08030301 | - | 5 | D | I | 2 | 1 | - | A | S |
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Module type |
TE | Trenz Electronic |
Module name |
08500950 |
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Module Revision |
01 | PCB Revision 1 (initial) |
Series / Cores |
E | C | M | P | H |
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VE-2 | VC-2 | VM-2 | VP-2 | VH-2 |
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Identifier |
A | B | D | F | G | H | K | L | M | N | P |
RSTUVWXYVEAA | B | D | F | G | H | K | L | M | N | P | R | S | T | U | V | W | X | Y | VM |
A | B | D | F | G | H | K | L | M | N | P | R | S | T | U | V | W | X | Y | VP |
B | D | F | G | H | K | L | M | N | P | R | S | T | U | V | W | X | Y | VC | - | Xilinx Versal AI Edge Series (VE) |
135 | 150 | 170 | 180 | 190 | 260 | 280 | - | - | - | - | Xilinx Versal AI Core Series (VC) |
110 | 130 | 140 | 150 | 180 | 220 | 230 | 250 | 290 | - | - | Xilinx Versal Prime Series (VM) |
100 | 105 | 110 | 120 | 140 | 150 | 155 | 170 | 180 | 250 | 280 | Xilinx Versal Premium Series (VP) |
152 | 154 | 158 | 170 | 180 | - | - | - | - | - | - | Xilinx Versal HBM Series (VH) |
Speedgrade, Voltage, Static Screen
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PRSTUVWXYVH3HS |
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Temp range (Tstr. abs. = -65°C to +150°C) |
XC (Standard-Grade) | XA (Automotive-Grade) | XQ (Defense-Grade) |
Extended (0/+100°C) | Industrial (–40/+100°C) | Automotive (–40/125°C) | Industrial (I) | Industrial | Military |
E | I | Q (R - Obsolete) | T | N | M |
DDR memory ( |
TE0803/0807/0808; TE0820/0821: 2x1 | TE0803/0807/0808: 2 GByte | Commercial | 4Gbit - NT5AD256M16D4-HR | #29165 |
TE0820/0821: 1 GByte |
2 | TE0803/0807/0808/0812/0813/0817/08188Gbit K4A8G165WBBIRCTE0820/0821: 2 GByte |
TE0865: 4 GByte + ECC (PS) + 4 GByte (PL) |
AM0010: 4 GByte + ECC |
3 | TE0803/0807/0808: 8 GByte | Commercial | 16Gbit (2 die) - K4AAG165WB-MCRC0CV | #27787 |
TE0820/0821: 4 GByte |
4 | TE0803/0807/0808/0865: 8 GByte | Industrial | 16Gbit - |
MT40A1G16RCBTE0820: 4 GByte |
5 | TE0803/0807/0808: 4 GByte | Automotive | 8Gbit - MT40A512M16JY-083E AAT:B | #30246 |
TE0820/0821: 2 GByte |
6 | TE0803/0807/0808: 8 GByte | Industrial | 16Gbit (2 die) - H5ANAG6NCMR-XNI | #30673 |
TE0820/0821: 4 GByte |
7 | TE0813/TE0817/TE0818: 4 GByte | Industrial | 8GBit - IS43QR16512A-083TBLI | #30714 |
8 | TE0803/0807/0808/0813/0817/0818: 4 GByte TE0820: 2 GByte | Industrial | 8 GBit - K4A8G165WC-BITDTCV | #30211 |
U | TE0802/0823: 1 GByte | Industrial | 8Gbit - IS43LQ32256A-062BLI (LPDDR4) | #29797 |
V | TE0802/0823: 1 GByte | Commercial | 8Gbit - K4F8E304HB-MGCJ (LPDDR4) | #28217 |
X | DDR SODIMM Socket | Y | IC Socket (IC Debug Holder) | Flash memory (2x for all modules except TE0802) |
#30258 | #32484
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Flash memory (QSPI 2x or OSPI)
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- | Not present
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TE0803/0807/0808/0813/0817/0818/0820/0821/0823/0865: 128MByteTE0950: 128 MByte, QSPI dual parallel
| Industrial | 512Mbit - MT25QU512ABB8E12-0SIT | #29292 |
AM0010: 128MByte |
3 | TE0803/0807/0808/0820/0821/0823: 256MByte | Industrial | 1Gbit - MT25QU01GBBB8E12-0SIT | #28264 |
4 | TE0803/0807/0808/0820/0821/0823: 512MByte.TE0802/TE0803/0807/0808/0820/0821/0823: 64MByte | Industrial | 256Mbit - MT25QL256ABA8E12-1SIT | #28856 | TE0950: 256 MByte, OSPI | Industrial | 2Gbit - |
MT25QU02GCBB8E12#28286 | #33972
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Other options (Connectors, custom options) |
Module | Variation | Description |
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TE0950 | A | FPGA is preproduction Die. Standard assembly option with eMMC: 32 GByte - SDINBDG4-32G-XI2 - Industrial - #31139 |
C | Standard assembly option (production die) with eMMC: 32 GByte - SDINBDG4-32G-XI2 - Industrial - #31139. |
5 | TE0803/0807/0808/0820/0821/0823: 64MByte | Automotive | 256Mbit - MT25QU256ABA8E12-0AAT | #30245 |
6 | TE0818/TE0830: 128MByte | Extended | 512MBit - IS25WP512M-RHLE (not supported) | #29423 |
7 | TE0812: 256MByte
| Industrial | 1Gbit - MT25QL01GBBB8E12-0SIT
| #29992 |
8 | TE0812: 256MByte | Automotive | 1Gbit - MT25QL01GBBB8E12-0AUT | #32363 |
9 | TE0812: 128MByte | Industrial | 512Mbit - MT25QL512ABB8E12-0SIT | #28934 |
eMMC (for TE0820/0821/0823) | - | Not present (for TE0803/07/08/13/17/18) | - | - | - |
0 | Not populated (for TE0820/0821/0823) | - | - | - |
F | TE00820/0821/0823: 8 GByte | Industrial | 8GByte - IS21ES08G-JCLI | #29169 (EOL)
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G | TE00820/0821/0823: 8 GByte | Commercial | 8GByte - KLM8G1GETF-B041 | #28669 (NRND) |
H | TE00820/0821/0823/0812: 32 GByte | 32GByte - ?? | ?? | K | TE00820/0821/0823: 64 GByte | Industrial | 64GByte - IS21ES64G-JCLI | #29799 |
M | TE00820/0821/0823/0865/AM0010: 8 GByte | Industrial | 8GByte - SDINBDG4-8G-XI2 | #31133 |
N | TE0812: 64 GByte | Industrial | 32GByte - SDINBDG4-32G-XI2 | #31139 |
P | TE00820/0821/0823/AM0010: 64 GByte | Industrial | 64GByte - SDINBDG4-64G-XI2 | #31140 |
Other options (Connectors, custom options) |
Module | Variation | Description |
All | A | Standard connector height |
L | Low profile connector height |
C | Standard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption) |
D | Low profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption) |
... | Custom assembly variant, look additional table below |
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Additional options |
Blank | No extra options |
S | Starter Kit |
K | With heat spreader |
P | Prototype |
Z | DCDC converter MUN3CAD03-SE instead of TPS82085SIL or MUN12AD03-SE instead of TPS82130SILR (depending on which regulator is used in the original design) |
... | Custom assembly variant, look additional table below |
Module | Variation | Description |
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TE0803 | A | Standard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220 |
L | Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017 |
R | Custom: standard hight connectors, R14 - 487k (PS_1V8 = 3.3V), U6 - SIT8008BI-71-33E-25.000000E, U32 - SiT8008BI-71-33E-33.333333E, U28 DNP, C81 DNP |
C | B2B connectors: standard profile , FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
X | Custom: standard hight connectors, U41 → SBAS70-04LT1G |
TE0807 | A | Standard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220 |
L | Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017 |
C | B2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
X | B2B connectors: standard profile, U41 → SBAS70-04LT1G |
TE0808 | A | Standard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220 |
L | Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017 |
C | B2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
X | B2B connectors: standard profile, U41 → SBAS70-04LT1G |
TE0812 | A | Space grade model |
B | Test model |
TE0820A | Standard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903 | L | Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125 |
C | B2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
I | B2B connectors: standard profile, Ethernet PHY U8 - 88E1512-A0-NNP2I000 DNP, no screws/spacers |
TE0821 | A | Standard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903 |
C | Standard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
L | Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125 |
TE0823 | A | Standard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903, HyperFlash/HyperRAM DNP |
C | Standard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
D | B2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification |
L | Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125 |
TE0830 | A | Standard assembly option PICMG ASP connectors |
TE0850 | A | Standard assembly option |
B | Without FAN |
C | Lanes SATA_R_SL, SATA_R_SCL disconnected from J1. Clock CK (U14/U73) connected to J1 |
TEB0911 | AStandard assembly option |