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Table of Contents

Table of Contents

Overview

The carrier board TEB0745 was especially designed and developed for the use of Trenz Electronic module TE0745. 

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Notes :

Key Features

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • Module: Form factor 20 cm x 23,1 cm
    • Trenz Electronic Module TE0745
    • Temperature: -40 to 85 °C
  • On Board: TE0745 Module Socket (3 x Samtec connectors)
    • 24V power supply
    over ARKZ950/2 connecting
    • terminal
    • 1 x EMI Network Filter
    • 3 x Variable Step Down Regulator Module (VDRM) with head sink
    • 2 x Synchronous Buck Regulator
    • 2 x Button (User / Reset)
    • 2 x LED (Green)
  • Interfaces:
    • 1 x XMOD (TE0790) Pin Header (JTAG / UART)
    • 1 x Pin Header (JTAG)
    • 1 x microSD connector
    • 1 x RJ45 Ethernet connector
    • 1 x USB Host Connector
    • 8 x SFP-Connector
    • 6 x Pin Header 50 pol. (FPGA Bank I/O's and Power)
    • 6 x Pin Header 12 pol. (FPGA Bank I/O's and Power)
    • 1 x battery holder
    • 2 x DIP Switch Array (VCC_HR_B / Modi)
  • 2 x Button (User / Reset)
  • 2 x LED (Green)Dimension: 200 mm x 231 mm

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTEB0745 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTExxxx TEB0745 main components


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  1. SFP+ Connector, J4 J6 J8 J10 J13 J15 J18 J20
  2. Board to Board Connector (B2B), J1 J2 J3
  3. RJ45 Gigabit Ethernet connector, J22
  4. SD card connector, J16
  5. USB connector, J41
  6. Push Button, S2 S3
  7. SDIO port expander, U15
  8. Power distribution switch, U4
  9. Battery holder, B1
  10. Mag I3C power, U26 U12 U5
  11. Push bottun switch, S1 S4
  12. Buck regulator, U6 U7
  13. I2C EEPROM, U33
  14. Low voltage chanel I2C switch, U16
  15. Overvoltage, undervoltage, reversesupply protection controller, U13
  16. EMI suppression filter, U29
  17. JTAG interface, J12
  18. Power jack, J31
  19. 8bit IO expandor for I2C bus, U18 U25
  20. Pin Headers J23...26 (Not Assembled)
  21. Pin Headers J27-J28-J32-J36 (Not Assembled)
  22. Pin Headers J37...40 (Not Assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

EEPROMNot ProgrammedEUI-64 number programmed

Can be used for MAC



Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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MODE Signal State

ConnectConnected toB2BStatusBoot Mode

BOOTMODE

S1J2-133OpenQSPI
ShortSD Card


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titleReset process.

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Schematic

Signal
Connected toB2BNote

PS_SRST

J2-152PS Reset
RST_IN_N

Push Button, S2

J2-131
General
Low Active Reset


Signals, Interfaces and Pins

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  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

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titleGeneral PL I/O to B2B connectors information

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onnected
B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 13

48 singel ended, 24 Differential

2 singel ended

C
Connected to Bank 12
JTAG Interface5 single endedTCK, TDI, TMS, TDO, JTAG_EN
SFP+ Connector8 DiffSPF4....7_RX_N/P , SPF4....7_TX_N/P
J2

Ethernet PHY4 Differential
2 single endedPHY_LED0...1
USB1 DifferentialOTG_N/P
Control Signals3 single endedPS_SRST, BOOTMODE, RST_IN_N
Power Control Signal2 single endedPWR_PS_OK, PWR_PL_OK
I2C Bus2 single endedI2C_SDA, I2C_SCL
User I/O4 single endedMIO12...15

J3


User I/O6 Single endedMIO46...51
SD Card Connector6 Single endedSD_CLK, SD_CMD, SD_DAT0...3 (MIO40...45)
SFP+ Connector8 Differential
SPF0
SPF0....3_RX_N/P , SPF0....3_TX_N/P

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XMOD Pin Header

JTAG access to the TEB0745 SoM is available through B2B connector JB1 and JB2. JTAG_EN is connected to J1-138, JTAG_EN can be activated through DIP Switch S1-B2.

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titleJTAG pins connection

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Designator

Connected to

B2B Pin

XMOD Header JB1Note
AMIO15J2-129JB1-3UART
Txd - input
TX - Input to the module
BMIO14J2-127JB1-7UART
Rxd
RX - Output of the module
CTCKJ1-143JB1-4JTAG interface signal
DTDOJ1-145JB1-8JTAG interface signal
FTDIJ1-142JB1-10JTAG interface signal
HTMSJ1-144JB1-12

JTAG interface signal

GRST_IN_NJ2-131JB1-11RESET will be connected to Push Button on JTAG Programmer

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There is a DIP switch, S2, on TE0790 adapter which must be set as following.

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titleI2C Address for RTC Xmod Adapter DIP-Switch Setting Description

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I2C DeviceI2C AddressDesignatorNotes
I2C_EXP0x72U16SFP 0-9
EEPROM0x51U33I/O EXP0x20...27U18...25

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

SD Card Socket

Power supply voltage for SD card holder is 3.3V.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins

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RJ45 Connector

Etherneth Socket is connected to Board to Board (B2B)  JM2.

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anchorTable_OBP_RJ45
titleLAN Transformer

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DIP Switch,S2DefaultDescription
1ONUpdate Mode JTAG access to SC CPLD only
2OFFMust be always in OFF state.
3OFFVIO is supplied from Module
4ON3.3V  from XMOD


SFP+ Connectors

The TEB0745 is equipped with 8 SFP+ Connectors, 

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PinConnected to Notes
SFP+ , J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
TD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TX FAULTIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
TX DISABLE IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF2 IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
LOSIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL


SD Card Socket

Power supply voltage for SD card holder is 3.3V.

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titleSD card interface MIOs and pins

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EEPROM

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anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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DIP Switches

There are two DIP Switches S1,S4.

J2-123
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titleDIP Switch S1

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Designator
SignalsConnected toB2B
Note
Notes
S1A
SD_CLK
BootMode
MIO40
J2-133S1BJTAG_ENJ1-148S1C-S1DPS_SW
J3-150
SD_CMDMIO41J3-152
SD_DAT0MIO42J3-154
SD_DAT1MIO43J3-156
SD_DAT2MIO44J3-158
SD_DAT3MIO45J3-160


RJ45 Connector

Ethernet Socket is connected to Board to Board (B2B)  JM2.

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titleDIP Switch S4LAN Transformer

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Designator
Signal
Connected to
B2B
B2BNote
S4AVADJ_VS2-Connected to 5 V
S4BVADJ_VS1-Connected to 5 V

S4C

VADJ_VS0Connected to 5 V
S4D---

Push Button

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Notes
PHY_MDIO0_PJ2-120
PHY_MDIO_NJ2-122
PHY_MDIO1_PJ2-126
PHY_MDIO1_NJ2-128
PHY_MDIO2_PJ2-132
PHY_MDIO2_NJ2-134
PHY_MDIO3_PJ2-138
PHY_MDIO3_NJ2-140
PHY_LED0J2-144
PHY_LED1J2-146


Test Points

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titleOn-board push button =sTest Points Information

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Designator

Test Point

Connected to
Signals

B2B Connector

Active Level
Notes
NoteS3USR_BTNJ3-153Active high
S2RST_IN_NJ2-131Active highGeneral Reset

LEDs

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anchorTable_OBP_LED
titleOn-board LEDs
TP 15V-
TP 2VBAT_INJ1-146
TP 3VCCIO18VJ2- J3
TP 4VCC_HR_BJ1
TP 5-9GND-
TP 10PS_1.8VJ2
TP 11VCC_HR_BJ1
TP 123.3VJ1- J2
TP 13--
TP 14--
TP 15PWR_PL_OKJ2- 135
TP 16PWR_PS_OKJ2-139
TP 1724V_FUSED-
TP 183.3V_SFP-


On-board Peripherals

...

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
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Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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titleOn board peripherals
Scroll Title
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titlePower Consumption

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

Chip/InterfaceDesignatorNotes
EEPROMU33

DIP Switches

S1, S4
I2C SwitchU16
I/O ExpanderU18...U25
Push ButtonsS2, S3
LEDsD1, D5


EEPROM

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titlePower DistributionI2C EEPROM interface MIOs and pins

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Power-On Sequence

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MIO PinSchematicB2BNotes
MIO10I2C_SCLJ2-119
MIO11I2C_SDAJ2-121



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titlePower SequencyI2C address for EEPROM

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I2C DeviceDesignatorI2C AddressNotes
EEPROMU330x51


DIP Switches

There are two DIP Switches S1,S4.

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titleVoltage Monitor CircuitDIP Switch S1

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Power Rails

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titleModule power rails.

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Power Rail NameVCC / VCCIODirectionNotes
JB13.3VINPL_VIN
VCC_HR_BINVCCIO_12, VCCIO_13
JB2VCCIO18VINVCCIO_34, VCCIO_35
PS_1.8VOUTPWR_OUT
3.3VINPS_3.3V

JB3

VCCIO18VINPWR_IN_VCCIO_33

Bank Voltages

DesignatorConnected toB2BNote
S1-ABootModeJ2-133
S1-BJTAG_ENJ1-148
S1-C-

S1-DPS_SWJ2-123


VCC_HR_B voltage can be selected using DIP Switch S4 .

Scroll Title
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titleDIP Switch S4
Scroll Title
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titleZynq SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes

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S4-1S4-2S4-3S4-4Power VCC_HR_BNotes
OFFOFFOFFN.C.1,8V
OFFOFFONN.C.1,5V
OFFONOFFN.C.3,3V
OFFONONN.C.2,5V
ONOFFOFFN.C.0,8V
ONOFFONN.C.Do not use
ONONOFFN.C.1,25V
ONONONN.C.1,2V


I2C Switch

There is a I2C Switch on the TEB0745 which can be used in order to controll the SPF+ Connectors. 

use "include page" macro and link to the general B2B connector page of the module series,

...

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

  • 3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

    Operating Temperature: -??°C ~ ??°C
    Current Rating: ??A per ContactNumber of Positions: ??
    Number of Rows: ??

Technical Specifications

Absolute Maximum Ratings

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anchorTable_TS_AMR
titlePS absolute maximum ratings

...

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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titleRecommended operating conditions.I2C Switch

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Parameter
Pin
Min
Schematic 
Max
Connected to
Units
Notes
Reference DocumentVSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.

Physical Dimensions

  • Module size: ?? mm × ?? mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
VCC3.3V

SCLI2C_SCLB2B, J2
SDA

I2C_SDA

B2B, J2
nRESETI2C_RSTVoltage Translator, U34
A0GNDLow I2C address is 0x72
A13.3VHighI2C address is 0x72
A2GNDLowI2C address is 0x72
SD0/ SC0SFP0_SDA / SFP0_SDASFP+ Connector, J4
SD1/ SC1SFP1_SDA / SFP1_SDASFP+ Connector, J6
SD2/ SC2SFP2_SDA / SFP2_SDASFP+ Connector, J8
SD3/ SC3SFP3_SDA / SFP3_SDASFP+ Connector, J10
SD4/ SC4SFP4_SDA / SFP4_SDASFP+ Connector, J13
SD5/ SC5SFP5_SDA / SFP5_SDASFP+ Connector, J15
SD6/ SC6SFP6_SDA / SFP6_SDASFP+ Connector, J18
SD7/ SC7SFP7_SDA / SFP7_SDASFP+ Connector, J20
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In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note