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Overview

The Trenz Electronic TE0745 is an industrial/commercial/extended grade module integrating a Xilinx Zynq SoC (XC7Z-030, XC7Z-035 or XC7Z-045), 1 GByte DDR3/L SDRAM, 32/64 MByte SPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.

Refer to http://trenz.org/te0745-info for the current online version of this manual and other available documentation.

Key Features

  • Industrial grade Xilinx Zynq SoC (XCZ7030, XC7Z035, XC7Z045)

    • 250 FPGA PL I/Os (120 LVDS pairs possible)
    • 17 PS MIOs on B2B connector available
  • Dual-core ARM Cortex-A9 MPCore™ with CoreSight™
  • 32 (2x16)-bit wide 1GB DDR3L SDRAM
  • 32/64 MByte QSPI Flash memory
  • 4 or 8 GTX transceiver lanes (XC7Z030 variant has 4)
  • 1 Gigabit Ethernet transceiver PHY
  • Two User LEDs
  • EEPROM for storing Ethernet MAC Address
  • Hi-speed USB 2.0 ULPI transceiver with full OTG support
  • Programmable quad clock generator
  • Temperature compensated RTC (real-time clock)
  • Board to Board (B2B)
    • Plug-on module with 3 × 160-pin high-speed connectors
  • Power Supply
    • 3.3 V
  • Others:
    • On-board high-efficiency DC-DC converters
    • System management
    • eFUSE bit-stream encryption
    • AES bit-stream encryption
    • Evenly-spread supply pins for good signal integrity
    • Rugged for shock and high vibration

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram


TE0745 block diagram

Main Components



TE0745 main components
  1. Xilinx Zynq XC7Z family SoC, U1
  2. Quad SPI Flash memory, U14
  3. Reference clock signal oscillator, U12
  4. Reference clock signal oscillator, U9
  5. 1 Gigabit Ethernet PHY, U7
  6. DDR3L SDRAM (8 Banks a 32 MWords, 16-bit word width), U3
  7. DDR3 memory termination regulator with buffered reference voltage VTTREF, U18
  8. Real-Time-Clock, U24
  9. level-shifting I2C bus repeater, U17
  10. Red LED, D2
  11. Green LED, D1
  12. DDR3L SDRAM (8 Banks a 32 MWords, 16-bit word width), U5
  13. 12A DC-DC PowerSoC (VCCINT), U4
  14. DC-DC regulator (MGTAVTT), U8
  15. DC-DC regulator  (MGTAUX), U6
  16. DC-DC regulator  (MGTAVCC), U11
  17. I2C Programmable Quad Clock Generator, U13
  18. Reference clock signal oscillator, U21
  19. B2B Connector, J3
  20. B2B Connector, J1
  21. B2B Connector, J2
  22. Quad SPI Flash memory, U14
  23. USB transceiver PHY , U32
  24. Reference clock signal oscillator, U33
  25. EEPROM for MAC address, U23
  26. System Controller CPLD, U2

Initial Delivery State

Storage device name

Content

Notes

EEPROM

User content, not programmed

Valid MAC Address from manufacturer.

SPI Flash OTP Area

not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Not programmed

-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-
Si5338 OTP NVMNot programmedOTP not re-programmable after delivery from factory
Initial delivery state of programmable devices on the module

Configuration Signals

BOOTMODE is connected to MIO4 and B2B Connector J2 (Pin 133) and BOOTMODE_1 is connected to MIO5 and System Controller CPLD and default high.

Boot Mode

BOOTMODE_1 (MIO5)

 BOOTMODE (MIO4)

Note

JTAG Boot mode

00

JTAG only is only  possible with other CPLD Firmware

----01not supported
QSPI10
SD Card11
Boot process.

Signal

B2BDirectionNote
RST_IN_NJ2-131InputLow-active Power-On reset pin, controls POR_B-signal (Bank 500 - C23)
PS_SRSTJ2-152InputLow-active PS system-reset pin of Zynq chip.
JTAG_ENJ1-148InputLow FPGA access, high CPLD access
Control Pins

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA Bank

Type

B2B ConnectorI/O Signal CountVoltage LevelNotes
12HRJ1

48 Diff (24 LVS pair),

2 Single ended

VCCIO_12
pins J1-54, J1-55		Voltage range 1.2V to 3.3V
13HRJ1

48 Diff (24 LVS pair),

2 Single ended

VCCIO_13
pins J1-112, J1-113		Voltage range 1.2V to 3.3V
33HPJ3

48 Diff (24 LVS pair),

2 Single ended

VCCIO_33
pins J3-115, J3-120		Voltage range 1.2V to 1.8V
34HPJ2

48 Diff (24 LVS pair),

2 Single ended

VCCIO_34
pins J2-29, J2-30		Voltage range 1.2V to 1.8V
35HPJ2

48 Diff (24 LVS pair),

2 Single ended

VCCIO_35
pins J2-87, J2-88		Voltage range 1.2V to 1.8V
500MIOJ251.8VMIO0, MIO12 ... MIO15, user configurable I/O's on B2B
501MIOJ3121.8VMIO40 ... MIO51, user configurable I/O's on B2B
General PL I/O to B2B connectors information

System Controller I/O Pins

Pin NameDirectionFunctionB2BDefault Configuration
JTAG_ENInputJTAG selectJ1-148

During normal operating mode the JTAG_EN pin should be in the low state for JTAG signals to be forwarded to the Zynq SoC.
If JTAG_EN pin is set to high or left open the JTAG signals are forwarded to the System Controller CPLD.

RST_IN_NInputResetJ2-131Low-active Power-On reset pin, controls POR_B-signal (bank 500, pin C23) of Zynq chip.
PS_SRSTInputResetJ2-152Low-active PS system-reset pin of Zynq chip.
BOOTMODEInputBoot modeJ2-133

Control line which sets in conjunction with signal 'BOOTMODE_1' connected to CPLD(BOOTMODE_1 default high)
the boot source of the Zynq chip. See section "Configuration Signals".

PWR_PL_OKInputPower goodJ2-135Indicates stable state of PL supply voltage (low-active) after power-up sequence.
PWR_PS_OKInputPower goodJ2-139Indicates stable state of PS supply voltage (low-active) after power-up sequence.
MIO0InputPS MIOJ2-137User I/O also connected to CPLD.
System Controller CPLD pins connection over B2B

JTAG Interface

JTAG interface access is provided through the SoC's PS configuration bank 0, it is connected to B2B connector J1.

JTAG Signal

B2B Connector

TMSJ1- 144
TDIJ1- 142
TDOJ1- 145
TCKJ1- 143
JTAG_ENJ1- 148
JTAG pins connection

I2C Interface

The I2C interface on B2B connector J2 has PS_3.3V as reference voltage and is connected to the Zynq SoC via voltage level translating (3.3V ↔ 1.8V) I2C bus repeater (U17).

SchematicB2BNotes
I2C_33_SCLJ2-1193.3V reference voltage
I2C_33_SDAJ2-1213.3V reference voltage
Pin assignment of the B2B I2C interface.

Following on-module I2C interface are connected to the same  I2C bus:

I2C Device I2C AddressNotes
Quad programmable PLL clock generator U16: pins 12 (SCL), 19 (SDA)0x70-
MAC Address EEPROM U23, pins 1 (SCL), 3 (SDA)0x53-
SC CPLD U2, bank 2, pins 16 (SDA), 17 (SCL)User programmable.-
RTC, U240x6F-
RTC RAM, U240x57-
MIO-pin assignment of the on-module I2C interface.


I2C bus is accessible from SoC over following MIO:

MIO PinSignal Schematic NameNotes
MIO 10I2C_SCL1.8V reference voltage
MIO 11I2C_SDA1.8V reference voltage
Module's I2C-Slave address overview.

MGT Lanes

LaneBankTypeSignal NameB2B PinNote
0112GTX

MGT_RX0_P

MGT_RX0_N

MGT_TX0_P

MGT_TX0_N

J3-50

J3-52

J3-51

J3-53


1112GTX

MGT_RX1_P

MGT_RX1_N

MGT_TX1_P

MGT_TX1_N

J3-56

J3-58

J3-57

J3-59


2112GTX

MGT_RX2_P

MGT_RX2_N

MGT_TX2_P

MGT_TX2_N

J3-62

J3-64

J3-63

J3-65


3112GTX

MGT_RX3_P

MGT_RX3_N

MGT_TX3_P

MGT_TX3_N

J3-68

J3-70

J3-69

J3-71


4111 1)GTX

MGT_RX4_P

MGT_RX4_N

MGT_TX4_P

MGT_TX4_N

J1-23

J1-21

J1-22

J1-20


5111 1)GTX

MGT_RX5_P

MGT_RX5_N

MGT_TX5_P

MGT_TX5_N

J1-17

J1-15

J1-16

J1-14


6111 1)GTX

MGT_RX6_P

MGT_RX6_N

MGT_TX6_P

MGT_TX6_N

J1-11

J1-9

J1-10

J1-8


7111 1)GTX

MGT_RX7_P

MGT_RX7_N

MGT_TX7_P

MGT_TX7_N

J1-5

J1-3

J1-4

J1-2


MGT connections to B2B connector

1) Note: MGT bank 111 not available at XC7Z030 Zynq SoC.

MIO Pins


MIO PinConnected toB2BNotes
MIO0CPLD and B2B J2-137J2Configurable, def. used for SD CD
MIO1...6

SPI_CS , SPI_DQ0... SPI_DQ3, SPI_SCK

-QSPI Flash
MIO7USB_RESET_N-10k pullup to PS_1.8V
MIO8Used for CPLD Status-10k pullup to PS_1.8V
MIO9ETH_PHY_RST_N-ETH PHY
MIO10....11SCL/SDA-I2C
MIO12...13-J2Configurable, def GPIO
MIO14...15UART
Configurable, def. used for UART
MIO16...27

ETH_TXCK, ETH_TXD0..3, ETH_TXCTL

ETH_RXCK, ETH_RXD0..3, ETH_RXCTL

-Ethernet Signals
MIO28...39

OTG_DATA4, OTG_DIR, OTG_STP, OTG_NXT,

OTG_DATA0...3, OTG_CLK, OTG_DATA5...7

-USB
MIO40...45MIO40..45J3Configurable, def. used for SD
MIO46...50-J3GPIO
MIO51I2C ResetJ3Configurable, def. used for I2C Reset
MIO52PHY_MDCJ3ETH PHY
MIO53PHY_MDIOJ3ETH PHY
MIOs pins

On-board Peripherals

Chip/InterfaceDesignatorNotes
Quad SPI Flash MemoryU14
DDR3 SDRAMU3, U5
RTCU24
EEPROMU23
System Controller CPLDU2
Ethernet PHYU7
USB ULPI PHYU32
Programmable PLL ClockU16
LEDsD1, D2
OscillatorsU21, U12, U33, U9
On board peripherals

Quad SPI Flash Memory

On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory 256/512 Mbit (32/64 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used. Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

MIO PinSchematicNotes
MIO1SPI-CS
MIO2SPI-DQ0/M0
MIO3SPI-DQ1/M1
MIO4SPI-DQ2/M2
MIO5SPI-DQ3/M3
MIO6SPI-SCK/M4
Quad SPI interface MIOs and pins

DDR3 SDRAM

The TE0745 SoM has two volatile Intelligent Memory 512 MByte DDR3L-1600 SDRAM IC for storing user application code and data. 

  • Part number: IM4G16D3FABG-125I
  • Supply voltage: 1.5V
  • Organization: 256M x 16 bits

DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing. The maximum possible speed for DDR3 SDRAM is 1600 Mb/s.

RTC

An temperature compensated is used as Real Time Clock (U24). Battery voltage must be supplied to the clock from the base board via pin 'VBAT_IN' (J1-146). Battery backed registers can be accessed over I2C bus at slave address mentioned in the table below. General purpose RAM of the RTC can be accessed at I2C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device.

The interrupt line 'RTC_INT' of the RTC is connected to System Controller CPLD bank 3 pin 4.

SchematicB2BI2C AddressDesignatorNotes

I2C_33_SCL

J2-1190x6FU24

I2C_33_SDA

J2-121
I2C Address for RTC

Programmable PLL Clock

There is a Silicon Labs I2C programmable quad PLL clock generator (U16) on-board. It's output frequencies can be programmed by using the I2C-bus with address 0x70.

A 25.00 MHz (U21) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Once running, the frequency and other parameters can be changed by programming the device using the I2C-bus connected between the Zynq module (master) and reference clock signal generator (slave).

U16 Pin
Signal Name / Description
Connected ToDirectionDefaultNote

IN1

CLKIN_P

B2B, J3-76Input

Reference input clock from base board.

IN2CLKIN_NB2B, J3-74Input

IN3

Reference input clock.

Oscillator U21, pin 3Input
25.000000 MHz oscillator, Si8008BI.

IN4

-GNDInput
I2C slave device address LSB (0x70 default address).

IN5

-

Not connected.Input
Not used.
IN6-GNDInput
Not used.

CLK0A

MGT_CLK1_P

Zynq Soc U1, pin U6OutputNot programmed

MGT bank 112 reference clock.

CLK0BMGT_CLK1_NZynq Soc U1, pin U5OutputNot programmed
CLK1ACLK1_PB2B, J3-80OutputNot programmedReference clock output to base board.
CLK1BCLK1_NB2B, J3-82OutputNot programmed
CLK2ACLK2_PB2B, J3-86OutputNot programmedReference clock output to base board.
CLK2BCLK2_PB2B, J3-88OutputNot programmed
CLK3A

MGT_CLK3_P

Zynq Soc U1, pin AA6OutputNot programmedMGT bank 111 reference clock.
CLK3BMGT_CLK3_NZynq Soc U1, pin AA6OutputNot programmed
Programmable quad PLL clock generator inputs and outputs.

System Controller CPLD

The System Controller CPLD (U2) is central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

For current CPLD Firmware description, check TE0745 CPLD

USB ULPI PHY

Hi-speed USB ULPI PHY (U32) is provided on the board. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U33).

MAC Address EEPROM

A serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. 

EEPROM

SchematicMIOI2C AddressDesignatorNotes

I2C_SCL

MIO100x53U23

I2C_SDA

MIO11
I2C address for EEPROM

Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided on the board. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2. 

SchematicB2BNotes
PHY_MDIO-Connected to MIO52
PHY_MDIO0+/ MDIO0-J2-120/122
PHY_MDIO1+/ MDIO1-J2-126/128
PHY_MDIO2+/ MDIO2-J2-132/134
PHY_MDIO3+/ MDIO3-J2-138/140
PHY_LED1J2-144
PHY_LED2J2-146
PHY_LED3J2-148
PHY_CLK125MJ2-150
PHY_MDC-Connected to MIO53
Ethernet PHY B2B connectors.

LEDs

SchematicColorConnected toActive levelNoteNote

D1

Green

System Controller CPLD (bank 3, pin 5)HighSystem main status LED, blinking indicates system activity

D2

Red

Zynq chip, bank 0 (config bank), 'DONE' pin

Low

Reflects inverted DONE signal. ON when FPGA is not configured, OFF as soon as PL is configured.

This LED remains OFF if System Controller CPLD can not power up the PL supply voltage.


On-board LEDs

Clock Sources

DesignatorSchematic NameFrequencyNote
U21-25.00 MHzQuad PLL clock generator U16, pin 3

U12

PS_CLK33.33 MHzBank 500 (MIO0 bank), pin B24
U33OTG-RCLK52.00 MHzUSB 2.0 transceiver PHY U32, pin 26
U9ETH_CLKIN25.00 MHzGigabit Ethernet PHY U7, pin 34
Osillators

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3.0 A for system startup is recommended.

Power Consumption

The maximum power consumption of a module mainly depends on the design which is running on the FPGA.

Power Input PinTypical Current
PL_VINTBD*
PS_VINTBD*
PS_3.3VTBD*
Power Consumption

* TBD - To Be Determined

For the lowest power consumption and highest efficiency of on board DC-DC regulators it is recommended to powering the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.

The on-board voltages of the TE0745 SoC module will be powered-up in order of a determined sequence after the external voltages 'PL_VIN', 'PS_VIN' and 'PS_3.3V' are available. All those power-rails can be powered up, with 3.3V power sources, also shared.

To avoid any damage to the module, check for stabilized on-board voltages should be carried out(i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.

Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.

It is important that all baseboard I/Os are tri-stated at power-on until the "Power Good"-signals 'PWR_PS_OK' (J2-139) and 'PWR_PL_OK' (J2-135) are high, meaning that all on-module voltages have become stable and module is properly powered up.

Power Distribution Dependencies

Power Distribution


Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row).

Power-On Sequence

The TE0745 SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DCDC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.

Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:


Power Sequency

The Enable-Signal 'EN_PL' is permanently logic high in standard SC-CPLD firmware. The "Power Good"-signals 'PWR_PS_OK' and 'PWR_PL_OK' (latter low-active, extern pull-up needed) are available B2B-connector J2 (pins J2-139, J2-135) and on the SC-CPLD.

Voltage Monitor Circuit

The voltages 'VCCPINT' and 'PS_1.8V' are monitored by the voltage monitor circuit U41, which generates the POR_B reset signal at Power-On. A manual reset is also possible by driving the MR-pin (available on J2-131 or SC-CPLD) to GND. Leave this pin unconnected or connect to VDD (PS_1.8V) when unused.


Voltage Monitor Circuit

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
PL_VIN

147, 149, 151, 153,
155, 157, 159

--Inputmodule supply voltage
PS_VIN-154, 156, 158-Inputmodule supply voltage
PS_3.3V-160-Inputmodule supply voltage
VCCIO1254, 55--Inputhigh range bank I/O voltage
VCCIO13112, 113--Inputhigh range bank I/O voltage
VCCIO33--115, 120Inputhigh performance bank I/O voltage
VCCIO34-29, 30-Inputhigh performance bank I/O voltage
VCCIO35-87, 88-Inputhigh performance bank I/O voltage
VBAT_IN146--InputRTC (battery-backed) supply voltage
PS_1.8V-130-Outputinternal 1.8V voltage level (Process System)
PL_1.8V--84,85Outputinternal 1.8V voltage level (FPGA)
Module power rails.

Bank Voltages

Bank          

Schematic Name

Voltage

Notes
0 (config)VCCIO_0

PL_1.8V, if R67 is equipped
PS_1.8V, if R68 is equipped

-
500 (MIO0)PS_1.8V 1.8V-
501 (MIO1)PS_1.8V1.8V-
502 (DDR3)1.35V1.35V-
12 HRVCCIO_12UserHR: 1.2V to 3.3V
13 HRVCCIO_13UserHR: 1.2V to 3.3V
33 HPVCCIO_33UserHP: 1.2V to 1.8V
Zynq SoC bank voltages.


Board to Board Connectors

5.2 x 7.6 cm SoM Kintex modules use three Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.
  • 3x REF-192552-02 (160-pins)
    • ST5 Mates with SS5

5.2 x 7.6 cm SoM Kintex carrier use three Samtec Razor Beam LP Socket Strip (SS5) on the top side.

  • 3x REF192552-01 (160-pins)
    • SS5 Mates with ST5

Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit
PL_VIN-0.35VTI TPS720 data sheet
PS_VIN-0.37VTI TPS82085 data sheet
PS_3.3V3.1353.465V

3.3V nominal ± 5%


VBAT supply voltage-16.0VISL12020MIRZ data sheet
PL IO bank supply voltage for HR I/O banks (VCCO)-0.53.6V-

PL IO bank supply voltage for HP I/O banks (VCCO)

-0.52.0V-
I/O input voltage for HR I/O banks-0.4VCCO_X+0.55V-
I/O input voltage for HP I/O banks-0.55VCCO_X+0.55V-
GT receiver (RXP/RXN) and transmitter (TXP/TXN)-0.51.26V-

Voltage on module JTAG pins

-0.33.6

V

MachX02 Family data sheet

Storage temperature

-40

+128

°C

Limits of ISL12020MIRZ RTC chip.
Storage temperature without the ISL12020MIRZ-55+100°CLimits of DDR3 memory chip.
PS absolute maximum ratings

Attention: PS_3.3V is directly connected to numerous on-board peripherals as supply and I/O voltage.

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
PL_VIN3.24.5V-TI TPS720 data sheet
PS_VIN3.1353.6V-CPLD data sheets
PS_3.3V3.1353.465V-3.3V nominal ± 5%
VBAT_IN supply voltage2.75.5V-ISL12020MIRZ data sheet

PL I/O bank supply voltage for HR
I/O banks (VCCO)

1.143.465V-Xilinx datasheet DS191

PL I/O bank supply voltage for HP
I/O banks (VCCO)

1.141.89V-Xilinx datasheet DS191
I/O input voltage for HR I/O banks-0.20VCCO_X+0.20V-

Xilinx datasheet DS191

I/O input voltage for HP I/O banks-0.20VCCO_X+0.20V

-

Xilinx datasheet DS191
GT receiver (RXP/RXN) and transmitter (TXP/TXN)(*)(*)V(*) Check datasheetXilinx datasheet DS191
Voltage on Module JTAG pins3.1353.6VJTAG signals forwarded to
Zynq module config bank 0		MachX02 Family Data Sheet
Recommended Operating Temperatur-40+85°C

Recommended operating conditions.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

  • Module size: 52 mm × 76 mm.  Please download the assembly diagram for exact numbers

  • Mating height with standard connectors: 4mm

  • PCB thickness: 1.6mm

  • Highest part on PCB: approx. 3mm. Please download the step model for exact numbers

Physical Dimension

Currently Offered Variants 

Trenz shop TE0745 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

Product changes can be seen in TE0745 Product Change Notifications page.  

Date

Revision

Changes

Documentation Link

2016-11-0202
  • MAC EEPROM Address patch fixed on PCB
REV02
2016-05-1201
  • Prototypes
REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.


Document Change History

DateRevisionContributorDescription

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Ambiguous method overloading for method jdk.proxy241.$Proxy3496#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]

Error rendering macro 'page-info'

Ambiguous method overloading for method jdk.proxy241.$Proxy3496#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]

  • Corrected limits for operating conditions of  PL/PS_VIN
  • Corrected MIO section (UARt)

v.102

Martin Rohrmüller

  • Corrected key features power supply voltage

v.98

John Hartfiel

  • typographical correction
  • block diagram correction

2020-02-18

v.94John Hartfiel
  • correction power rails
2019-11-19v.93John Hartfiel
  • correction key features
2019-10-10v.92Pedram Babakhani

  • document style update

  • description bug fix
2019-03-01v.83

Pedram Babakhani

  • Add power note
2018-04-11v.81John Hartfiel
  • correction PDF link
2017-11-14v.80John Hartfiel
  • Update B2B Section
2017-11-13v.79Ali Naseri, Jan Kumann, John Hartfiel
  • First TRM release

--

all

Error rendering macro 'page-info'

Ambiguous method overloading for method jdk.proxy241.$Proxy3496#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]

  • --
Document change history.

Disclaimer

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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

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To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


Error rendering macro 'page-info'

Ambiguous method overloading for method jdk.proxy241.$Proxy3496#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]




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