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Table of Contents
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Overview
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Refer to "https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/TE0745" for downloadable version of this manual and the rest of available documentation. |
Block Diagram
Main Components
- Xilinx ZYNQ-7000 family SoC, U1
- ...
Key Features
- Xilinx Zynq Z-7030/Z-7035/Z-7045
- 1 GByte 32-Bit DDR3/L
- 32 MByte SPI Flash
- B2B Connectors 3 x 160 pins
- 250 I/O's, all HR and HP I/O
- 1 Gbit Ethernet PHY
- USB 2.0 OTG PHY
- 8 x GTX (7030: 4 GT)
- 2 GT Reference Clock inputs (7030: 1 REFCLK
- Reference clock input for PLL (optional)
- 2 x PLL outputs
- I2C
- 6 MIO
- RTC
- MAC Address EEPROM
I2C Address Map
Device | ||
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RTC | 0x6F | |
RTC RAM | 0x57 | |
MAC Address EEPROM | 0x53 | |
Si5338 PLL | 0x70 |
B2B connectors
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Technical Specifications
Absolute Maximum Ratings
Recommended Operating Conditions
Physical Dimensions
Module size: 52 mm × 76 mm. Please download the assembly diagram for exact numbers
Mating height with standard connectors: 4mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 3mm. Please download the step model for exact numbers
All dimensions are given in millimeters.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Weight
.. g - Plain module
.. g - Set of bolts and nuts
Revision History
Hardware Revision History
Date | Revision | Notes | Link to PCN | Documentation Link |
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2016-10-11 | 02 | Production release | TE0745-02 | |
2016-04-18 | 01 | Prototypes | TE0745-01 |
Hardware revision number is written on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributors | Description |
---|---|---|---|
2017-02-05 | Jan Kumann | Initial document. |
Disclaimer
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Overview
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