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Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive an Automotive Xilinx  Zynq-7020 7 FPGA, two 100 Mbit Ethernet transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte DDR3 SDRAM, QSPI Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. 

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All this in a compact 6 x 6 cm form factor, at the most competitive price.

Refer to http://trenz.org/te0728-info for the current online version of this manual and other available documentation.

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• Xilinx
XA7Z020
• XC7Z020-1CLG484Q (Automotive)
• Rugged for shock and high vibration
• Dimensions: 6 x 6 cm
• Temperature range: automotive
• [XA7Z014S is available on other assembly options]
  • Package: CL/CLG484
  • Speed Grade: -1
  • Temperature Grade: Expanded (-40 to +128 °C)
    
• Dual-Core
2 x
• ARM Cortex-A9 MPCore
  
• 2 x 100 MBit Ethernet transceiver (PHY)
• 512 MByte DDR3L SDRAM, 16-bit-wide 
• DDR3 SDRAM, up to 512MB, up to 1066 Mb/s, connected to PS  [different size is available on other assembly options]
16 MByte
• QSPI Flash memory (with XiP support)
• Plug-on module with 3 x 80-pin Samtec Micro Tiger Eye(TM) high-speed connectors
• [different size is available on other assembly options]
• Programmable SIT8918A , PS clock generator
• 2 Kbit serial EEPROM
• Three user LEDs
• CAN transceiver (PHY)
• Temperature compensated RTC (real-time clock)
• 2 x 100 MBit Ethernet transceiver (PHY)
• Board to Board (B2B)
  • Plug-on module with 3 x 80-pin Samtec Micro Tiger Eye(TM) high-speed connectors
• I/O Interface
  • 42x MIO
  • 200x HR
  • 128x PS IO
  • 0x GTP Transceiver
  • 0x GTX Transceiver

• Power Supply
  • 12 V power supply with watchdog
• Others:
  • Dimensions: 6 x 6 cm
  • Rugged for shock and high vibration
  • On-board high-efficiency DC-DC converters
  • System
• 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on board-to-board connectors
• CAN transceiver (PHY)
• 12 V power supply with watchdog
• On-board high-efficiency DC-DC converters
System
• • management and power sequencing
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
• Temperature compensated RTC (real-time clock)
• 3 user LEDs
Evenly-spread supply
• • Evenly-spread supply pins for good signal integrity
    
Other assembly options for cost or performance optimization plus high volume prices available on request.

Depending on the customer design, additional cooling might be required.

• • 
    

Block Diagram

Main Components

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Initial Delivery State

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1. DDR3 SDRAM, U1
2. Xilinx Automotive XA7Z020-1CLG484Q ,U2
3. 100 MBit Ethernet transceiver, U3
4. 100 MBit Ethernet transceiver, U10
5. User LED Green, D4
6. Real Time Clock, U7
7. Standard Clock Oscillators, U5
8. 64 Kbit I2C EEPROM, U11
9. CAN Tranceiver, U16
10. QSPI NOR Flash memory, U13
11. Standard Clock Oscillators, U14
12. Low-Quiescent-Current Programmable Delay Supervisory Circuit, U15
13. Low-Quiescent-Current Programmable Delay Supervisory Circuit, U12
14. B2B connector , JM2
15. B2B connector , JM3
16. B2B connector , JM1

FPGA (U2), DDR3 SDRAM (U1) and QSPI (U13) can be  varied on other assembly option, for more information contact us. 

Initial Delivery State

Configuration Signals

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Storage device name

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Content

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Notes

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Control Signals

Signals, Interfaces and Pins

Subsections...

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Notes : add subsection for every component which is important for design, for example: Ethernet PHY USB PHY Programmable Clock Generator Oscillators eMMCs RTC FTDI ... DIP-Switches Buttons LEDs

Subsections...

Power and Power-On Sequence

Power Consumption

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Power-On Sequence

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Signals, Interfaces and Pins

Voltage Monitor Circuit

Power Rails

Bank Voltages

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

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Recommended Operating Conditions

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Physical Dimensions

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Board to Board (B2B) I/Os

TE0728 Module has 3 B2B connectors and every connector has 80 pins (2 row, 40 pins).

FPGA bank number and number of I/O signals connected to the B2B connector:

Ethernet PHY

Ethernet pins connections to Board to Board (B2B). Ethernet components ETH1 and ETH2 are connected to B2B connector J3.

CAN PHY

CAN pins connections to Board to Board (B2B).

JTAG Interface

JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.

MIO Pins

On-board Peripherals

Quad SPI Flash Memory

On-board QSPI flash memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.

RTC 

The RTC has an I²C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy.

RTC interrupt is connected to MIO0 connected to Bank 500 through pin G6.

EEPROM

The Microchip Technology Inc. 24xx64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. The 24xx64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.

LEDs

DDR3 SDRAM

The TE0728 SoM has a volatile DDR3 SDRAM, 256Mx16bit (512MB), IC for storing user application code and data. Size of DDR3 can be varied in different assembly versions.

• Part number: NT5CB256M16CP-DIH
• Supply voltage: 1.5V
• Organization: 256M x 16 bits

DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing. The maximum possible speed for DDR3 SDRAM is 1066 Mb/s.

Ethernet

There are two 100 MBit Extreme Temperature Ethernet provided by Texas Instrumen on the board. Datasheet is provided at TI website. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz sources is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.

PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.

CAN Transceiver

Controller Area Network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is available in TI website. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps. 

Oscillators

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2.5A for system startup is recommended.

Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power on Sequence

The TE07028 SoM meets the recommended criteria to power up the Xilinx Zynq properly by keeping a specific sequence of enabling the on-board DC-DC converters and regulators dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages. When the U8 and U9 generates PWRGD signal, it turns on the U4 which generates PWRGD_3.3V, it turns on the U6 and it generates PWROK signal which is connected to MR. Whenever the supply voltage for U12 drops down below the threshold it resets the system. Actually it resets the system when all regulators are working.

Voltage Monitor Circuit

The microprocessor supervisory circuits monitor system voltages asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user adjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.

Power Rails

Bank Voltages

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditionse

Physical Dimensions

• Module size: 60 mm × 60 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 7 mm.

• PCB thickness: 1.6 mm.

Currently Offered Variants 

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Revision History

Hardware Revision History

Product changes can be seen in PCN page.

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

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