to source by M1.8VOUT or M3.3VOUT.
VCCJTAGJB2-92inJTAG reference voltage
USB-VBUS_RJ6-1 (J12-1)out5V USB, derived from VIN by power switch U1
Module power rails.

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz



Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference document

5VIN supply voltage

 -0.3

7

V

MP5010A, EN6347QI data sheet

Storage temperature

-40

+100

°C

ROHM Semiconductor SML-P11 Series datasheet

Recommended Operating Conditions

Parameter

MinMax

Units

Reference document

5VIN supply voltage

4.75

5.25

V

USB2.0 specification concerning 'VBUS' voltage
Operating temperature

-40

+85

°C

FTDI FT2232H datasheet
Assembly variants for higher storage temperature range are available on request.
Please check components datasheets for complete list of absolute maximum and recommended operating ratings.

Physical Dimensions

  • Board size:  100 mm ×  64.5 mm. Notice that the mini-USB jack on the left and ethernet RJ-45 jack on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106 mm. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8 mm

  • PCB thickness: 1.65 mm

  • Highest parts on the PCB are USB type A jack and ethernet RJ-45 jack, approximately 15 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.


Physical Dimension

Operating Temperature Ranges

The carrier board itself is capable to be operated at industrial grade temperature range.

Please check the operating temperature range of the mounted modules which determines the relevant operating temperature range of the overall system.

Weight

42g - Plain board.

13g - 2 x VG96 connectors.

Revision History

Currently Offered Variants 

Trenz shop TE0728 overview page
English pageGerman page
Trenz Electronic Shop Overview

Hardware Revision History

Date

Revision

Notes

PCN

Documents
2019-09-0206

Added SD IO voltage selection jumper

Further changes  see PCN.

PCN-20190104TE0703

2016-09-07

05

Added VCCIO Jumpers

PCN-20161122

TE0703-05

-

04

Corrected FTDI EEPROM connection

-

TE0703-04

-

03

Added VCCIO strapping resistors

-


-

02

First series boards

-


-

01

Prototypes

-


Hardware revision number is printed on the PCB board next to the module model number separated by the dash.


Document Change History

Date

Revision

Contributors

Description

Martin Rohrmüller

  • updated to REV06
  • updated to TRM style 2.12

2018-06-13

v.29

Ali Naseri
  • updating operating conditions
2017-02-07v.28John Hartfiel
  • Add DIP setting description
2017-11-09v.26John Hartfiel
  • add B2B connector section
2017-02-21

v.19

Jan Kumann
  • New block diagram.
2017-02-02

v.16

Jan Kumann
  • New board image with silk screen pin markings for VG96 connectors J1 and J2.
2016-12-22

v.14

Jan Kumann
  • Block diagram added.
2016-12-08
v.10

Jan Kumann

  • Document structure revised.
2016-12-05

v.5

John Hartfiel
  • Corrected Boot Mode table.
2016-09-06

v.1

Jan Kumann, John Hartfiel

  • Initial document.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.








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