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The carrier board TEB0745 was especially designed and developed for the use of Trenz Electronic module TE0745. 

Refer to for the current online version of this manual and other available documentation.

Key Features

  • Module: 
    • Trenz Electronic Module TE0745
    • Temperature: -40 to 85 °C
  • On Board:
    • 24V power supply terminal
    • 1 x EMI Network Filter
    • 3 x Variable Step Down Regulator Module (VDRM) with head sink
    • 2 x Synchronous Buck Regulator
    • 2 x Button (User / Reset)
    • 2 x LED (Green)
  • Interfaces:
    • 1 x XMOD (TE0790) Pin Header (JTAG / UART)
    • 1 x Pin Header (JTAG)
    • 1 x microSD connector
    • 1 x RJ45 Ethernet connector
    • 1 x USB Host Connector
    • 8 x SFP-Connector
    • 6 x Pin Header 50 pol. (FPGA Bank I/O's and Power)
    • 6 x Pin Header 12 pol. (FPGA Bank I/O's and Power)
    • 1 x battery holder
    • 2 x DIP Switch Array (VCC_HR_B / Modi)
  • Dimension: 200 mm x 231 mm

Block Diagram

TEB0745 block diagram

Main Components

TEB0745 main components
  1. SFP+ Connector, J4 J6 J8 J10 J13 J15 J18 J20
  2. Board to Board Connector (B2B), J1 J2 J3
  3. RJ45 Gigabit Ethernet connector, J22
  4. SD card connector, J16
  5. USB connector, J41
  6. Push Button, S2 S3
  7. SDIO port expander, U15
  8. Power distribution switch, U4
  9. Battery holder, B1
  10. Mag I3C power, U26 U12 U5
  11. Push bottun switch, S1 S4
  12. Buck regulator, U6 U7
  13. I2C EEPROM, U33
  14. Low voltage chanel I2C switch, U16
  15. Overvoltage, undervoltage, reversesupply protection controller, U13
  16. EMI suppression filter, U29
  17. JTAG interface, J12
  18. Power jack, J31
  19. 8bit IO expandor for I2C bus, U18 U25
  20. Pin Headers J23...26 (Not Assembled)
  21. Pin Headers J27-J28-J32-J36 (Not Assembled)
  22. Pin Headers J37...40 (Not Assembled)

Initial Delivery State

Storage device name



EEPROMEUI-64 number programmed

Can be used for MAC

Initial delivery state of programmable devices on the module

Configuration Signals

MODE Signal State

Connected toB2BStatusBoot Mode


ShortSD Card
Boot process.


Connected toB2BNote

Push Button, S2

J2-131Low Active Reset
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

B2B ConnectorInterfacesNumber of I/ONotes

User I/O

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 13

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 12
JTAG Interface5 single endedTCK, TDI, TMS, TDO, JTAG_EN
SFP+ Connector8 DiffSPF4....7_RX_N/P , SPF4....7_TX_N/P

Ethernet PHY4 Differential
2 single endedPHY_LED0...1
USB1 DifferentialOTG_N/P
Control Signals3 single endedPS_SRST, BOOTMODE, RST_IN_N
Power Control Signal2 single endedPWR_PS_OK, PWR_PL_OK
I2C Bus2 single endedI2C_SDA, I2C_SCL
User I/O4 single endedMIO12...15


User I/O6 Single endedMIO46...51
SD Card Connector6 Single endedSD_CLK, SD_CMD, SD_DAT0...3 (MIO40...45)
SFP+ Connector8 DifferentialSPF0....3_RX_N/P , SPF0....3_TX_N/P
General PL I/O to B2B connectors information

XMOD Pin Header

JTAG access to the TEB0745 SoM is available through B2B connector JB1 and JB2. JTAG_EN is connected to J1-138, JTAG_EN can be activated through DIP Switch S1-2.


Connected to

B2B Pin

XMOD Header JB1Note
AMIO15J2-129JB1-3UART TX - Input to the module
BMIO14J2-127JB1-7UART RX - Output of the module
CTCKJ1-143JB1-4JTAG interface signal
DTDOJ1-145JB1-8JTAG interface signal
FTDIJ1-142JB1-10JTAG interface signal

JTAG interface signal

GRST_IN_NJ2-131JB1-11RESET will be connected to Push Button on JTAG Programmer
JTAG pins connection

There is a DIP switch, S2, on TE0790 adapter which must be set as following.

DIP Switch,S2DefaultDescription
1ONUpdate Mode JTAG access to SC CPLD only
2OFFMust be always in OFF state.
3OFFVIO is supplied from Module
4ON3.3V  from XMOD
Xmod Adapter DIP-Switch Setting Description

SFP+ Connectors

The TEB0745 is equipped with 8 SFP+ Connectors, 

PinConnected to Notes
SFP+ , J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
TD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TX FAULTIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
TX DISABLE IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF2 IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
LOSIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
SFP Connectors

SD Card Socket

Power supply voltage for SD card holder is 3.3V.

SignalsConnected toB2BNotes
SD card interface MIOs and pins

RJ45 Connector

Ethernet Socket is connected to Board to Board (B2B)  JM2.

LAN Transformer

Test Points

Test Point


B2B Connector

TP 15V-
TP 5-9GND-
TP 10PS_1.8VJ2
TP 123.3VJ1- J2
TP 13--
TP 14--
TP 15PWR_PL_OKJ2- 135
TP 16PWR_PS_OKJ2-139
TP 183.3V_SFP-
Test Points Information

On-board Peripherals


DIP Switches

S1, S4
I2C SwitchU16
I/O ExpanderU18...U25
Push ButtonsS2, S3
LEDsD1, D5
On board peripherals


MIO PinSchematicB2BNotes
I2C EEPROM interface MIOs and pins

I2C DeviceDesignatorI2C AddressNotes
I2C address for EEPROM

DIP Switches

There are two DIP Switches S1,S4.

DesignatorConnected toB2BNote

DIP Switch S1

VCC_HR_B voltage can be selected using DIP Switch S4 .

S4-1S4-2S4-3S4-4Power VCC_HR_BNotes
ONOFFONN.C.Do not use
DIP Switch S4

I2C Switch

There is a I2C Switch on the TEB0745 which can be used in order to controll the SPF+ Connectors. 

PinSchematic Connected toNotes



B2B, J2
nRESETI2C_RSTVoltage Translator, U34
A0GNDLow I2C address is 0x72
A13.3VHighI2C address is 0x72
A2GNDLowI2C address is 0x72
SD0/ SC0SFP0_SDA / SFP0_SDASFP+ Connector, J4
SD1/ SC1SFP1_SDA / SFP1_SDASFP+ Connector, J6
SD2/ SC2SFP2_SDA / SFP2_SDASFP+ Connector, J8
SD3/ SC3SFP3_SDA / SFP3_SDASFP+ Connector, J10
SD4/ SC4SFP4_SDA / SFP4_SDASFP+ Connector, J13
SD5/ SC5SFP5_SDA / SFP5_SDASFP+ Connector, J15
SD6/ SC6SFP6_SDA / SFP6_SDASFP+ Connector, J18
SD7/ SC7SFP7_SDA / SFP7_SDASFP+ Connector, J20
I2C Switch

I2C DeviceDesignatorI2C AddressNotes
I2C DeviceU160x72
I2C Address of I2C Switch

IO Expanders

The TEB0745 is equipped with 8 I/O Expanders.

PinConnected to Notes
IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25
nINTNot Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected 

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2


I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

VCC3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 
P0...P7SFP+, J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
SFP Connectors
IO Expander Information

In the following table you can find I2C addresses of I/O Expanders which would be designated by pins A0,A1 and A2. 

I2C DeviceDesignatorI2C AddressNotes
I/O ExpanderU180x20
I2C Addresses of I/O Expanders

Push Buttons

There are two push buttons S2, S3.

DesignatorConnected toB2BActive LevelNote
S3USR_BTNJ3-153Active high
S2RST_IN_NJ2-131Active highGeneral Reset
On-board push button =s


DesignatorColorB2BConnected toActive LevelNote
D1GreenJ3-149MIO48Active HighLED1
D5GreenJ3-151MIO49Active HighLED2
On-board LEDs

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

Power Input VoltageTypical Current
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Power Sequency

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin


147, 149, 151, 153,
155, 157, 159

154, 156, 158,160-OutputPL_VIN
VCCIO1254, 55--Outputhigh range bank I/O voltage
VCCIO13112, 113--Outputhigh range bank I/O voltage
VCCIO33--115, 120Outputhigh performance bank I/O voltage
VCCIO34-29, 30-Outputhigh performance bank I/O voltage
VCCIO35-87, 88-Outputhigh performance bank I/O voltage
VBAT_IN146--OutputRTC (battery-backed) supply voltage
PS_1.8V-130-Inputinternal 1.8V voltage level (Process System)
Module power rails.

Board to Board Connectors

5.2 x 7.6 cm SoM Kintex modules use three Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.

  • 3x REF-192552-02 (160-pins)
    • ST5 Mates with SS5

5.2 x 7.6 cm SoM Kintex carrier use three Samtec Razor Beam LP Socket Strip (SS5) on the top side.

  • 3x REF192552-01 (160-pins)
    • SS5 Mates with ST5

Technical Specifications

Absolute Maximum Ratings

VIN Supply Voltage024V
Storage Temperatur-25+85°C
PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution.

ParameterMinMaxUnitsReference Document
VIN Supply Voltage2025.4VSee LTC4365ITS8 Datasheet
Operating Temperatur-40+85°C
Recommended operating conditions.

Physical Dimensions

  • Module size: 200 mm x 231 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 3.5 mm.

  • PCB thickness: 1.6 mm.

Physical dimensions drawing

Currently Offered Variants 

Trenz shop TEB0745 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevisionChangesDocumentation Link
  • Resistors R14 and R15 was replaced by 953R (was 5K1)
  • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
  • U16 I2C expander: address set to 0x72
  • U33 EEPROM: address set to 0x51. Added variant to set address 0x52.
  • Changed power up sequence: 24V_FUSED -> 3.3V (Module power up) -> 5V -> VCCIO18, VCC_HR_B, 3.3V_SFP
  • Fixed PCB patch: U6 pin 18 connected to 5V, pin 19 connected to GND.
  • JTAG connector J30 VREF (pin2) and XMOD VIO (pin 6) connected to 3.3V. XMOD IO A, B, E, G connected to module MIO via level translator U8.
  • Pull-up for BOOTMODE and PS_SW (DIP switch S1), RST_IN_N and USR_BTN (front panel buttons S2, S3) changed from VCCIO18 to PS_1.8V; JTAG_EN connected to 3.3V via DIP switch (S1).
  • Added switch S4 for selecting of output voltage of DCDC U7 (VCC_HR_B, HR banks VCCO)
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History


John Hartfiel

  • Correction XMOD DIPs

2020-09-01v.135John Hartfiel
  • Correction power sequencing picture
2019-12-08v.134Pedram Babakhani
  • Technical Specifications Update



  • --
Document change history.


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