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Table of Contents |
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Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive an Automotive Xilinx Zynq-7000 7 FPGA, two 100 Mbit Ethernet transceiver transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte DDR3 SDRAM, QSPI Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips.
Within the complete module only Automotive components are installed.
All this in a compact 6 x 6 cm form factor, at the most competitive price.
Refer to http://Refer to http://trenz.org/te0712te0728-info for the current online version of this manual and other available documentation.
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Notes : - List of key features of the PCB
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Block Diagram
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- Xilinx XC7Z020-1CLG484Q (Automotive) [XA7Z014S is available on other assembly options]
- Package: CL/CLG484
- Speed Grade: -1
- Temperature Grade: Expanded (-40 to +128 °C)
- Dual-Core ARM Cortex-A9 MPCore
- DDR3 SDRAM, up to 512MB, up to 1066 Mb/s, connected to PS [different size is available on other assembly options]
- QSPI Flash memory (with XiP support) [different size is available on other assembly options]
- Programmable SIT8918A , PS clock generator
- 2 Kbit serial EEPROM
- Three user LEDs
- CAN transceiver (PHY)
- Temperature compensated RTC (real-time clock)
- 2 x 100 MBit Ethernet transceiver (PHY)
- Board to Board (B2B)
- Plug-on module with 3 x 80-pin Samtec Micro Tiger Eye(TM) high-speed connectors
- I/O Interface
- 42x MIO
- 200x HR
- 128x PS IO
- 0x GTP Transceiver
- 0x GTX Transceiver
- Power Supply
- 12 V power supply with watchdog
- Others:
- Dimensions: 6 x 6 cm
- Rugged for shock and high vibration
- On-board high-efficiency DC-DC converters
- System management and power sequencing
- eFUSE bit-stream encryption
- AES bit-stream encryption
- Evenly-spread supply pins for good signal integrity
Block Diagram
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Main Components
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- DDR3 SDRAM, U1
- Xilinx Automotive XA7Z020-1CLG484Q ,U2
- 100 MBit Ethernet transceiver, U3
- 100 MBit Ethernet transceiver, U10
- User LED Green, D4
- Real Time Clock, U7
- Standard Clock Oscillators, U5
- 64 Kbit I2C EEPROM, U11
- CAN Tranceiver, U16
- QSPI NOR Flash memory, U13
- Standard Clock Oscillators, U14
- Low-Quiescent-Current Programmable Delay Supervisory Circuit, U15
- Low-Quiescent-Current Programmable Delay Supervisory Circuit, U12
- B2B connector , JM2
- B2B connector , JM3
- B2B connector , JM1
FPGA (U2), DDR3 SDRAM (U1) and QSPI (U13) can be varied on other assembly option, for more information contact us.
Initial Delivery State
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title | Initial delivery state of programmable devices on the module |
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Storage Device | Symbol | Content |
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Quad SPI Flash | U13 | Not Programmed | EEPROM | U11 | Not Programmed |
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Configuration Signals
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- Overview of Boot Mode, Reset, Enables,
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title | Boot process. |
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Signal | FPGA Bank | Pin | B2B | Signal State | Boot Mode |
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Boot_R | 500 | E4 | J2-11 | Low | QSPI | High | SD Card |
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Signal | B2B | I/O | Note |
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Reset | J2-7 | Input | Comes from Carrier | RST_OUT | J2-9 | Output | PS_PROB_B |
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Signals, Interfaces and Pins
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- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B) I/Os
TE0728 Module has 3 B2B connectors and every connector has 80 pins (2 row, 40 pins).
FPGA bank number and number of I/O signals connected to the B2B connector:
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title | General PL I/O to B2B connectors information |
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FPGA Bank | Type | B2B Connector | I/O Signal Count | Voltage Level | Notes |
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13 | HR | J1 | 48 Single ended (24 Diff) | VCCO_13 | variable from carrier | 500 | MIO | J1 | 4 Singel ended | 3.3V |
| 501 | MIO | J2 | 38 Singel ended | VMIO1 | variable from carrier | 33 | HR | J3 | 34 Single ended (17 Diff) | 3.3V |
| 35 | HR | J3 J2 | 20 Single ended (10 Diff) 22 Single ended (11 Diff) | 3.3V |
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Ethernet PHY
Ethernet pins connections to Board to Board (B2B). Ethernet components ETH1 and ETH2 are connected to B2B connector J3.
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title | Ethernet PHY B2B connectors. |
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Schematic | ETH1 | ETH2 | Direction | Notes |
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CTREF | J3-57 | J3-25 | In | Magnetics center tap voltage | TD+ | J3-58 | J3-28 | Out | Transfer | TD- | J3-56 | J3-26 | Out |
| RD+ | J3-52 | J3-22 | In | Receive | RD- | J3-50 | J3-20 | In |
| LED1 | J3-55 | J3-23 | Out | LED Yellow on carrier, multiple usage-ACK | LED2 | J3-53 | J3-21 | Out |
| LED3 | J3-51 | J3-19 | Out | LED Green on carrier, multiple usage-Link | POWERDOWN/INT | L21 | R20 | In |
| RESET_N | M15 | R16 | In | Active low PHY Reset |
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CAN PHY
CAN pins connections to Board to Board (B2B).
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Schematic | B2B | Direction | Notes |
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CANH/CANL | J1-2/J1-4 | Inout/Inout |
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JTAG Interface
JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.
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JTAG Signal | B2B Pin |
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TMS | J2-12 | TDI | J2-10 | TDO | J2-8 | TCK | J2-6 |
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MIO Pins
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MIO Pin | Connected to | B2B | Notes |
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MIO0 | MIO0 | - | RTC interrupt | MIO1...MIO6 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | - | SPI Flash | MIO7 | LED RED | - | LED | MIO8/MIO9 | Tx/Rx | - | CAN Transceiver | MIO10...MIO13 | IO_0 ... IO_3 | J1 | GPIO | MIO14/MIO15 | SCL/SDA | - | I2C | MIO16...MIO39 | - | J2 | GPIO | MIO40...MIO48 | CLK, Cmd, Data0...Data3, wp, cd | J2 | SD | MIO48 | PS_MIO48_501 | J2 | LED Red on Carrier | MIO49 | PS_MIO49_501 | J2 | LED Yellow on Carrier | MIO50 | PS_MIO49_501 | J2 | LED Green on Carrier | MIO51 | PS_MIO51_501 | J2 | GPIO | MIO52/MIO53 | UART_Txd / UART_Rxd | J2 | UART transfer/recieve |
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On-board Peripherals
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Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transceiver PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Quad SPI Flash Memory
On-board QSPI flash memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.
Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.
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title | Quad SPI interface MIOs and pins |
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MIO Pin | Schematic | Notes |
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MIO1 | SPI_CS |
| MIO2 | SPI_DQ0/M0 |
| MIO3 | SPI_DQ1/M1 |
| MIO4 | SPI_DQ2/M2 |
| MIO5 | SPI_DQ3/M3 |
| MIO6 | SPI_SCK/M4 |
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RTC
The RTC has an I2C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy.
RTC interrupt is connected to MIO0 connected to Bank 500 through pin G6.
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title | I2C Address for RTC |
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MIO Pin | I2C Address | Designator | Notes |
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MIO14...15 | 0x56 | U7 | Slave address |
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EEPROM
The Microchip Technology Inc. 24xx64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. The 24xx64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.
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title | I2C address for EEPROM |
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MIO Pin | I2C Address | Designator | Notes |
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MIO14...15 | 0x50 | U11 | Slave address |
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LEDs
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Designator | Color | Connected to | Active Level |
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D9 | Green | DONE | Low | D8 | RED | MIO7 | High | D4 | Green | Bank 33 - V18 | High |
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DDR3 SDRAM
The TE0728 SoM has a volatile DDR3 SDRAM, 256Mx16bit (512MB), IC for storing user application code and data. Size of DDR3 can be varied in different assembly versions.
- Part number: NT5CB256M16CP-DIH
- Supply voltage: 1.5V
- Organization: 256M x 16 bits
DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing. The maximum possible speed for DDR3 SDRAM is 1066 Mb/s.
Ethernet
There are two 100 MBit Extreme Temperature Ethernet provided by Texas Instrumen on the board. Datasheet is provided at TI website. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz sources is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.
PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.
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title | Ethernet PHY to Zynq SoC connections |
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Bank | Signal Name | ETH1 | ETH2 | Signal Description |
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34 | ETH-RST | M15 | R16 | Ethernet reset, active-low. | 34 | ETH_COL | L16 | P20 |
| 34 | MDC | P16 | T17 | Ethernet management clock. | 34 | MDIO | M16 | T16 | Ethernet management data. | 34 | ETH_TX_D0 | J22 | N22 | Ethernet transmit data 0. Output to Ethernet PHY. | 34 | ETH_TX_D1 | M17 | P21 | Ethernet transmit data 1. Output to Ethernet PHY. | 34 | ETH_TX_D2 | K21 | P22 | Ethernet transmit data 2. Output to Ethernet PHY. | 34 | ETH_TX_D3 | M22 | R21 | Ethernet transmit data 3. Output to Ethernet PHY. | 34 | ETH_TX_EN | J21 | M21 | Ethernet transmit enable. | 34 | ETH_RX_D0 | L17 | R18 | Ethernet receive data 0. Input from Ethernet PHY. | 34 | ETH_RX_D1 | K18 | R19 | Ethernet receive data 1. Input from Ethernet PHY. | 34 | ETH_RX_D2 | J18 | T18 | Ethernet receive data 2. Input from Ethernet PHY. | 34 | ETH_RX_D3 | J20 | T19 | Ethernet receive data 3. Input from Ethernet PHY. | 34 | ETH_RX_DV | N17 | P15 | Ethernet receive data valid. |
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CAN Transceiver
Controller Area Network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is available in TI website. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps.
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title | CAN Tranciever interface MIOs |
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Bank | Signal name | Notes |
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500 | D - Tx | Driver Input | 500 | R - Rx | Reciever Output |
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Oscillators
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title | Osillators |
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Designator | Description | Frequency | Used as |
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U14 | MEMS Oscillator | 50 MHz | PS_CLK | U5 | MEMS Oscillator | 25 MHz | Ethernet PHY Clock | U7 | RTC (internal oscillator) | 32.768 KHz | CLKOUT of RTC is not connected |
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Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of 2.5A for system startup is recommended.
Power Consumption
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Power Input Pin | Typical Current |
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VIN | TBD* |
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* TBD - To Be Determined
Power Distribution Dependencies
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Power on Sequence
The TE07028 SoM meets the recommended criteria to power up the Xilinx Zynq properly by keeping a specific sequence of enabling the on-board DC-DC converters and regulators dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages. When the U8 and U9 generates PWRGD signal, it turns on the U4 which generates PWRGD_3.3V, it turns on the U6 and it generates PWROK signal which is connected to MR. Whenever the supply voltage for U12 drops down below the threshold it resets the system. Actually it resets the system when all regulators are working.
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Voltage Monitor Circuit
The microprocessor supervisory circuits monitor system voltages asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user adjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.
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Power Rails
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title | Module power rails. |
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Power Signal | B2B JM1 Pin | B2B JM2 Pin | B2B JM3 Pin | Direction | Notes |
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VIN | 1,3 | - | - | Input | Supply voltage from carrier board. | VCCO_13 | 39 | - | - | Input |
| VBATT | - | 1 | - | Output | RTC Supply voltage | 3.3V | 19 | 4 | 25,57 | Output | Internal 3.3V voltage level. | VMIO | - | 2 |
| Input | Variable and supplied by carrier | 1.8V | - | 5 | - | Output | Internal 1.8V voltage level. |
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Bank Voltages
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| Schematic Name | | I/O Type | Notes |
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500 | VCCO_MIO0_500 | 3.3V | MIO |
| 501 | VCCO_MIO1_501 | 2.5V or 3.3V | MIO | supplied by carrier. | 502 | VCCO_DDR_502 | 1.5V | DDR3 |
| 13 | VCCO_13 | 1.8V or 3.3V | HR | Supplied by the carrier board. J1 | 33 | 3.3V | 3.3V | HR | Supplied by carrier board. J3 | 34 | 3.3V | 3.3V | HR |
| 35 | 3.3V | 3.3V | HR | Supplied by the carrier board. J2, J3 |
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Board to Board Connectors
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| 6 x 6 SoM TEM and SEM B2B Connectors |
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| 6 x 6 SoM TEM and SEM B2B Connectors |
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Technical Specifications
Absolute Maximum Ratings
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Symbols | Min | Max | Unit | Description |
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VIN supply voltage | -0.3 | 65 | V | TPS54260-Q1 datasheets. | VMIO | -0.5 | 3.6 | V | PS MIO I/O supply voltage | VCCO | -0.5 | 3.6 | V | PL supply voltage for HR I/O banks | Storage Temperature | -40 | +85 | °C |
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Recommended Operating Conditionse
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anchor | Table_TS_ROC |
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title | Recommended operating conditions |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Symbol | Min | Max | Units | Reference Document |
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VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. | VMIO | 1.71 | 3.465 | V | See Xilinx DS187 data sheet. | VCCO | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. | Operating Temperature | -40 | +105 | °C |
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Physical Dimensions
Module size: 60 mm × 60 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 7 mm.
PCB thickness: 1.6 mm.
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anchor | Figure_TS_PD |
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title | Physical Dimension |
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draw.io Diagram |
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border | false |
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viewerToolbar | true |
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fitWindow | false |
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diagramName | TE0728_MC1 |
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simpleViewer | true |
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links | auto |
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tbstyle | hidden |
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lbox | false |
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diagramWidth | 632 |
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revision | 22 |
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scroll-pdf | true |
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scroll-office | true |
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scroll-chm | true |
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scroll-docbook | true |
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scroll-eclipsehelp | true |
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scroll-epub | true |
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scroll-html | true |
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| Image Added |
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Currently Offered Variants
Main Components
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Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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anchor | Figure_OV_MC |
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title | TE... main components |
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add drawIO object here: Attention if you copy from other page, objects are only linked. |
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image link to the generate drawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
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Initial Delivery State
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anchor | Table_OV_IDS |
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title | Initial delivery state of programmable devices on the module. |
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Storage device name
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Content
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Notes
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Control Signals
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- Overview of Boot Mode, Reset, Enables,
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Signals, Interfaces and Pins
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Notes : - For carrier or stand-alone boards use subsection for every connector typ (add designator on description, not on the subsection title), for example:
- For modules which needs carrier us only classes and refer to B2B connector if more than one is used, for example
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Subsections...
On-board Peripherals
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Notes : - add subsection for every component which is important for design, for example:
- Ethernet PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Subsections...
Power and Power-On Sequence
Power Consumption
Power Distribution Dependencies
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anchor | Figure_PWR_PD |
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title | Power Distribution |
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add drawIO object here: Attention if you copy from other page, objects are only linked. |
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image link to the generate drawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
Power-On Sequence
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anchor | Figure_PWR_PS |
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title | Power Sequency |
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Create DrawIO object here: Attention if you copy from other page, objects are only linked. |
Scroll Only |
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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
Voltage Monitor Circuit
Power Rails
Bank Voltages
Board to Board Connectors
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Technical Specifications
Absolute Maximum Ratings
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anchor | Table_TS_AMR |
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title | Module absolute maximum ratings. |
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Recommended Operating Conditions
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anchor | Table_TS_AMR |
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title | Recommended Operating Conditions. |
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Physical Dimensions
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anchor | Figure_TS_PD |
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title | Physical dimensions drawing |
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anchor | Table_VCP_SO |
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title | Trenz Electronic Shop Overview |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default | style | widths |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Revision History
Hardware Revision History
Product changes can be seen in PCN page.
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anchor | Table_RH_HRH |
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title | Hardware Revision History |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default | style | widths |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Date | Revision | Note | PCN | Documentation Link |
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- | 01 | Prototypes | - | - |
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| Changes |
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| 04 | - U1 DDR3 IC changed from NT5CB256M16CP-DIH to NT5CC256M16CP-DIH
- Net DDR3-ODT0: added series resistor R55
- Added Traceability pad
- Net PS-POR-B: added pull-down resistor R56
| 2015-12-01 | 03 | | 2015-06-12 | 02 | | 2015-03-03 | 01 | |
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anchor | Figure_RH_HRN |
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title | Hardware Revision Number
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Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
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- Note this list must be only updated, if the document is online on public doc!
- It's semi automatically, so do following
Add new row below first Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf PDF export template - Metadata is only used of compatibility of older exports
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anchor | Table_RH_DCH |
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title | Document change history. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default | style |
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widths | sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Date | Revision | Contributor | Description |
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Page info |
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infoType | Modified date |
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dateFormat | yyyy-MM-dd |
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type | Flat |
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| Page info |
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infoType | Current version |
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prefix | v. |
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type | Flat |
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showVersions | false |
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| Page info |
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infoType | Modified by |
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type | Flat |
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showVersions | false |
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| change list | | 2019-05-16 | v. 367 | Pedram Babakhani | | -- | all | Page info |
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infoType | Modified users |
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type | Flat |
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showVersions | false |
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