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Table of Contents
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Overview
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Refer to https://wiki.trenz-electronic.de/display/PD/TE0808+TRM for the current online version of this manual and other available documentation.
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The Trenz Electronic TE0808 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, up to 8 GBytes of DDR4 SDRAM via 64-bit wide data bus, max. 512 MByte Flash memory for configuration and operation, 20 Gigabit transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed stacking connections. All this in a compact 5.2 x 7.6 cm form factor, at the competitive price.
Key Features
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Refer to http://trenz.org/te0808-info for the current online version of this manual and other available documentation.
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Key Features
- MPSoC: ZYNQ UltraScale+ ZU9EG 900 pin package
- Memory
- 64-Bit DDR4, 8 GByte maximum
- Dual - MPSoC: ZYNQ UltraScale+ ZU9EG 900 pin package
- Memory
- 64-Bit DDR4, 8 GByte maximum
- Dual SPI boot Flash in parallel, 512 MByte maximum - User I/Os
- 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GPIOs (3 banks)
- Serial transceivers: 4 x GTR + 16 x GTH
- Transceiver clocks inputs and outputs
- PLL clock generator inputs and outputs - Si5345 - 10 output PLL
- All power supplies on board, single 3.3V power source required
- 14 on-board DC-DC regulators and 13 LDOs
- LP, FP, PL separately controlled power domains - Support for all boot modes (except NAND) and scenarios
- Support for any combination of PS connected peripherals
- Size: 52 x 76 mm, 3 mm mounting holes for skyline heat spreader
- B2B connectors: 4 x 160 pin
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Table 2: B2B connector pin-outs of available PL and PS banks of the TE0808-04 SoM.
All MIO banks are powered from on-module DC-DC power rail. All PL I/O Banks have separate VCCO pins in the B2B connectors, valid VCCO should be supplied from the baseboard.
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Bank | Type | B2B Connector | Count of MGT Lanes | Schematic Names / Connector Pins | MGT Bank's Reference Clock Inputs |
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228 | GTH | J1 | 4 GTH lanes (4 RX / 4 TX) | B228_RX3_P, B228_RX3_N, pins J1-2751, J1-2953 B228_RX2_P, B228_RX2_N, pins J1-3357, J1-3559 B228_RX1_P, B228_RX1_N, pins J1-3963, J1-4165 B228_RX0_P, B228_RX0_N, pins J1-4569, J1-4771 | 1 reference clock signal (B228_CLK0) from B2B connector 1 reference clock signal (B228_CLK1) from programmable |
229 | GTH | J1 | 4 GTH lanes (4 RX / 4 TX) | B229_RX3_P, B229_RX3_N, pins J1-27, J1-29 B229_RX2_P, B229_RX2_N, pins J1-33, J1-35 B229_RX1_P, B229_RX1_N, pins J1-39, J1-41 B229_RX0_P, B229_RX0_N, pins J1-45, J1-47 | 1 reference clock signal (B229_CLK0) from B2B connector 1 reference clock signal (B229_CLK1) from programmable |
230 | GTH | J1 | 4 GTH lanes (4 RX / 4 TX) | B230_RX3_P, B230_RX3_N, pins J1-3, J1-5 B230_RX2_P, B230_RX2_N, pins J1-9, J1-11 B230_RX1_P, B230_RX1_N, pins J1-15, J1-17 B230_RX0_P, B230_RX0_N, pins J1-21, J1-23 | 1 reference clock signal (B230_CLK1) from B2B connector 1 reference clock signal (B230_CLK0) from programmable |
128 | GTH | J2 | 4 GTH lanes (4 RX / 4 TX) | B128_RX3_N, B128_RX3_P, pins J2-28, J2-30 B128_RX2_N, B128_RX2_P, pins J2-34, J2-36 B128_RX1_N, B128_RX1_P, pins J2-40, J2-42 B128_RX0_N, B128_RX0_P, pins J2-46, J2-48 | 1 reference clock signal (B128_CLK1) from B2B connector 1 reference clock signal (B128_CLK0) from programmable |
505 | GTR | J2 | 4 GTR lanes (4 RX / 4 TX) | B505_RX3_N, B505_RX3_P, pins J2-52, J2-54 B505_RX2_N, B505_RX2_P, pins J2-58, J2-60 B505_RX1_N, B505_RX1_P, pins J2-64, J2-66 B505_RX0_N, B505_RX0_P, pins J2-70, J2-72 | 2 reference clock signals (B505_CLK0, B505_CLK1) from B2B connector 2 reference clock signal (B505_CLK2, B505_CLK3) from programmable |
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Quad SPI Flash memory ICs U7 and U17 are connected to the Zynq MPSoC PS QSPI0 interface via PS MIO bank 500, pins MIO0 ... MIO5 and MIO7 ... MIO12.
MIO | Signal Name | U7 Pin | MIO | Signal Name | U17 Pin | ||
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0 | SPI Flash CLK | B2 | 7 | SPI Flash CS | C2 | ||
1 | SPI Flash IO1 | D2 | 8 | SPI Flash IO0 | D3 | ||
2 | SPI Flash IO2 | C4 | 9 | SPI Flash IO1 | D2 | ||
3 | SPI Flash IO3 | D4 | 10 | SPI Flash IO2 | C4 | ||
4 | SPI Flash IO0 | D3 | 11 | SPI Flash IO3 | D4 | ||
5 | SPI Flash CS | C2 | 12 | SPI Flash CLK | B2 |
Table 7: PS MIO pin assignment of the Quad SPI Flash memory ICs.
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The TE0808-04 SoM is equipped with with four DDR4-2400 SDRAM modules chip with up to 8 GByte memory density. The SDRAM modules chips are connected to the Zynq MPSoC's PS DDR controller (bank 504) with a 64-bit data bus.
Refer to the Xilinx Zynq UltraScale+ datasheet DS925 for more information on whether the specific package of the Zynq UltraScale+ MPSoC supports the maximum data transmission rate of 2400 MByte/s.
Programmable PLL Clock Generator
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Input | Connected to | Frequency | Notes |
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IN0 | On-board Oscillator (U25) | 25.000000 MHz | - |
IN1 | B2B Connector pins J2-34, J2-1 6 (differential pair) | User | AC decoupling required on base |
IN2 | B2B Connector pins J3-66, J3-68 (differential pair) | User | AC decoupling required on base |
IN3 | OUT9 | User | Loop-back from OUT9 |
Output | Connected to | Frequency | Notes |
OUT0 | B2B Connector pins J2-3, J2-1 (differential pair) | User | Default off |
OUT1 | B230 CLK0 | User | Default off |
OUT2 | B229 CLK1 | User | Default off |
OUT3 | B228 CLK1 | User | Default off |
OUT4 | B505 CLK2 | User | Default off |
OUT5 | B505 CLK3 | User | Default off |
OUT6 | B128 CLK0 | User | Default off |
OUT7 | B2B Connector pins J2-713, J2-9 15 (differential pair) | User | Default off |
OUT8 | B2B Connector pins J2-137, J2-15 9 (differential pair) | User | Default off |
OUT9 | IN3 (Loop-back) | User | Default off |
XA/XB | Quartz (Y1) | 50.000 MHz | - |
Table 11: Programmable PLL clock generator input/output.
The Si5345A programmable clock generator's control interface pins are exposed to B2B connector J2. For further information refer to the Si5345A data sheet.
Signal | B2B Connector Pin | Function |
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PLL_FINC | J2-81 | Frequency increment. |
PLL_LOLN | J2-85 | Loss of lock (active-low). |
PLL_SEL0 / PLL_SEL1 | J2-93 / J2-87 | Manual input switching. |
PLL_FDEC | J2-94 | Frequency decrement. |
PLL_RST | J2-5989 | Device reset (active-low) |
PLL_SCL / PLL_SDA | J2-90 / J2-92 | I2C interface, external pull-ups needed for SCL / SDA lines. I2C address in current configuration: 1101000b1101001b. |
Table 12: B2B connector pin-out of Si5345A programmable clock generator.
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Figure 3: Power Distribution Diagram.
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Current rating of Samtec Razor Beam™ LSHMBeam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 21.0A 5 A per pin (2 adjacent pins powered1 pin powered per row). |
Power-On Sequence Diagram
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Enable-Signal | B2B Connector Pin | Max. Voltage | Note | Power-Good-Signal | B2B Connector Pin | Pull-up Resistor | Note | ||
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EN_LPD | J2-108 | 6V | TPS82085SIL data sheet | LP_GOOD | J2-106 | 4K7, pulled up to LP_DCDC | - | ||
EN_FPD | J2-102 | DCDCIN | NC7S08P5X data sheet | PG_FPD | J2-110 | 4K7, pulled up to DCDCIN | - | ||
EN_PL | J2-101 | PL_DCIN | left floating for logic high (drive to GND for logic low) | PG_PL | J2-104External pull-up needed (max. voltage GT_DCDC), max. sink current | 1 mA4K7, pulled up to PL_DCIN | TPS82085SIL / | ||
EN_DDR | J2-112 | DCDCIN | NC7S08P5X data sheet | PG_DDR | J2-114 | 4K7, pulled up to DCDCIN | - | ||
EN_PSGT | J2-84 | DCDCIN | NC7S08P5X data sheet | PG_PSGT | J2-82 | External pull-up needed (max. 5.5V), max. sink current 1 mA | TPS74801 data sheet | ||
EN_GT_R | J2-95 | GT_DCDC | NC7S08P5X data sheet | PG_GT_R | J2-91 | External pull-up needed (max. 5.5V), max. sink current 1 mA | TPS74401 data sheet | ||
EN_GT_L | J2-79 | GT_DCDC | NC7S08P5X data sheet | PG_GT_L | J2-97 | External pull-up needed (max. 5.5V), max. sink current 1 mA | TPS74801 data sheet | ||
EN_PLL_PWR | J2-77 | 6V | TPS82085SIL data sheet | PG_PLL_1V8 | J2-80 | External pull-up needed (max. 5.5V), max. sink current 1 mA | TPS82085SIL data sheet |
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Power Rail Name | B2B J1 Pins | B2B J2 Pins | B2B J3 Pins | Directions | Note |
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PL_DCIN | 151, 153, 155, 157, 159 | - | - | Input | - |
DCDCIN | - | 154, 156, 158, 160, | - | Input | - |
LP_DCDC | - | 138, 140, 142, 144 | - | Input | - |
PS_BATT | - | 125 | - | Input | - |
GT_DCDC | - | - | 157, 158, 159, 160 | Input | - |
PLL_3V3 | - | - | 152 | Input | U5 (programmable PLL) 3.3V nominal input |
SI_PLL_1V8 | - | - | 151 | Output | Internal voltage level 1.8V nominal output |
PS_1V8 | - | 99 | 147, 148 | Output | Internal voltage level |
PL_1V8 | 91, 121 | - | - | Output | Internal voltage level |
DDR_1V2 | - | 135 | - | Output | Internal voltage level |
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B2B connectors
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Variants Currently In Production
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Parameter | Min | Max | Unit | Notes / Reference Document |
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PL_DCIN | -0.3 | 74 | V | TPS82085SIL / EN63A0QI data sheet / Limit is LP_DCDC over EN/PG |
DCDCIN | -0.3 | 74 | V | TPS82085SIL / TPS51206 data sheet / Limit is LP_DCDC over EN/PG |
LP_DCDC | -0.3 | 4 | V | TPS3106K33DBVR data sheet |
GT_DCDC | -0.3 | 74 | V | TPS82085SIL data sheet / Limit is LP_DCDC over EN/PG |
PS_BATT | -0.5 | 2 | V | Xilinx DS925 data sheet |
PLL_3V3 | -0.5 | 3.8 | V | Si5345/44/42 data sheet |
VCCO for HD I/O banks | -0.5 | 3.4 | V | Xilinx DS925 data sheet |
VCCO for HP I/O banks | -0.5 | 2 | V | Xilinx DS925 data sheet |
VREF | -0.5 | 2 | V | Xilinx DS925 data sheet |
I/O input voltage for HD I/O banks | -0.55 | VCCO + 0.55 | V | Xilinx DS925 data sheet |
I/O input voltage for HP I/O banks | -0.55 | VCCO + 0.55 | V | Xilinx DS925 data sheet |
PS I/O input voltage (MIO pins) | -0.5 | VCCO_PSIO + 0.55 | V | Xilinx DS925 data sheet, VCCO_PSIO 1.8V nominally |
Receiver (RXP/RXN) and transmitter | -0.5 | 1.2 | V | Xilinx DS925 data sheet |
Voltage on input pins of | -0.5 | VCC + 0.5 | V | NC7S08P5X data sheet, see schematic for VCC |
Voltage on input pins (nMR) of | -0.3 | VDD + 0.3 | V | TPS3106 data sheet, |
"Enable"-signals on TPS82085SIL (EN_PLL_PWR, EN_LPD) | -0.3 | 7 | V | TPS82085SIL data sheet |
Storage temperature (ambient) | -40 | 100 | °C | ROHM Semiconductor SML-P11 Series data sheet |
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Parameter | Min | Max | Unit | Notes / Reference Document |
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PL_DCIN | 23.53 | 3.6 | V | EN63A0QI / TPS82085SIL data sheet / Limit is LP_DCDC over EN/PG |
DCDCIN | 3.13 | 3.6 | V | TPS82085SIL / TPS51206PSQ data sheet / Limit is LP_DCDC over EN/PG |
LP_DCDC | 23.53 | 3.6 | V | TPS82085SIL / TPS3106 TPS3106K33DBVR data sheet |
GT_DCDC | 23.53 | 3.6 | V | TPS82085SIL data sheet/ Limit is LP_DCDC over EN/PG |
PS_BATT | 1.2 | 1.5 | V | Xilinx DS925 data sheet |
PLL_3V3 | 3.14 | 3.47 | V | Si5345/44/42 data sheet 3.3V typical |
VCCO for HD I/O banks | 1.14 | 3.4 | V | Xilinx DS925 data sheet |
VCCO for HP I/O banks | 0.95 | 1.9 | V | Xilinx DS925 data sheet |
I/O input voltage for HD I/O banks. | -0.2 | VCCO + 0.2 | V | Xilinx DS925 data sheet |
I/O input voltage for HP I/O banks | -0.2 | VCCO + 0.2 | V | Xilinx DS925 data sheet |
PS I/O input voltage (MIO pins) | -0.2 | VCCO_PSIO + 0.2 | V | Xilinx DS925 data sheet, VCCO_PSIO 1.8V nominally |
Voltage on input pins of NC7S08P5X 2-Input AND Gate | 0 | VCC | V | NC7S08P5X data sheet, |
Voltage on input pin 'MR' of | 0 | VDD | V | TPS3106 data sheet, |
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Module size: 52 mm × 76 mm. Please download the assembly diagram for exact numbers
Mating height with standard connectors: 4mm5mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 3mm. Please download the step model for exact numbers
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Document Change History
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2022-09-13 | v.41 | Vadim Yunitski |
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2021-09-07 | V.39 | John Hartfiel |
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2021-05-17 | v.37 | John Hartfiel |
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2021-03-11 | v.35 | Antti Lukats |
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2019-01-27 | v.30 | Martin Rohrmüller |
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2018-11-20 | v.29 | John Hartfiel |
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2018-08-27 | v.27 | John Hartfiel |
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2028-06-28 | v.26 | John Hartfiel |
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2017-11-13 | v.24 | Ali Naseri |
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2017-11-13 | John Hartfiel |
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2017-10-20 | v.21 | Ali Naseri |
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2017-08-28 | v.15 | John Hartfiel |
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2017-08-28 | v.14 | Jan Kumann |
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2017-08-15 | v.12 | Vitali Tsiukala | Changed signals count in the B2B connectors table | |||||||||||||||||||||||||||||||
2017-08-15 | v.11 | John Hartfiel, Ali Naseri |
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2017-02-06 | v.1 | Jan Kumann | Initial document |
Disclaimer
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