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AM
Excerpt

Scroll Table Layout
orientationlandscape
sortDirectionASC
repeatTableHeadersdefault
widths100%
sortByColumn1
tableStylingconfluence
sortEnabledfalse
cellHighlightingtrue


TE
0803
0950-
03
01-5DI21-AS

1 23456


7

8 9


10



11



12



131415





























16































17



































18




































Module type

TE
Trenz Electronic
Trenz Electronic
Andromeda
Module name
08020803080608070808081308170818082008210823083508650010
0950




























Module Revision
01

PCB Revision 1 (initial)

Device name

Series / Cores
ECMPH













VE-2VC-2VM-2VP-2VH-2













Identifier
12345679
ABDF
ZU+ZU1ZU2ZU3ZU4ZU5ZU6ZU7ZU9ZU11ZU15ZU17ZU19KMNPJRXYSTUV

ZU+ RFSoC

ZU21ZU25ZU27ZU28ZU29ZU39ZU42ZU43ZU46ZU47ZU48ZU49PS and engine type and speed gradeABDFGHKMNPRSTXYCG-1EG-1EV-1CG-2EG-2EV-2CG-3EG-3EV-3CG-1LEG-1LEV-1LCG-2LDR-1
GHKLMNP

175

200

210

220

230260280----Xilinx Versal AI Edge Series (VE)

135

150

170

180

190

260280----Xilinx Versal AI Core Series (VC)

110

130

140

150

180

220230250290--Xilinx Versal Prime Series (VM)

100

105

110

120

140

150155170180250280Xilinx Versal Premium Series (VP)

152

154

158

170

180

------Xilinx Versal HBM Series (VH)
Speedgrade, Voltage, Static Screen
ABDFGHKLMN










1LL1LS1ML1MS2HS2LL2LS2ML2MS3HS
DR-2











Temp range (Tstr. abs. = -65°C to +150°C)
XC  (Standard-Grade)XA  (Automotive-Grade)XQ  (Defense-Grade)
Extended (0/+100°C)Industrial
(–40/+100°C)		Automotive (–40/125°C)Industrial (I)Industrial Military
EIQ (R - Obsolete)TNM
DDR memory (
TE0803/0807/0808
TE0950: 4x
; TE0820/0821: 2x
)
0Not populated
1

TE0803/0807/0808: 2 GByte

Commercial4Gbit - NT5AD256M16D4-HR #29165TE0820/0821: 1 GByte2
---
1TE0950
TE0803/0807/0808/0812/0813/0817/0818
: 4 GByteIndustrial
8Gbit
8 GBit -
K4A8G165WB
K4A8G165WC-
BIRC#28375
BITDTCV#30211
2TE0950
TE0820/0821: 2 GByteTE0865:  4 GByte + ECC (PS) + 4 GByte (PL)AM0010: 4 GByte + ECC3TE0803/0807/0808: 8 GByteCommercial16Gbit (2 die) - K4AAG165WB-MCRC0CV#27787TE0820/0821: 4 GByte4TE0803/0807/0808/0865
: 8 GByteIndustrial16Gbit -
MT40A1G16RC
MT40A1G16TB-062E IT:
BTE0820: 4 GByte5TE0803/0807/0808: 4 GByteAutomotive8Gbit - MT40A512M16JY-083E AAT:B#30246TE0820/0821: 2 GByte6TE0803/0807/0808: 8 GByteIndustrial16Gbit (2 die) - H5ANAG6NCMR-XNI#30673TE0820/0821: 4 GByte7TE0813/TE0817/TE0818: 4 GByteIndustrial8GBit -  IS43QR16512A-083TBLI#307148

TE0803/0807/0808/0813/0817/0818: 4 GByte

TE0820: 2 GByte

Industrial8 GBit - K4A8G165WC-BITDTCV#30211UTE0802/0823: 1 GByteIndustrial8Gbit - IS43LQ32256A-062BLI (LPDDR4)#29797VTE0802/0823: 1 GByteCommercial8Gbit - K4F8E304HB-MGCJ (LPDDR4)#28217XDDR SODIMM SocketYIC Socket (IC Debug Holder)Flash memory (2x for all modules except TE0802)
F
#30258
#32484

Flash memory (QSPI 2x or OSPI) 
-Not present
---
0Not populated
---
1
TE0803/0807/0808/0813/0817/0818/0820/0821/0823/0865: 128MByte
TE0950: 128 MByte, QSPI dual parallel 
Industrial512Mbit - MT25QU512ABB8E12-0SIT#29292
AM0010: 128MByte
2
TE0802/TE0803/0807/0808/0820/0821/0823: 64MByteIndustrial256Mbit - MT25QL256ABA8E12-1SIT#28856
TE0950: 256 MByte, OSPIIndustrial2Gbit - MT35XU02GCBA1G12-0SIT
#33972
Other options (Connectors, custom options)
ModuleVariationDescription
TE0950AFPGA is preproduction Die. Standard assembly option with eMMC: 32 GByte - SDINBDG4-32G-XI2 - Industrial - #31139
CStandard assembly option (production die) with eMMC: 32 GByte - SDINBDG4-32G-XI2 - Industrial - #31139.
3TE0803/0807/0808/0820/0821/0823: 256MByteIndustrial1Gbit - MT25QU01GBBB8E12-0SIT#282644TE0803/0807/0808/0820/0821/0823: 512MByte.Industrial2Gbit - MT25QU02GCBB8E12-0SIT#282865TE0803/0807/0808/0820/0821/0823: 64MByteAutomotive256Mbit - MT25QU256ABA8E12-0AAT#30245

6

TE0818/TE0830: 128MByteExtended512MBit - IS25WP512M-RHLE (not supported)#294237TE0812: 256MByte
Industrial1Gbit - MT25QL01GBBB8E12-0SIT
#299928TE0812: 256MByteAutomotive1Gbit - MT25QL01GBBB8E12-0AUT#323639TE0812: 128MByteIndustrial512Mbit - MT25QL512ABB8E12-0SIT#28934eMMC (for TE0820/0821/0823)-Not present (for TE0803/07/08/13/17/18)---0Not populated (for TE0820/0821/0823)---FTE00820/0821/0823: 8 GByte Industrial8GByte - IS21ES08G-JCLI#29169 (EOL)
GTE00820/0821/0823: 8 GByteCommercial8GByte - KLM8G1GETF-B041#28669 (NRND)HTE00820/0821/0823/0812: 32 GByte32GByte - ????KTE00820/0821/0823: 64 GByteIndustrial64GByte - IS21ES64G-JCLI#29799MTE00820/0821/0823/0865/AM0010: 8 GByte Industrial8GByte - SDINBDG4-8G-XI2#31133NTE0812: 64 GByteIndustrial32GByte - SDINBDG4-32G-XI2#31139PTE00820/0821/0823/AM0010: 64 GByteIndustrial64GByte - SDINBDG4-64G-XI2#31140Other options (Connectors, custom options)ModuleVariationDescriptionAllAStandard connector heightLLow profile connector heightCStandard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)DLow profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)...Custom assembly variant, look additional table below

Additional options
BlankNo extra options
SStarter Kit
KWith heat spreader
PPrototype
Z
DCDC converter MUN3CAD03-SE instead of TPS82085SIL or MUN12AD03-SE instead of TPS82130SILR (depending on which regulator is used in the original design)
...Custom assembly variant, look additional table below 


Other assembly variations (position

17)ModuleVariationDescriptionTE0803AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220

L

Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017RCustom: standard hight connectors, R14 - 487k (PS_1V8 = 3.3V), U6 - SIT8008BI-71-33E-25.000000E, U32 - SiT8008BI-71-33E-33.333333E, U28 DNP, C81 DNPCB2B connectors: standard profile , FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationXCustom: standard hight connectors, U41 → SBAS70-04LT1GTE0807AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationXB2B connectors: standard profile, U41 → SBAS70-04LT1GTE0808AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationXB2B connectors: standard profile, U41 → SBAS70-04LT1GTE0812

A

Space grade modelBTest modelTE0820AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modificationIB2B connectors: standard profile, Ethernet PHY  U8 - 88E1512-A0-NNP2I000 DNP, no screws/spacersTE0821AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125TE0823AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903, HyperFlash/HyperRAM DNPCStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modificationDB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125TE0830AStandard assembly option PICMG ASP connectorsTE0850AStandard assembly optionBWithout FANCLanes SATA_R_SL, SATA_R_SCL disconnected from J1. Clock CK (U14/U73) connected to J1 TEB0911AStandard assembly option

Other assembly variations (position 18)

Variant with MUN3CAD03-SE instead TPS82085SIL
ModuleVariationDescription
TE0803IFPGA supplied by customer
TE0820TFPGA supplied by customer
JWithout screws, spacers
Z