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  • Xilinx Zynq UltraScale+ MPSoC (XCZU2CG / XCZU2EG, XCZU3CG / XCZU3EG or XCZU4CG / XCZU4EV)
    • Quad-core or dual-core Cortex-A53 64-bit ARM v8 application processing unit (APU) (depends on assembly variant CG,EG,EV)
    • Dual Cortex-R5 32-bit ARM v7 real-time processing unit (RPU)
    • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:

      • PCI Express® interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 132 x HP PL I/Os (3 banks)
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
  • 2 GByte DDR4 SDRAM, 32bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 4 8 GByte eMMC
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
  • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips
  • All power supplies on board
  • Size: 50 x 40 mm

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  1. Xilinx Zynq UltraScale+ MPSoC, U1
  2. 1.8V, 512 Mbit QSPI flash memory, U7
  3. 1.8V, 512 Mbit QSPI flash memory, U17
  4. 8 Gbit (512 x 16) DDR4 SDRAM, U2
  5. 8 Gbit (512 x 16) DDR4 SDRAM, U3
  6. Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
  7. 6A PowerSoC DC-DC converter (PL_VCCINT, 0.85V), U5
  8. B2B connector Samtec Razor Beam™ LSHM-150, JM1
  9. B2B connector Samtec Razor Beam™ LSHM-150, JM2
  10. B2B connector Samtec Razor Beam™ LSHM-130, JM3
  11. 4 8 GByte eMMC memory, U6
  12. Lattice Semiconductor MachXO2 System Controller CPLD, U21
  13. I2C programmable, any  frequency , any output  quad clock generator, U10
  14. Highly integrated full featured hi-speed USB 2.0 ULPItransceiver, U18
  15. LED D1(Red) Done Pin
  16. LED D2 (Green) CPLD Status, User LED
  17. LED D3 (Red) PS Error
  18. LED D4 (Green) PS Error Status

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eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips MTFC4GACAJCNIS21ES08G-4M IT JCLI (FLASH - NAND Speicher-IC 32 (64 Gb (4 G x 81) MMC ) is used.

DDR4 Memory

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Two quad SPI compatible serial bus flash N25Q512A flash MT25QU512ABB8E12-0SIT memory chips are provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

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  • Updated according to PCN-20190110: eMMC, QSPI-Flash

v.78Martin Rohrmüller
  • Corrected PJTAG Mio Pin29 in table 8

2019-05-08

v.77John Hartfiel
  • Corrected EEPROM I2C Address
  • Correction USB PHY connection

2018-11-12

v.74
John Hartfiel
  • update boot section

2018-08-30

v.73John Hartfiel
  • typo correction
  • update CPLD section
  • add LEDs to component list
  • add 3D picture of REV03 instead of REV01 picture

2018-07-12

v.69Ali Naseri
  • Update PCB Rev03

2018-06-11

v.61John Hartfiel
  • Rework chapter currently available products
  • add PJTAG note to MIOtable
2018-03-12v.54
  • Correction Power Rail Section
2017-11-20v.51John Hartfiel
  • Correction Default MIO Configuration Table
2017-11-10v.50John Hartfiel
  • Replace B2B connector section
2017-10-18v.49John Hartfiel
  • add eMMC section
2017-09-25v.48John Hartfiel
  • Correction in the "Board to Board (B2B) I/Os" section
  • Update in the "Variants Currently In Production" section
2017-09-18v.47John Hartfiel
  • Update PS MIO table
2017-08-30v.46Jan Kumann
  • MGT lanes section added.

2017-08-24

v.36

John Hartfiel
  • Correction in the  "Key Features" section.
2017-08-21v.34John Hartfiel
  • "Initial delivery state" section updated.
2017-08-21v.33Jan Kumann
  • HW revision 02 block diagram added.
  • Power distribution and power-on sequence diagram added.
  • System Controller CPLD and DDR4 SDRAM sections added.
  • TRM update to the template revision 1.6
  • Weight section removed.
  • Few minor corrections.



2017-08-18


v.7

John Hartfiel
  • Style changes
  • Updated "Boot Mode", "HW Revision History", "Variants Currently In Production" sections
  • Correction of MIO SD Pin-out, System Controller chapter
  • Update and new sub-sections on "On Board Peripherals and Interfaces" sections

2017-08-07

v.5

Jan Kumann

  • Initial version
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