Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

Children Display

Document Change History

daterevisionauthorsdescription
2013-09-06

Sergio PavesiFabio De Riccardis

Release
 

All

Overview

The TE0320 is an industrial-grade FPGA micromodule integrating a leading-edge Xilinx Spartan-3A DSP FPGA, a USB 2.0 microcontroller, 32-bit wide 128 MByte DDR RAM, 4 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.
All this on a tiny footprint, smaller than a credit card, at the most competitive price. Hardware and software development environment as well as reference designs are available at: www.trenz-electronic.de.
 

Sample Applications

  • Cryptographic hardware module
  • Digital signal processing
  • Embedded educational platform
  • Embedded industrial OEM platform
  • Embedded system design
  • Emulation platforms
  • FPGA graphics
  • Image processing
  • IP (intellectual property) cores
  • Low-power design
  • Parallel processing
  • Rapid prototyping
  • Reconfigurable computing
  • System-on-Chip (SoC) development

Key Features

  • Industrial-grade Xilinx Spartan-3A DSP FPGA module (1800 k gates or 3400 k gates)
  • USB 2.0 (Hi-Speed USB) interface with a signalling bit rate of up to 480 Mbit/s
  • 32-bit wide 1 Gbit DDR SDRAM
  • FPGA configuration through:
  • JTAG (B2B connector, pin header)
  • SPI Flash memory
  • Large SPI Flash memory (for configuration and operation) accessible through:
  • B2B connector (SPI direct)
  • FPGA JTAG port (SPI indirect)
  • USB bus (Firmware Upgrade Tool)
  • On-board 100 MHz oscillator for high performance
  • On-board 24 MHz oscillator available to user
  • 3 on-board high-power, high-efficiency, switch-mode DC-DC converters capable of 3 A each
  • Power supply range: 4.0 - 7.0 V
  • Power supply via USB or B2B (carrier board)
  • 4 LEDs, 2 push buttons, 8 DIP switches.
  • Plug-on module with 2 female 1.27 mm pitch header connectors
  • 109 FPGA I/O pins (+ 10 dual-purpose pins) available on B2B connectors
  • Evenly spread supply pins for good signal integrity
  • Assembly options for cost or performance optimization available on request

 

Scroll pdf title
titleTE0320, top view
Image Removed
Scroll pdf title
titleTE0320, bottom view.
Image Removed
TE0320, top view.TE0320, bottom view.

 

...