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  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"

Template Change history:

DateVersionChangesAuthor

3.12
  • Version History
    • changed from list to table
  • all
    • changed title-alignment for tables from left to center
ma

3.11
  • update "Recommended Operating Conditions" section


3.1
  • New general notes for temperature range to "Recommended Operating Conditions"


3.02
  • add again fix table of content with workaround to use it for pdf and wiki
  • Export Link for key features examples
    • Notes for different Types (with and without Main FPGA)
  • Export Link for Signals, Interfaces and Pins examples
    • Notes for different Types (Modul, Modul Hypride, Evalboard, Carrier)


3.01
  • remove fix table of content and page layout ( split page layout make trouble with pdf export)
  • changed and add note to signal and interfaces, to on board periphery section
  • ...(not finished)


3.00
  • → separation of Carrier/Module and evaluation kit TRM


2.15
  • add excerpt macro to key features


2.14
  • add fix table of content
  • add table size as macro



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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
        anchorFigure_anchorname
        title-alignmentcenter
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
        anchorTable_tablename
        title-alignmentcenter
        titleText

        Scroll Table Layout
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        cellHighlightingtrue

        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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-----------------------------------------------------------------------


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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.

Overview

The Trenz Electronic AM0010 module is an industrialgrade module based on AMD Xilinx.

Refer to http://trenz.org/AM0010am0010-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

See examples fro different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures


Excerpt
  • SoC
    • Device: ZU1 / ZU2 / ZU3 / ZU4 / ZU5 1)
    • Engine: CG / EG / EV 1)
    • Speedgrade: -1 / -2 1)
    • Temperature Range: Extended / Industrial 1)
    • Package: SFVC784
  • RAM/Storage
    • 4 GByte DDR4 SDRAM with ECC 2)
    • 8 GByte e.MMC 3)
    • Optional HyperFlash 4)
    • 2 x 64 MByte Serial Flash 5)
    • EEPROM with MAC address
  • On Board
    • Gigabit Ethernet Transceiver
    • USB Transceiver
    • OPTIGA Trust M
    • CryptoAuthentication
    • Oscillator
    • Analog Multiplexer
  • Interface
    • 2 x B2B Connector (ADM6)
      • up to 204 PL IO

      • up to  22 PS MIO

      • 4 GTR
      • 4 GTH (with ZU4 and higher)
      • ETH, USB, I2C, JTAG, ...
  • Power
    • 5 V ... 12 V power supply via B2B Connector needed.
  • Dimension
    • 56.4 mm x 40 mm
  • Notes
    1) Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
    2) Up to 32 GByte are possible with a maximum bandwidth of 2400 MBit/s.
    3) Up to 64 GByte are possible.
    4) Up to 64 MByte are possible.
    5) Up to 2 x 256 MByte are possible.

Block Diagram

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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


Note

Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram


Note

All created DrawIOs  should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD



Scroll Title
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titleAM0010 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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  1. FPGA, U1
  2. DDR4, U2, U3, U9, U12, U14
  3. eMMC, U17
  4. Quad SPI Flash, U6, U7
  5. Connector, J5, J6
  6. Ethernet Transceiver, U8
  7. HyperFlash, U16
  8. EEPROM, U15
  9. OPTIGA Trust M, U27
  10. CryptoAuthentication, U24
  11. USB Transceiver, U10
  12. Oscillator, U13, U14, U30, U31, U32
  13. Analog Multiplexer, U38
  14. Power Supply, U5, U11, U18, U19, U20, U21, U22, U23, U28

Initial Delivery State

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Note

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty



Scroll Title
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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

DDR4 SDRAMnot programmed
eMMCnot programmed
Quad SPI Flashnot programmed

HyperFlash

not programmed


EEPROMnot programmed besides factory programmed MAC address





Signals, Interfaces and Pins

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For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins

Note
  • Table with all connectors and Designtor
  • List of different interfaces per connector
  • IO CNT (for FPGA IOs where functionality can be changed by customer)



Connectors

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Connector TypeDesignatorInterfaceIO CNT 1)Notes
B2BJ5HP104 SE / 48 DIFF
B2BJ5MGT PL4 x MGT (RX/TX)
B2BJ5MGT PL2 x MGT CLK
B2BJ5HD24 SE / 12 DIFF
B2BJ6HP52 SE / 24 DIFF
B2BJ6MGT PS4 x MGT (RX/TX)
B2BJ6MGT PS2 x MGT CLK
B2BJ6HD24 SE / 12 DIFF
B2BJ6MIO2 x I2C
B2BJ6MIO2 x UART
B2BJ6MIO2 x PERST
B2BJ6MIOSDIO
B2BJ6MIOJTAG
B2BJ6MIO4 x GPIO
B2BJ6ETH

B2BJ6USB

1) IO CNT depends on assembly variant. E.g. the MGTs are not available for all FPGAs


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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Test PointSignalNotes
TP1PROG_B#pulled-up to V_IO_CFG
TP2VTT
TP3VTT
TP4VREFA
TP5VREFA
TP60.85V
TP70.85V
TP8DDR_1V2
TP9DDR_1V2
TP10MGTAVCC
TP11MGTAVCC
TP12DDR_2V5
TP13DDR_2V5
TP14PL_VCU_0V9
TP15PL_VCU_0V9
TP161.8V
TP171.8V
TP183.3V_SEQ
TP193.3V_SEQ
TP203.3V
TP213.3V



On-board Peripherals

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example:

Chip/InterfaceDesignatorConnected ToNotes
ETH PHYU10
  • B2B connector J1
  • SoC MIO
Gigabit ETH PHY



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Chip/InterfaceDesignatorConnected ToNotes

DDR4 SDRAM

U2, U3, U9, U12, U14SoC - PS

eMMC

U17SoC - PS

Quad SPI Flash

U6, U7SoC - PSBooting.

Gigabit Ethernet Transceiver

U8SoC - PS

HyperFlash

U16SoC - PL

EEPROM

U15SoC - PS

OPTIGA Trust M

U27SoC - PS

CryptoAuthentication

U24SoC - PS

USB 2 Transceiver

U10SoC - PS

Oscillator

U13SoC - PS135 MHz

Oscillator

U14SoC - PS100 MHz

Oscillator

U30ETH PHY25 MHz

Oscillator

U31USB PHY24 MHz

Oscillator

U32SoC33 MHz

Analog Multiplexer

U38SoCVoltage measuring with Xilinx internal ADC.



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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals



Configuration and System Control Signals

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  • Overview  all Controller signals, like Reset, Boote Mode, JTAG Interface(Connector or USB In case of FTDI)...
  • In case it's connected to CPLD always link to CPLD description and add not from the  current implementation here(in case it's available)


Scroll Title
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titleController signal.

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Connector.Pin

Signal Name

Direction1)Description
J6.A59V_BAT INInput voltage for VCC_PSBATT 2) 3).
J6.B58RST_M2C#OUTModule reset for baseboard peripheral reset.
J6.C53DONEOUTFPGA Signal PS_DONE -signal 2).
J6.C54 MODE0INBoot mode selection/ J6.C55 MODE1INBoot mode selection/ J6.C56 MODE2INBoot mode selection/ J6.C57MODE3MODE0..3INBoot mode selection 2):
  • JTAG
  • QUAD-SPI (32 Bit)
  • SD1 (2.0)
  • eMMC (1.8 V)
  • SD1 LS (3.0)

Supported Modes depends also on used Carrier.

J6.C58PS_SRST#INFPGA system resetSoC Soft Reset 2).
J6.C59PS_POR#IN

SoC Power-on-

reset status

reset 2).

PWR_GOOD deasserts module reset.

J6.D56 / J6.D57DX_P / DX_NIN

Temperature sensing diode pin

J6

.

D57
DX_NIN

When not used, tie to GND.

Temperature sensing diode pin

J6.D58PWR_ENIN / OUT

Power Enable
(Do not tie "PWR_EN" to VDD directly.
This signal could be tied to GND within
this module.)
. Controlled module internally. Can be used to delay power on sequencing or disable power. Tie only to GND or leave floating.

J6.D59PWR_GOODOUTPower good status

1) Direction:

  • IN: Input from the point of view of this board.
  • OUT: Output from the point of view of this board
    .
    J6.D51 / J6.D52 / J6.D54 / J6.D55TDI/TCK/TDO/TMSSignal-dependent

    JTAG configuration and debugging interface.

    JTAG reference voltage: V_IO_CFG

    LED D1 / D2ERR_STATUS / ERR_OUT---PS_STATUS_ERROR_OUT / PS_ERROR_OUT 2).

    1) Direction:

      • IN: Input from the point of view of this board.
      • OUT: Output from the point of view of this board.

    2) See UG1085 for additional information.

    3) See Recommended Operating Conditions.

    Power and Power-On Sequence

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    Enter the default value for power supply and startup of the module here.

    • Order of power provided Voltages and Reset/Enable signals

    Link to Schematics, for power images or more details


    Power Rails

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    List of all Powerrails which are accessible by the customer

    • Main Power Rails and Variable Bank Power



    Scroll Title
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    titleModule power rails.

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    Power Rail Name/ Schematic NameConnector.PinDirection1)Notes
    V_MOD1J5.A7 / J5.A15 / J5.A47 / J5.A55 / J5.B5 / J5.B11 / J5.B17 / J5.B45 / J5.B51 / J5.B57 / J6.C5 / J6.C11 / J6.C17 / J6.D7 / J6.D15IN
    1.8VJ5.C7 / J5.C15 / J6.B7 / J6.B15OUT
    V_IO_W01J5.D3 / J5.D17IN
    V_IO_W3J5.D40IN
    V_IO_W45J5.D43 / J5.D57IN
    V_IO_X01J6.A3 / J6.A17IN
    V_BATJ6.A59IN
    V_IO_X3J6.B35IN
    3.3VJ6.B59OUT
    V_IO_CFGJ6.C52IN

    1) Direction:

      • IN: Input from the point of view of this board.
      • OUT: Output from the point of view of this board.
    Baseboard Design Hints (needs to be updated)



    Recommended Power up Sequencing

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    List baseboard design hints for final baseboard development.


    -
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    SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
    0---Configuration signal setup.See Configuration and System Control Signals.
    1 1)V_BAT3.3 V
    PriorityNet nameVoltage RangePull-up/downDescriptionNotesPin
    PreparationTDI/TCK/TDO/TMSV_IO_CFG-JTAG interface.J6.D51, J6.D52, J6.D54, J6.D55
    PreparationMODE0...3V_IO_CFG-Boot mode setup. Do not float.

    Hardwiring possible. Consider debug options. Boot Mode options are descriped in AMD Xilinx documentation.

    J6.C54, J6.C55, J6.C56, J6.C57
    PreparationDX_P / DX_N--

    MPSoC temperature measurement.
    When not used, tie to GND.

    J6.D56, J6.D571V_BAT
    -Battery connection.Battery Power Domain usage. When not used, tie to GND
    .Battery Power Domain usage
    .
    J6.A59
    2V_MOD1
    -
    12 V-Main Power supply.

    Main module power supply.

    see table "Module Power Rails"

    3 A recommended. Power consumption depends mainly on design and cooling solution.

    3 1)
    3
    PWR_EN-

    PU 2), 3.3 V


    (on module)

    Power
    enable
    release.
    (Do not tie "PWR_EN" to VDD directly.
    This signal could be tied to GND within
    this module.)
    J6.D58

    Controlled module internally. Can be used to delay power on sequencing or disable power. Tie only to GND or leave floating.

    4
    43.3V / 1.8V--Module generated voltages.see table "Module Power Rails"5
    PWR_GOOD-

    PU 2), 3.3 V


    (on module)

    Power good status.
    J6.D596V_IO_W01 / V_IO_W45 / V_IO_X01 / V_IO_W3 /  V_IO_X3 / V_IO_CFG
    Module power on sequencing finished. Periphery and variable bank voltages can be enabled on carrier.
    5 1)3.3V / 1.8V--

    Module

    bank

    generated output voltages.

    see table "Module Power Rails"

    Voltages are available after PWR_GOOD deassertion.

    These voltages can be used

    • to supply bank voltages,
    • to supply periphery and/or
    • as power good signal to enable external power regulators.

    Important: Consider maximum power consumption.

    5

    V_IO_W01 / V_IO_W45 / V_IO_X01 / V_IO_W3 /  V_IO_X3 /

    7DONEV_IO_CFGPU, V_IO_CFG
    (on module)PL configuration monitoring.This signal states the PL configuration according to AMD Xilinx documentation.J6.C537PS_SRST#V_IO_CFG

    PU, V_IO_CFG
    (on module)

    Module reset.This signal initiate a system reset according to AMD Xilins documentation.J6.C588PS_POR#V_IO_CFGPU,

    V_IO_CFG

    (on module
    3)
    Power-on reset.Needs to held at zero until all PS power supplies meet voltage requirements and the PS_CLK reference is within specification. When deasserted the PS begins the boot process.J6.C598RST_M2C#V_IO_CFG

    PU, 3.3 V
    (on module)

    Baseboard peripheral reset.This signals resets module peripheral and can / should be used for baseboard peripheral reset.J6.B58
    -Module bank voltages.Enable bank voltages after PWR_GOOD deassertion. To achieve minimum current draw and ensure that the I/Os are 3-stated at power-on it is recommended to enable bank voltages before or at the same time as external logic,
    6 1)---Reset handling.

    RST_M2C# delivers external periphery reset. See Configuration and System Control Signals.

    1) (optional)

    2) (on module)

    3) See DS925 for additional information.

    Board to Board Connectors

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    • This section is optional and only for modules.
    • use "include page" macro and link to the general B2B connector page of the module series,

      For example: 6 x 6 SoM LSHM B2B Connectors

      Include Page
      https://wiki.trenz-electronic.de/pages/viewpage.action?pageId=139253650&moved=true
      https://wiki.trenz-electronic.de/pages/viewpage.action?pageId=139253650&moved=true

    Include Page
    Andromeda ADM6/ADF6 B2B Connectors
    Andromeda ADM6/ADF6 B2B Connectors

    Technical Specifications

    Absolute Maximum Ratings *)

    Scroll Title
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    Power Rail Name/ Schematic NameDescriptionMinMaxUnit
    V_MOD1Main input power supply-0.318V
    V_IO_W01HP FPGA Bank 65 voltage-0.5002.000V
    V_IO_W3HD FPGA Bank 24 voltage-0.5003.400V
    V_IO_W45HP FPGA Bank 64 voltage-0.5002.000V
    V_IO_X01HP FPGA Bank 66 voltage-0.5002.000V
    V_BAT 1)FPGA Battery Voltage
    6V
    V_IO_X3HD FPGA Bank 24 voltage-0.5003.400V
    V_IO_CFGPS FPGA Bank 501 and 503 Voltage-0.33.630V

    1) It is possible to use a resistor instead of the LDO but then, consider the different min (-0.500 V) / max (2.000 V) values.

    *) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
       or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.


    Recommended Operating Conditions

    This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)


    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    • Variants of modules are described here: Article Number Information
    • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
    • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
    • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
    • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.


    Scroll Title
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    ParameterMinMaxUnitsReference Document
    V_MOD14.516VSee TPS54A24 and FS1406 datasheets.
    V_IO_W010.9501.900VSee FPGA datasheet.
    V_IO_W31.1403.400VSee FPGA datasheet.
    V_IO_W450.9501.900VSee FPGA datasheet.
    V_IO_X010.9501.900VSee FPGA datasheet.
    V_BAT 1)2.05.5VSee AP7354D datasheet.
    V_IO_X31.1403.400VSee FPGA datasheet.
    V_IO_CFG1.7103.465VSee FPGA datasheet.

    1) Using a resistor instead of the LDO is possible which leads to different min (1.2 V) / max (1.89 V) values.

    Physical Dimensions

    • Module size: 56.4 mm × 40 mm.  Please download the assembly diagram for exact numbers.

    • Mating height with standard connectors: 5 mm.

    PCB thickness: 2 mm.

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    In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

    For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

    https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



    Scroll Title
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    Scroll Ignore


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    Currently Offered Variants 

    Page properties
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    Set correct link to the shop page overview table of the product on English and German.

    Example for TE0706:

        ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

        DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


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    titleTrenz Electronic Shop Overview

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    Trenz shop AM0010 overview page
    English pageGerman page


    Revision History

    Hardware Revision History

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    hiddentrue
    idComments

    Set correct links to download  Carrier, e.g. TE0706 REV02:

      TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

    Note:

    • Date format:  YYYY-MM-DD
    • Example: 

      DateRevisionChangesDocumentation Link
      2020-11-25REV02
      • Resistors R14 and R15 was replaced by 953R (was 5K1)
      • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
      REV02




    Scroll Title
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    titleBoard hardware revision number.


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    Scroll Title
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    titleHardware Revision History

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    DateRevisionChangesDocumentation Link
    -REV01First Production ReleaseREV01


    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

    Document Change History

    Page properties
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    • Note this list must be only updated, if the document is online on public doc!
    • It's semi automatically, so do following
      • Add new row below first

      • Copy "Page Information Macro (date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

      • Metadata is only used of compatibility of older exports


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    titleDocument change history.

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    DateRevisionContributorDescription

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    typeFlat
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    • Recommended Power up Sequencing modified


    v.42

    ED

    • Initial Document

    --

    all

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    infoTypeModified users
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    • --


    Disclaimer

    Include Page
    IN:Legal Notices
    IN:Legal Notices



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    Table of contents

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    outlinetrue