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Table of Contents

Table of Contents

Overview

The carrier board TEB0745 was especially designed and developed for the use of Trenz Electronic module TE0745. 

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Notes :

Key Features

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • Module: Form factor 20 cm x 23,1 cm
    • Trenz Electronic Module TE0745
    • Temperature: -40 to 85 °C
  • On Board: TE0745 Module Socket (3 x Samtec connectors)
    • 24V power supply
    over ARKZ950/2 connecting
    • terminal
    • 1 x EMI Network Filter
    • 3 x Variable Step Down Regulator Module (VDRM) with head sink
    • 2 x Synchronous Buck Regulator
    • 2 x Button (User / Reset)
    • 2 x LED (Green)
  • Interfaces:
    • 1 x XMOD (TE0790) Pin Header (JTAG / UART)
    • 1 x Pin Header (JTAG)
    • 1 x microSD connector
    • 1 x RJ45 Ethernet connector
    • 1 x USB Host Connector
    • 8 x SFP-Connector
    • 6 x Pin Header 50 pol. (FPGA Bank I/O's and Power)
    • 6 x Pin Header 12 pol. (FPGA Bank I/O's and Power)
    • 1 x battery holder
    • 2 x DIP Switch Array (VCC_HR_B / Modi)
  • 2 x Button (User / Reset)
  • 2 x LED (Green)Dimension: 200 mm x 231 mm

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx TEB0745 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTExxxx TEB0745 main components


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  1. SFP+ Connector, J4 J6 J8 J10 J13 J15 J18 J20
  2. Board to Board Connector (B2B), J1 J2 J3
  3. RJ45 Gigabit Ethernet connector, J22
  4. SD card connector, J16
  5. USB connector, J41
  6. Push Button, S2 S3
  7. SDIO port expander, U15
  8. Power distribution switch, U4
  9. Battery holder, B1
  10. Mag I3C power, U26 U12 U5
  11. Push bottun switch, S1 S4
  12. Buck regulator, U6 U7
  13. I2C EEPROM, U33
  14. Low voltage chanel I2C switch, U16
  15. Overvoltage, undervoltage, reversesupply protection controller, U13
  16. EMI suppression filter, U29
  17. JTAG interface, J12
  18. Power jack, J31
  19. 8bit IO expandor for I2C bus, U18 U25
  20. Pin Headers J23...26 (Not Assembled)
  21. Pin Headers J27-J28-J32-J36 (Not Assembled)
  22. Pin Headers J37...40 (Not Assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Quad SPI Flash...

Storage device name

Content

Notes

EEPROMDDR3 SDRAMEUI-64 number programmed

Can be used for MAC



Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleBoot process.

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MODE Signal State

ConnectConnected toB2BStatusBoot Mode

BOOTMODE

S1J2-133OpenQSPI
ShortSD Card


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titleReset process.

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Schematic

Signal
Connected toB2BNote
PS_SRST
RST_IN_N

Push Button, S2

J2-
152
131
PS
Low Active Reset
RST_INJ2-131

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

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onnected
B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 13

48 singel ended, 24 Differential

2 singel ended

C
Connected to Bank 12
JTAG Interface5 single endedTCK, TDI, TMS, TDO, JTAG_EN
SFP+ Connector8 Diff
SPF0
SPF4....7_RX_N/P ,
SPF0
SPF4....7_TX_N/P
J2

Ethernet PHY4 Differential
2 single endedPHY_LED0...1
USB1 DifferentialOTG_N/P
Control Signals3 single endedPS_SRST, BOOTMODE, RST_IN_N
Power Control Signal2 single endedPWR_PS_OK, PWR_PL_OK
I2C Bus2 single endedI2C_SDA, I2C_SCL
User I/O4 single endedMIO12...15

J3


User I/O
20
6 Single ended
, 10 differential
Connected to Bank 35
34 single ended, 17 differentialConnected to Bankd 33
Ethernet 14 single ended, 2 differentialETH_CTREF , ETH_TD+, ETH_TD- , ETH_RD+, ETH_RD-, ETH_LED1, ETH_LED2, ETH_LED3
Ethernet 24 single ended, 2 differentialETH_CTREF , ETH_TD+, ETH_TD- , ETH_RD+, ETH_RD-, ETH_LED1, ETH_LED2, ETH_LED3

...

MIO46...51
SD Card Connector6 Single endedSD_CLK, SD_CMD, SD_DAT0...3 (MIO40...45)
SFP+ Connector8 DifferentialSPF0....3_RX_N/P , SPF0....3_TX_N/P


XMOD Pin Header

JTAG access to the TEB0745 SoM is available through B2B connector JB1 and JB2. JTAG_EN is connected to J1-138, JTAG_EN can be activated through DIP Switch S1-2JTAG access to the TExxxx SoM through B2B connector JMX.

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Designator
JTAG Signal

Connected to

B2B

Connector

Pin

TMS
XMOD Header JB1
TDI
Note
TDO
A
TCKJTAG_EN

MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO15J2-129JB1-3UART TX - Input to the module
BMIO14J2-127JB1-7UART RX - Output of the module
CTCKJ1-143JB1-4JTAG interface signal
DTDOJ1-145JB1-8JTAG interface signal
FTDIJ1-142JB1-10JTAG interface signal
HTMSJ1-144JB1-12

JTAG interface signal

GRST_IN_NJ2-131JB1-11RESET will be connected to Push Button on JTAG Programmer


There is a DIP switch, S2, on TE0790 adapter which must be set as following.

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DIP Switch,S2DefaultDescription
1ONUpdate Mode JTAG access to SC CPLD only
2OFFMust be always in OFF state.
3OFFVIO is supplied from Module
4ON3.3V  from XMOD


SFP+ Connectors

The TEB0745 is equipped with 8 SFP+ Connectors, 

...

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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anchorTable_OBP_MIOs
titleMIOs pins

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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Designator
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PinConnected to 
Chip/Interface
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
SFP+ , J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
TD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TX FAULTIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
TX DISABLE IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF2 IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
LOSIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL


SD Card Socket

Power supply voltage for SD card holder is 3.3V.

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anchorTable_OBP_RTC
titleI2C interface MIOs and pins

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anchorTable_OBP_I2C_RTC
titleI2C Address for RTC

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anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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titleOn-board LEDsSD card interface MIOs and pins

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Schematic
Signals
Color
Connected to
Active LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

B2BNotes
SD_CLKMIO40J3-150
SD_CMDMIO41J3-152
SD_DAT0MIO42J3-154
SD_DAT1MIO43J3-156
SD_DAT2MIO44J3-158
SD_DAT3MIO45J3-160


RJ45 Connector

Ethernet Socket is connected to Board to Board (B2B)  JM2.

Scroll Title
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titleLAN Transformer
Scroll Title
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titleEthernet PHY to Zynq SoC connections

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Bank

Signal
Name
ETH1
B2B
ETH2Signal Description

CAN Transceiver

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anchorTable_OBP_CAN
titleCAN Tranciever interface MIOs

...

Notes
PHY_MDIO0_PJ2-120
PHY_MDIO_NJ2-122
PHY_MDIO1_PJ2-126
PHY_MDIO1_NJ2-128
PHY_MDIO2_PJ2-132
PHY_MDIO2_NJ2-134
PHY_MDIO3_PJ2-138
PHY_MDIO3_NJ2-140
PHY_LED0J2-144
PHY_LED1J2-146


Test Points

Scroll Title
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titleTest Points Information

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Scroll Title
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titleOsillators

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Designator

Test Point

Description
Signals
Frequency

B2B Connector

Note
Notes
MHz
TP 1
MHz
5V
KHz

...

-

...

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
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Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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anchorTable_PWR_PC
titlePower Consumption

...

* TBD - To Be Determined

Power Distribution Dependencies

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anchorFigure_PWR_PD
titlePower Distribution

TP 2VBAT_INJ1-146
TP 3VCCIO18VJ2- J3
TP 4VCC_HR_BJ1
TP 5-9GND-
TP 10PS_1.8VJ2
TP 11VCC_HR_BJ1
TP 123.3VJ1- J2
TP 13--
TP 14--
TP 15PWR_PL_OKJ2- 135
TP 16PWR_PS_OKJ2-139
TP 1724V_FUSED-
TP 183.3V_SFP-


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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Power-On Sequence

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anchorFigure_PWR_PS
titlePower Sequency
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Scroll Title
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titleVoltage Monitor CircuitOn board peripherals

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Power Rails

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titleModule power rails.

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

...

Chip/InterfaceDesignatorNotes
EEPROMU33

DIP Switches

S1, S4
I2C SwitchU16
I/O ExpanderU18...U25
Push ButtonsS2, S3
LEDsD1, D5


EEPROM

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titleZynq SoC bank voltages.I2C EEPROM interface MIOs and pins

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Bank          
MIO PinSchematic
Name
Voltage
B2BNotes

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MIO10I2C_SCLJ2-119
MIO11I2C_SDAJ2-121



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titleI2C address for EEPROM

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I2C DeviceDesignatorI2C AddressNotes
EEPROMU330x51


DIP Switches

There are two DIP Switches S1,S4.

Scroll Title
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titleDIP Switch S1

use "include page" macro and link to the general B2B connector page of the module series,

...

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

  • 3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

    Operating Temperature: -??°C ~ ??°C
    Current Rating: ??A per ContactNumber of Positions: ??
    Number of Rows: ??

Technical Specifications

Absolute Maximum Ratings

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titlePS absolute maximum ratings

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Symbols
Designator
DescriptionMinMaxUnitVVVVVVVV

Recommended Operating Conditions

...

Connected toB2BNote
S1-ABootModeJ2-133
S1-BJTAG_ENJ1-148
S1-C-

S1-DPS_SWJ2-123


VCC_HR_B voltage can be selected using DIP Switch S4 .

Scroll Title
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titleRecommended operating conditions.DIP Switch S4

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ParameterMinMaxUnitsReference Document
VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.

Physical Dimensions

  • Module size: ?? mm × ?? mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

...

hiddentrue
idComments

In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

S4-1S4-2S4-3S4-4Power VCC_HR_BNotes
OFFOFFOFFN.C.1,8V
OFFOFFONN.C.1,5V
OFFONOFFN.C.3,3V
OFFONONN.C.2,5V
ONOFFOFFN.C.0,8V
ONOFFONN.C.Do not use
ONONOFFN.C.1,25V
ONONONN.C.1,2V


I2C Switch

There is a I2C Switch on the TEB0745 which can be used in order to controll the SPF+ Connectors. 

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titleI2C Switch

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PinSchematic Connected toNotes
VCC3.3V

SCLI2C_SCLB2B, J2
SDA

I2C_SDA

B2B, J2
nRESETI2C_RSTVoltage Translator, U34
A0GNDLow I2C address is 0x72
A13.3VHighI2C address is 0x72
A2GNDLowI2C address is 0x72
SD0/ SC0SFP0_SDA / SFP0_SDASFP+ Connector, J4
SD1/ SC1SFP1_SDA / SFP1_SDASFP+ Connector, J6
SD2/ SC2SFP2_SDA / SFP2_SDASFP+ Connector, J8
SD3/ SC3SFP3_SDA / SFP3_SDASFP+ Connector, J10
SD4/ SC4SFP4_SDA / SFP4_SDASFP+ Connector, J13
SD5/ SC5SFP5_SDA / SFP5_SDASFP+ Connector, J15
SD6/ SC6SFP6_SDA / SFP6_SDASFP+ Connector, J18
SD7/ SC7SFP7_SDA / SFP7_SDASFP+ Connector, J20



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titleI2C Address of I2C Switch

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I2C DeviceDesignatorI2C AddressNotes
I2C DeviceU160x72


IO Expanders

The TEB0745 is equipped with 8 I/O Expanders.

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titleIO Expander Information

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titleSFP Connectors

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PinConnected to Notes
IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25
nINTNot Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected 
SCL

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2


SDA

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2


A0GND3.3VGND3.3VGND3.3VGND3.3V 
A1GNDGND3.3V3.3VGNDGND3.3V 3.3V 
A2GNDGNDGNDGND3.3V3.3V 3.3V 3.3V 
VCC3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 
P0...P7SFP+, J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20



In the following table you can find I2C addresses of I/O Expanders which would be designated by pins A0,A1 and A2. 

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I2C DeviceDesignatorI2C AddressNotes
I/O ExpanderU180x20
U190x21
U200x22
U210x23
U220x24
U230x25
U240x26
U250x27


Push Buttons

There are two push buttons S2, S3.

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DesignatorConnected toB2BActive LevelNote
S3USR_BTNJ3-153Active high
S2RST_IN_NJ2-131Active highGeneral Reset


LEDs

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DesignatorColorB2BConnected toActive LevelNote
D1GreenJ3-149MIO48Active HighLED1
D5GreenJ3-151MIO49Active HighLED2


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

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Power Input VoltageTypical Current
24VTBD*
VBATTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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Power-On Sequence

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Power Rails

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
3.3V

147, 149, 151, 153,
155, 157, 159

154, 156, 158,160-OutputPL_VIN
VCCIO1254, 55--Outputhigh range bank I/O voltage
VCCIO13112, 113--Outputhigh range bank I/O voltage
VCCIO33--115, 120Outputhigh performance bank I/O voltage
VCCIO34-29, 30-Outputhigh performance bank I/O voltage
VCCIO35-87, 88-Outputhigh performance bank I/O voltage
VBAT_IN146--OutputRTC (battery-backed) supply voltage
PS_1.8V-130-Inputinternal 1.8V voltage level (Process System)


Board to Board Connectors

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  • This section is optional and only for modules.

  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

Include Page
5.2 x 7.6 SoM ST5 and SS5 B2B Connectors
5.2 x 7.6 SoM ST5 and SS5 B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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SymbolsMinMaxUnitNote
VIN Supply Voltage024V
Storage Temperatur-25+85°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution.

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ParameterMinMaxUnitsReference Document
VIN Supply Voltage2025.4VSee LTC4365ITS8 Datasheet
Operating Temperatur-40+85°C


Physical Dimensions

  • Module size: 200 mm x 231 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 3.5 mm.

  • PCB thickness: 1.6 mm.
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In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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titlePhysical dimensions drawing

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Currently Offered Variants 

Page properties
hiddentrue
idComments

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.


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titleTrenz Electronic Shop Overview

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Trenz shop TEB0745 overview page
English pageGerman page


Revision History

Hardware Revision History

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DateRevisionChangesDocumentation Link
2018-12-0602a
  • Resistors R14 and R15 was replaced by 953R (was 5K1)
  • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
REV02-A
2018-10-1902
  • U16 I2C expander: address set to 0x72
  • U33 EEPROM: address set to 0x51. Added variant to set address 0x52.
  • Changed power up sequence: 24V_FUSED -> 3.3V (Module power up) -> 5V -> VCCIO18, VCC_HR_B, 3.3V_SFP
  • Fixed PCB patch: U6 pin 18 connected to 5V, pin 19 connected to GND.
  • JTAG connector J30 VREF (pin2) and XMOD VIO (pin 6) connected to 3.3V. XMOD IO A, B, E, G connected to module MIO via level translator U8.
  • Pull-up for BOOTMODE and PS_SW (DIP switch S1), RST_IN_N and USR_BTN (front panel buttons S2, S3) changed from VCCIO18 to PS_1.8V; JTAG_EN connected to 3.3V via DIP switch (S1).
  • Added switch S4 for selecting of output voltage of DCDC U7 (VCC_HR_B, HR banks VCCO)
REV02
2016-05-2501-REV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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titleBoard hardware revision number.


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titlePhysical Dimension
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titlePhysical dimensions drawing
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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed

Currently Offered Variants 

Page properties
hiddentrue
idComments

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.

...

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titleTrenz Electronic Shop Overview

...

Revision History

Hardware Revision History

-
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DateRevisionNotePCNDocumentation Link
--


Document Change History

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  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following

    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

...

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DateRevisionContributorDescription

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change list

  • Correction XMOD DIPs

2020-09-01v.135John Hartfiel
  • Correction power sequencing picture
2019-12-08v.134Pedram Babakhani
  • Technical Specifications Update

--

all

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  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices