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Overview

Refer to https://wiki.trenz-electronic.de/display/

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PD/TE0722+TRM for downloadable version of this manual and additional technical documentation of the product.

 The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx Zynq-7000 SoC.

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• Xilinx Zynq XC7Z010 SoC
• Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
• 16 MByte quad Quad SPI Flash
• Micro SD Card socket with card detect signal
• 34 I/Os on DIP40 header pins
• System status LED (DONE)
• RGB LED connected to PL I/O
• Green user LED connected to ARM CPU GPIO
• Proximity and ambient light sensor
• DIP40 form factor (size 18 x 51 mm)

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Figure 1: TE022-02 block diagram.

Main Components

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Figure 2: TE0722-02 PCB top side.

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Figure 3: TE0722-02 PCB bottom side.

1. Xilinx Zynq XC7Z010 or Zynq XC7Z007S SoC, U1
2. Micro SD card socket with card detect, J8
3. Red LED, D3
4. Green LED, D2
5. Red LED, D6
6. 20-pin connector placeholder, P1
7. Red LED, D5
8. Proximity/ambient light sensor, U4
9. RGB LED, D4
10. Red LED, D1
11. 20-pin connector placeholder, P2
12. Ultra-low supply-current voltage monitor, U4
13. 2 x 5-pin connector placeholder, J1
14. 2 x 5-pin connector placeholder, J2
15. 2 x 5-pin connector placeholder, J3
16. 16 MByte QSPI Flash memory, U5
17. Low-power programmable oscillator @ 33.333333 MHz, U8
18. 1A PowerSoC DC-DC converter (1.0V), U2
19. 1A PowerSoC DC-DC converter (1.8V), U3

Initial Delivery State

Table 1: . Initial delivery state of programmable devices on the module

Boot Process

By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector JM..

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High or open

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SD Card

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Low or ground

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QSPI Interface

The 7 boot mode strapping pins (MIO2 ... MIO8) of the Xiliny Zynq Z-7010 device are hardware programmed on the board. They are evaluated by the Zynq device soon after the 'POR_B'.signal is deasserted to begin the boot process (see section "Boot Mode Pin Settings" of Xilinx manual UG585).

The TE0722 FPGA board is hardware programmed to boot initially from the on-board QSPI Flash memory U5. The JTAG interface of the module is provided for storing the data to the QSPI Flash memory through the Zynq Table 2: Selecting power-on boot device.

Signals, Interfaces and Pins

I/O Signals on Connectors

Overview of the PL I/O banks signals routed to the external connectors:

Table 32: Zynq SoC PL I/O signals overview

Zynq SoC I/O Banks

Table 3: General overview of Zynq SoC PL/PS I/O banks

JTAG Interface

JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.:

Table 4: JTAG interface signals.

Quad SPI Interface

Quad SPI Flash memory (U5) is connected to the Zynq SoC PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.:

Table 5: Quad SPI interface signals and connections.

SD Card Interface

TE0722 module board has on-board 3.3V SD Card socket (J8) with card detect switch wired to the Zynq SoC PS MIO bank 501, pins MIO28 .. MIO33 and MIO49.

Table 6: SD card interface signals.

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I²C Interface

I²C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devicesPS MIO-bank 501 (MIO36, MIO37) are connected to ambient / proximity light sensor (U4).

Table 7: Zynq SoC I²C interface signals.

Default PS MIO Mapping

Table 8: Default mapping of Zynq PS MIO-bank pinsTable 8: .

On-board Peripherals

Quad SPI Flash Memory

On-board QSPI flash memory (U5) is provided by Cypress Semiconductor Serial Flash Memory S25FL127SABMFV101 with 128 MBit (16 MByte) storage capacity. This non volatile memory is used to store initial configuration data. Besides initial configuration data, remaining free flash memory can be used for user application and data storage.

Proximity and Ambient Light Sensor

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The TE0722-02 Zynq SoC board is equipped with the Si1143 infrared proximity and ambient light sensor. On-board three red LEDs D1, D3 and D5 are connected to the light sensor to use the proximity sensing functionality. For more details and how to configure and use this chip, refer to the Si1141/42/43 data sheet.

Oscillator

The Zynq SoC board one reference clocking signal as system clock provided by on-board oscillator U8:

Table 9: Clock sources overview

On-board LEDs

There are 6 LEDs fitted on the Zynq SoC board. The LEDs are user configurable to indicate for example any system status.

Table 9: .10: LEDs of the board

Connectors

All connectors are for 100mil (2.54mm pitch) headers, all connector locations are in 100mil grid. The module's PCB provides footprints to mount and solder optional pin headers, if those are not factory-fitted on module.

Power and Power-On Sequence

Power Consumption

Power To power-up a module, power supply with minimum current capability of 1A is recommended.

Power Supply

TE0722-02 needs one single power supply with nominal of 3.3V at all variants. Following diagram shows the dependencies of the power supply:

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Figure 4: Module power supply dependencies

Power Consumption

Table 11: Module power consumption

*TBD - To Be Determined.

for system startup is recommended. The maximum power consumption of the module mainly depends on the design running on the Zynq SoC's FPGA and ambient temperature.

Xilinx provide a power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Typical power consumption is to be determined.

Power-On Sequence

... diagram will be here soon ...

Variants Currently in Production

Power-On Sequence

There is no specific or special power-on sequence, single power source is needed as 3.3V as power supply voltage.

Voltage Monitor Circuit

The voltages 1.0V (core voltage) and 3.3V are monitored by the voltage monitor circuit U6, which generates the POR_B reset signal at power-on. A manual reset is also possible by driving the connector pin P1-10 ('NRST') to GND. Leave this pin unconnected or connect to VDD (3.3V) when unused.

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Figure 5: Voltage monitor circuit

Power Rails

Table 12: Board power rails

Bank Voltages

Table 13: Board bank voltages

Variants Currently in Production

Table 814: Module Board variants.

Technical Specifications

Absolute Maximum Ratings

Table 915: Module Board absolute maximum ratings.

Recommended Operating Conditions

Table 10: Module recommended operating conditions.

Table 16: Board recommended operating condition

Physical Dimensions

• Module size: 18 17.9 mm × 51 mm.  Please download the assembly diagram for exact numbers.

• PCB thickness: 1.6 65 mm.

• Highest part on PCB approx. 4 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

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Figure 46: TE0722-02 Board physical dimensions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Revision History

Hardware Revision History

Table 1117: TE0722 module Board hardware revision history.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

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Figure 57: TE0722 module hardware revision number.

Document Change History

Table 1218: Document change history.

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