Page History

<!--
Template Revision 1.68
(HTML comments will be not displayed in the document, no need to remove them. For Template/Skeleton changes, increase Template Revision number. So we can check faster, if the TRM style is up to date).
-->

<!--
General Notes:
If some section is CPLD firmware dependent, make a note and if available link to the CPLD firmware description. It's in the TE shop download area in the corresponding module -> revision -> firmware folder.
-->

<!--
General Notes:
Designate all graphics and pictures with a number and a description. For example "Figure 1: TE07xx-xx Block Diagram" or "Table 1: Initial delivery state". "Figure x" and "Table x" have to be formatted to bold.  
-->

<!--
Link to the base folder of the module (remove de/ or en/ from the URL): for example:
https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0703/
-->

Overview

The Trenz Electronic TE0783 is a high-performance, industrial-grade SoM (System on Module) with industrial temperature range based on Xilinx Zynq-7000 SoC (XC7Z035, XC7Z045 or XC7Z100).

These highly integrated modules with an economical price-performance-ratio have a form-factor of 8,5 x 8,5 cm and are available in several versions.

All parts cover at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options and for modified PCB-equipping due increasing cost-performance-ratio and prices for large-scale order.

<!--
Use short link the Wiki Ressource page: for example:
http://trenz.org/TE0783-info
List of available short links: https://wiki.trenz-electronic.de/display/CON/Redirects
  -->

Refer to http://trenz.org/te0783-info for the current online version of this manual and other available documentation.

Key Features

• Xilinx Zynq-7000 XC7Z045-2FFG900I SoC
• Rugged for shock and high vibration
• Large number of configurable I/Os are provided via rugged high-speed stacking strips
• Dual ARM Cortex-A9 MPCore
  • 1 GByte RAM (32bit wide DDR3) connected to PS
  • 2 GByte RAM (64bit wide DDR3) connected to PL
  • 32 MByte QSPI Flash memory
  • Hi-Speed USB2 ULPI transceiver PHY
  • Gigabit (10/100/1000 Mbps) Ethernet transceiver PHY
  • 4 GByte eMMC (optional up to 64 GByte)
• Lattice MachXO2 HC 4000 System Controller CPLD
  • 40 GPIO's available to user on B2B connector
• MAC-address EEPROM
• Serial user EEPROM
• Temperature compensated RTC (real-time clock)
• Si5338A programmable quad PLL clock generator for GTX transceiver clocks
• Plug-on module with 3 x 160-pin high-speed strips
  • 16 GTX high-performance transceiver
  • 4x GT transceiver clock inputs
  • 166 FPGA I/O's (83 LVDS pairs)
• On-board high-efficiency switch-mode DC-DC converters
• System management
• eFUSE bit-stream encryption
• AES bit-stream encryption
• Evenly-spread supply pins for good signal integrity
• User LED

Assembly options for cost or performance optimization available upon request.

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

<!--
Rules for all diagrams:
1. All diagrams are wrapped in the "Scroll Title" macro.
	- The title has to be named with the diagrams name
	- The anchor has the designation figure_x, whereby x is the number of the diagram

2. The Draw.IO diagram has to be inserted in the "Scroll Ignore" macro
	- Border has to be switched off in the macro edit
	- Toolbar has to be hidden in the macro edit

3. A PNG Export of the diagram has to be inserted in the "Scroll Only" macro 

The workaround with the additional PNG of the diagram is necessary until the bug of the Scroll PDF Exporter, which cuts diagram to two pages, is fixed.


IMPORTANT NOTE: In case of copy and paste the TRM skeleton to a new Wiki page, delete the Draw.IO diagrams and the PNGs, otherwise due to the linkage of the copied diagrams every change in the TRM Skeleton will effect also in the created TRM and vice versa!

See page "Diagram Drawing Guidelines" how to clone an existing diagram as suitable template for the new diagram! 

   -->

Main Components

1. Xilinx Zynq-7000 SoC, U1
2. 4Gbit DDR3L SDRAM, U19
3. 4Gbit DDR3L SDRAM, U10
4. 4Gbit DDR3L SDRAM, U8
5. 4Gbit DDR3L SDRAM, U9
6. 4Gbit DDR3L SDRAM, U14
7. 4Gbit DDR3L SDRAM, U12
8. SI5338A programmable quad PLL clock generator, U2
9. SiTime SiT8008 25.000000 MHz oscillator, U3
10. Lattice Semiconductor MachXO2 4000HC CPLD, U32
11. Microchip 128Kbit I²C EEPROM, U26
12. Microchip 2Kbit I²C MAC EEPROM, U22
13. TPS780180300 LDO @1.8V backup battery voltage, U21
14. TCA9406DCUR I²C voltage level shifter, U25
15. Intersil ISL12020MIRZ Real Time Clock, U17
16. Microchip USB3320C USB PHY transceiver, U4
17. SiTime SiT8008 52.000000 MHz oscillator, U7
18. 74AVCH4T245 voltage level tranlator, U30
19. TPS74801RGW LDO @1.5V, U23
20. 32 MByte QSPI Flash memory, U38
21. LT quad 4A PowerSoC DC-DC converter (@1.0V), U13
22. LT quad 4A PowerSoC DC-DC converter (@3.3V, @1,8V, @1.2V_MGT, @1.0V_MGT), U16
23. TPS74801RGW LDO @1.5V_PL, U20
24. Samtec ASP-122952-01 160-pin stacking strip (2 rows a 80 positions), J2
25. Samtec ASP-122952-01 160-pin stacking strip (2 rows a 80 positions), J3
26. Samtec ASP-122952-01 160-pin stacking strip (2 rows a 80 positions), J1
27. Micron Technology 4 GByte eMMC, U28
28. Marvell Alaska 88E1512 Gigabit Ethernet PHY, U18
29. Texas Instruments TXS02612RTWR SDIO Port Expander, U29
30. SiTime SiT8008 25.000000 MHz oscillator, U11
31. DSC1123CI2 Low-Jitter Precision LVDS Oscillator, U31
32. SiTime SiT8008 33.333333 MHz oscillator, U33
33. TPS799 LDO @1.8V_MGT, U5
34. TPS799 LDO @VCCAUX_IO (1.8V), U35

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module

Boot Process

6 of the 7 boot mode strapping pins (MIO2 ... MIO8) of the Xilinx Zynq-7000 SoC device are hardware programmed on the board, 1 of them is set by the SC CPLD firmware. The boot strapping pins are evaluated by the Zynq device soon after the 'PS_POR' signal is deasserted to begin the boot process (see section "Boot Mode Pin Settings" of Xilinx manual UG585).

The TE0783 boot mode is selected by the pin 'CPLD_GPIO3' of the SC CPLD, which is connected to B2B pin J2-16 to either boot from the on-board QSPI Flash memory U38 or SD IO interface. See section Bootmode in the TE0783 SC CPLD reference Wiki page.

The JTAG interface of the module is provided for storing the data to the QSPI Flash memory through the Zynq-7000 device.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

Zynq-7000 SoC's I/O banks signals connected to the B2B connectors:

Table 2: General overview of board to board I/O signals

For detailed information about the pin-out, please refer to the Pin-out table.

MGT Lanes

The Xilinx Zynq-7000 SoC used on the TE0783 module has 16 MGT transceiver lanes. All of them are wired directly to B2B connectors J1 and J3. MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane with data transmission rates up to 12.5Gb/s per lane (Xilinx GTX transceiver). Following table lists lane number, FPGA bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:

Table 3: MGT lanes

There are 2 clock sources for the GTX transceivers. MGT_CLK1, MGT_CLK2, MGT_CLK4 and MGT_CLK7 are connected directly to B2B connector J3 and J1, so the clock can be provided by the carrier board. Clocks MGT_CLK0, MGT_CLK3, MGT_CLK5 and MGT_CLK6 are provided by the on-board clock generator (U2). As there are no capacitive coupling of the data and clock lines that are connected to the connectors, these may be required on the user’s PCB depending on the application.

Table 4: MGT reference clock sources

JTAG Interface

JTAG access to the Xilinx Zynq-7000 is provided through B2B connector J3.

Table 5: Zynq JTAG interface signals

JTAG access to the LCMXO2-1200HC System Controller CPLD U14 is provided through B2B connector J3.

Table 6: System Controller CPLD JTAG interface signals

Pin J3-136 'JTAGENB' of B2B connector J3 is used to access the JTAG interface of the SC CPLD. Set high to program the System Controller CPLD via JTAG interaface.

System Controller CPLD I/O Pins

Special purpose pins are connected to System Controller CPLD (U32) and have following default configuration:

Table 7: System Controller CPLD special purpose pins.

See also TE0783 CPLD reference Wiki page.

Default PS MIO Mapping

Table 8: Zynq PS MIO mapping

Gigabit Ethernet

The TE0783 is equipped with one Marvell Alaska 88E1512 Gigabit Ethernet PHYs (U18). The transceiver PHY is connected to the Zynq PS Ethernet GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHYs is supplied from an on board 25MHz oscillator (U11).

GbE PHY connection:

Table 9: General overview of the Gigabit Ethernet1 PHY signals

USB Interface

The TE0783 is equipped with one USB PHY USB3320 from Microchip (U4). The ULPI interface of the USB PHY is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.

The reference clock input of the PHY is supplied from an on board 52MHz oscillator (U7).

USB2 PHY connection:

Table 10: General overview of the Gigabit Ethernet2 PHY signals

I2C Interface

The on-board I²C components are connected to PS MIO bank 500 pins MIO10 ('MIO10_SCL') and MIO11 ('MIO11_SDA').

I²C addresses for on-board components:

Table 11: Address table of the I²C bus slave devices

On-board Peripherals

System Controller CPLD

The System Controller CPLD (U32) is provided by Lattice Semiconductor LCMXO2-4000HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.

See also TE0783 CPLD reference Wiki page.

eMMC Flash Memory

eMMC Flash memory device (U28) is connected to the Zynq PS MIO bank 501 pins MIO46..MIO51. eMMC chips MTFC4GMVEA-4M IT (Flash NAND-IC 2x 16 Gbit) is used with 4 GByte of memory density.

DDR3L Memory

By default TE0783-01 module has two 16bit wide IM (Intelligent Memory) IM4G16D3FABG-125I DDR3L SDRAM (DDR3-1600 Speedgrade) connected to the PS DDR memory bank 502, the chips are arranged into 32bit wide memory bus providing total of 1 GBytes of on-board RAM.

Another 4 chips are arranged into 64bit wide memory bus prodivding total of 2 GByte on-board RAM connected to the PL HP banks 34, 35 and 36.

Quad SPI Flash Memory

One quad SPI compatible serial bus Flash memory (U38) for FPGA configuration file storage is provided by Spansion S25FL256SAGBHI20 with 256 Mbit (32 MByte) memory density. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U18) is provided by Marvell Alaska 88E1512. The Ethernet PHY's RGMII interface is connected to the Zynq's PS MIO bank 501. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U11).

High-speed USB2 ULPI PHY

Hi-speed USB ULPI PHY (U4) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 bank 501 (see also section USB interface). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U7).

MAC Address EEPROM

A Microchip 24AA025E48 serial EEPROM (U22) contain globally unique 48-bit node address, which are compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8 Kbit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. The MAC address EEPROM is accessible over I²C bus (see also section I²C interface).

Configuration EEPROM

The TE0783 board contains one EEPROM (U26) for configuration and general user purposes. The EEPROMs is provided by Microchip 24LC128-I/ST with 128 KBit memory density, the EEPROM is areaccessible over I²C bus (see also section I²C interface).

Programmable Clock Generator

There is a Silicon Labs I²C programmable clock generator Si5338A (U2) chip on-board. It's output frequencies can be programmed using the I²C bus address 0x70 or 0x71. Default address is 0x70, IN4/I2C_LSB pin must be set to high for address 0x71.

A 25.000000 MHz oscillator (U3) is connected to the pin IN3 and is used to generate the output clocks. The output voltage of the oscillator is provided by the 1.8V power rail, thus making output frequency available as soon as 1.8V is present. All 4 of the Si5338 clock outputs are connected to the MGT banks of the Zynq device. It is possible to use the clocks connected to the GTR bank in the user's logic design. This is achieved by instantiating a IBUFDSGTE buffer in the design.

Once running, the frequency and other parameters can be changed by programming the device using the I²C bus connected between the FPGA (master) and clock generator (slave). For this, proper I²C bus logic has to be implemented in FPGA.

Table 12: General overview of the on-board quad clock generator I/O signals

Oscillators

The module has following reference clock signals provided by on-board oscillators and external source from carrier board:

Table 13: Reference clock signals

On-board LEDs

Table 14: On-board LEDs

Power and Power-on Sequence

Power Supply

Power supply with minimum current capability of 4A for system startup is recommended.

Power Consumption

Table 15: Power consumption

 * TBD - To Be Determined soon with reference design setup.

Power Distribution Dependencies

The Trenz TE0783 SoM is equipped with two quad DC-DC voltage regulators to generate required on-board voltage levels 1V, 3.3V, 1.8V, 1.2V_MGT, 1V_MGT. Additional voltage regulators are used to generate voltages 3.3V_SB, 1.5V, VTT, VTTREF for PS and PL memory bank, 1.8V_MGT and VCCAUX_IO.

There are following dependencies how the initial voltages of the power rails on the B2B connectors are distributed to the on-board DC-DC converters, which power up further DC-DC converters and the particular on-board voltages:

See also Xilinx datasheet DS191 for additional information. User should also check related base board documentation when intending base board design for TE0783 module.

Power-On Sequence

Power-on sequence is handled by the System Controller CPLD using "Power good"-signals from the voltage regulators:

Voltage Monitor Circuit

The voltages '1V' and '3.3V' are monitored by the voltage monitor circuit U27, which generates the PS_POR reset signal if monitored voltages have transient interruptions:

Power Rails

Table 16: Module power rails

Bank Voltages

Table 17: Module I/O bank voltages

See Xilinx Zynq-7000 datasheet DS191 for the voltage ranges allowed.

Board to Board Connectors

Variants Currently In Production

Technical Specifications

Absolute Maximum Ratings

Table 18: Module absolute maximum ratings

Recommended Operating Conditions

Table 19: Recommended operating conditions

Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 85 mm × 85 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 5 mm

• PCB thickness: 1.7 mm

All dimensions are shown in millimeters.

Revision History

Hardware Revision History

Table 20: Hardware revision history table

Document Change History

<!--
Generate new entry:
1.add new row below first
2.Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number
3.Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description.
  -->

Table 21: Document change history

Disclaimer