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BankTypeConnectorI/O Signal CountVoltageNotes
34HRJ183.3VSignal Schematic names: 'SCL', 'SDA', 'D8' ... 'D13'.
34HRJ283.3VSignal Schematic names: 'RXD', 'TXD', 'D2' ... 'D7'.
34HRJ683.3VSignal Schematic names: 'PIO01' ... 'PIO08'.
34HRJ1113.3VSignal Schematic name: 'AIN_FPGA'.
35HRJ463.3V

Signal Schematic names: 'AIN0' ... 'AIN5', usable as single ended of differential analog input inputs or regular digital I/O's.

35HRJ513.3VConnector dedicated to ESP8266 module.
500MIOJ1073.3VSDIO interface to SD Card socket.
 501MIOJ543.3VConnector dedicated to ESP8266 module  .

Table 2: Overview of the Zynq SoC's PS/PL banks I/O signals

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BankTypeVCCIOI/O Signal CountAvailable on ConnectorsNotes
34HR3.3V44258 user I/O's on Pmod connector J6, female pin header J1 and J2 each. 1 I/O on pin header J11.
35HR3.3V876 user I/O's on female pin header J4, 1 user I/O on female pin header J5.
500PS MIO3.3V15-6 MIO pins used for QSPI flash memory interface, 7 MIO pins used for SD Card interface, 1 MIO pin connected to red LED D2,
1 MIO pin as reset pin routed to USB PHY U18, 'POR_B'-signal is connected to voltage monitor circuit 23.
501PS MIO3.3V16412 MIO pins used for USB ULPI interface, 4 MIO pins used for ESP8266 interface header J5.
0Config3.3V54-4 I/O's are dedicated to JTAG interface, 'PROG_B'-signal is connected to voltage monitor circuit 23.

Table 3: General overview of Zynq SoC PL/PS I/O bank

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Analog differential Input Pin Pair

Connector pin

Connector pinSignal Schematic NameNote
IO_L1P_T0_AD0P_35, pin F12
IO_L1N_T0_AD0N_35, pin E13
J4-3
J4-1
AIN2
AIN0
I/O's also usable in digital mode

IO_L2P_T0_AD8P_35, pin F11
IO_L2N_T0_AD8N_35, pin E12

J4-4
J4-2
AIN3
AIN1
I/O's also usable in digital mode

IO_L3P_T0_DQS_AD1P_35, pin F13
IO_L3N_T0_DQS_AD1N_35, pin F14

J4-6
J4-5
AIN5
AIN4
I/O's also usable in digital mode

Table 12: Auxiliary Analog Inputs of the Zynq device

Note: These 6 auxiliary analog inputs pins are analog inputs are shared with PL bank pins and can be used as regular digital I/O's.

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The TE0723 board is equipped with one push buttons S1:

ButtonSignal Schematic NameConnected toNotes
S1
'
NRST
'
Voltage Monitor Circuit, U23Triggers system reset.

Table 15: Push buttons of the module

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Power consumption is to be determined by the user and depends on SoC's FPGA design and connected hardware.

Board VariantFPGADesignTypical Power, 25°C ambient
TE0723-02XC7Z010-1CLG225CNot configuredTBD*
TE0723-03MXC7Z010-1CLG225CNot configuredTBD*
TE0723-03-07S-1CXC7Z007S-1CLG225CNot configuredTBD*

Table 1516: Module power consumption

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The voltage direction of the power rails is directed at on-board connectors' view:


Header
Main Power Pins DesignatorVCC / VCCIODirectionPinsNotes
J6
J12
VCCIO_33
5VIn
2, 4, 6-

1

.8V

5V power supply pin header.
J33
Out5-2.5VOut3-3
.3VOut
1-J7VCCIO_13
In
2, 4
, 6
On-
board 3.3V voltage level available.
5VIn /
1.8V
Out5On-
2.5VOUt3-3.3VOut1-

Table 20: Power Pin description of VCCIO selection jumper pin header.

board 5.0V voltage level available or supply pin.

Table 17: Main power pin header description


I/O pin header
Main Power Jack and Pins Designator
VCC / VCCIODirectionPinsNotes
J12
J5
5VIN
3.3V
In
Out

1

-J95VINIn / OutA1, A2also usable as '5VIN' power supply to the Carrier Board as alternative to J12J2VBAT_INIn1Attention: Pin 2 connected to ground. VBAT_IN voltage on this pin cause short-circuit.

4, 8

I/O header VCCIO.
J63.3VOut6, 12I/O header VCCIO.

Table 21: Main Power jack and pins description.Table 18: Power pin description of I/O pin header  


Peripheral Socket DesignatorVCC / VCCIODirectionPinsNotes
J10
J8 /
J11
J9USB-VBUSIn / Out1Direction depends on USB2 mode.
J1
J10
VIN33
3.3VOut4MikroSD Card socket VDD.

Table 2219: Power pin description of peripheral connector.

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Power Rail Name

...

J3 Pins

...

Direction

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Bank Voltages

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Table 16: Board power rails

Bank Voltages

Bank

Bank I/O Voltage VCCO

Voltage Range

0 (config)3.3Vfixed500 (MIO)3.3Vfixed501 (MIO)3.3Vfixed

Bank

Bank I/O Voltage VCCO

Voltage Range

0 (config)3.3Vfixed
500 (MIO)3.3Vfixed
501 (MIO)3.3Vfixed
34 (HR)3.3Vfixed
35 (HR)3.3Vfixed

Table 1720: Board bank voltages

Variants Currently in Production

 Board VariantXilinx Zynq SoC

DDR3L SDRAM

ARM Cores

PL Cells

LUTsFlip-Flops

Block RAM

DSP Slices

Zynq SoC Operating Temp.Temp. Range
TE0723-TE0723-02XC7Z010-1CLG225C128 MBytesDual-core28K17,6K35,2K2.1 MBytes800°C to +85°CCommercial
TE0723-03MXC7Z010-1CLG225C512 MBytesDual-core28K17,6K35,2K2.1 MBytes800°C to +85°CCommercial
TE0723-03-07S-1CXC7Z007S-1CLG225C512 MBytesSingle-core23K14,4K28,8K1.8 MBytes660°C to +85°CCommercial

Table 1821: Board variants

Technical Specifications

Absolute Maximum

...

Rating

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.53.6

V

Xilinx datasheet DS187.

Storage temperature

-40

+85

°C

 

Table 19: Board absolute maximum ratings.

Recommended Operating Conditions

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5V power supply voltage

4.755.25

V

USB2.0 VBUS voltage specification
HR PL I/O banks input voltage (VCCIO single ended)-0.4VCCO + 0.55VXilinx datasheet DS187 (VCCO 3.3V nominal)
PS MIO I/O banks input voltage (VCCIO single ended)-0.4VCCO + 0.55VXilinx datasheet DS187 (VCCO 3.3V nominal)
Analog Multiplexer IC pins input voltage03.3VVTI CDx4HC405x data sheet

Storage temperature

-40

+85

°C

WL-SMCW SMD LED data sheet

Table 22: Board absolute maximum ratings

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
5V power supply voltage4.755.25 VUSB2.0 VBUS voltage specification
HR PL I/O banks input voltage (VCCIO single ended)-0.20VCCO + 0.20VXilinx datasheet DS187 (VCCO 3.3V nominal)
PS MIO I/O banks input voltage (VCCIO single ended)-0.20VCCO + 0.20VXilinx datasheet DS187 (VCCO 3.3V nominal)
Analog Multiplexer IC pins input voltage03.3VVTI CDx4HC405x data sheet

Operating Temperature Commercial

0+85°CXilinx datasheet DS190

Table 23: Board recommended operating conditions

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Note
Please check Xilinx datasheet DS187 for complete list of absolute maximum and recommended operating ratings for the Zynq-7 device.

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Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.

Image Modified        Image Modified

Figure 5: Board physical dimensions

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DateRevision

Notes

PCNDocumentation Link
2016-07-1503

Refer to Changes list in Schematic for further details in changes to REV02

-TE0723-03
2015-11-06
02Second Production Release -TE0723-02
 -

01

First Production Release - -

Table 2124: Board hardware revision history

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Figure 6: TE0723 board hardware revision number

Document Change History

Date

Revision

Contributors

Description

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd



Ali Naseri,
Jan Kumann

  • First TRM release

Table 2225: Document change history.

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