Page History

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Products Affected

This change affects all Trenz Electronic TEBF0808 SoMsCarrier: TEBF0808-04A*.

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Changes

#1 Restructured input power supply circuit architecture. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 (T4, T5) (signal "12V"). Added input power protection circuit with TVS diode SMBJ20CA (D11, D19).

Type: Schematic Change

Reason: Improve power supply architecture.

Impact: None.Power supplies are separated. It is not possible to supply the board simultaneously with both connectors (J20, J25) at the same time. It is not possible to supply one connector and draw power from the other connector.

#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and #2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: Power supply selection option 1.25 V removed. Increased output current capability. Minor changes in electrical characteristics. (???)

#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased  Increased current output capability. Minor changes in electrical characteristics. (???)

#4 Changed

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DCDCs 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)None. Minor changes in electrical characteristics.

#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)None. Increased current output capability. Minor changes in electrical characteristics.

#6 Changed

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DCDCs EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#8 Changed battery power supply circuit architecture. Changed LDO (U37

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) from TPS780180300 to TPS7A0212PDBVR and diode (D16) from SDMG0340LC-7-F to BAS70-05W.

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Added capacitor (C278), resistor (R269), and assembly option (default: not fitted) resistor (R270). 

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: Reduced voltage level for signal "PSBATT"

Type: Schematic Change

Reason: Change battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.
Impact:  (???)

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#9 Reordered MGT signal connection at each FireFly connector (J6, J21) separately.

Type: Schematic Change

Reason: Improve FireFly handling and harmonize with TEBF0818 series.

Impact: FireFly using custom firmware needs to be adapted by customer.

#10 Changed eMMC (U2) from MTFC4GACAJCN-4M IT to SDINBDG4-8G-XI2.

Type: BOM Schematic change

Reason: EOL of Component.

Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)

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Increased eMMC memory density from 4 GByte to 8 GByte.

#11 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") coming from connector (J2) is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).

Type: Schematic Change

Reason:  Harmonize with TEBF0818 seriesChanged PCIe clock to HCSL.

Impact: None.

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#12 Changed AC coupling (C93/C94

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[REV04A]) to DC coupling (R263/R264

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[REV05]) for differential clock signals "CLK0_N" and "CLK0_P". Removed capacitor (C94).

Type: Schematic Change

Reason: Harmonize with TEBF0818 seriesChanged PCIe clock to HCSL.

Impact: None.

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#13 Changed MEMS oscillator (U10) from SiT8008AI-73-XXS-52.000000E to SiT8008BI-73-XXS-52.000000E.

Type: BOM change

Reason: EOL of Component.

Impact: None. Clock revision changed.

#14 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#15 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: Harmonize with TEBF0818 seriesBOM Optimization.

Impact: None.

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Resistors were not fitted on previous revision.

#16 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#17 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").

Type: Schematic Change

Reason: Improve FireFly handling and harmonize with TEBF0818 seriesFix voltage level for signal "PWROK".

Impact: If FireFly is used custom firmware needs to be adapted by customer.

#16 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").

Type: Schematic Change

None. Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" for signal "PWROK".

#18 Inserted MOSFET (T9) circuit for level shifting and logic level inverting between CPLD (U39) (signal "PSON") and ATX connector (J20) (signal "PS_ON_N").

Type: Schematic Change

Reason: Fix voltage level for signal "PSON".

Reason: Impact: None. Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" .

Impact: None.

#17 Inserted MOSFET (T9) circuit for level shifting and logic level inverting.

Type: Schematic Change

Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 series.

Impact: None. for signal "PSON". Change logic level for signal "PSON". CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.

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#19 Connected all shield signals for connector (J7) together to net "FGND". Removed shield signals (J7) from net "F2GND". Removed capacitor (C261).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#20 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44 [REV04A]) to 1 MOhm resistor (

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R143 [REV05]) and 100 pF capacitor (C149 [REV05]). Removed resistor (R44 [REV04A]).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series. (???)

Impact: None.

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#21 Inserted FGND3 with resistor (R43 [

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REV05]) and capacitor (C93 [REV05]) for SFP+ connector (J14) shield.

Type: Schematic Change

Reason: Improve ESD protection.

Impact: None.

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#22 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws

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, nuts, crimp contacts, and housing (JX1).

Type: BOM change

Reason:  EOL of Component.

Impact: Specified airflow of fan decreases slightly increases from 0.03 028 m³/min to 0.028 155 m³/min. (???)

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Specified acoustic noise increases from 20 dB(A) to 25.3 dB(A). Increased temperature range from (-10 °C - +60 °C) to (-10 °C - +70 °C).

#23 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54

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), temperature sense MMBT3904 (T12), and AND Gate (U55).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#24 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").

Type: Schematic Change

Reason:Fan controller handling.

Impact: None. Assembled fan controller uses I2C address 0x4C.

#25 Changed pin header (J19) from two pins to four pins.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#26 Used resistor (R164) as pull-up resistor for signal "POK_1V8".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#27 Added debounce circuit (R235, C211) for button (S1) and (R236, C213) for button (S2).

Type: Schematic Change

Reason: Improve button behaviour.

Impact: None.

#28 Added pull-up resistor (R228 ... R234) for signal ("PRSNT1", "PERST", "WAKE", "PRSNT2", "PRSNT3", "PRSNT4", "PRSNT5").

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#29 Added pull-up resistor (R293) for signal "I2C_RST".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#30 Added termination resistor assembly option (R134) for differential clock (signals "CLK0_N" and "CLK0_P").

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#31 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.

Type: Schematic Change

Reason:BOM Optimization.

Impact: None.

#32 Changed 1 µH power inductor (L1) from 1.7 A, 20 %, 55 mOhm to 0.7 A, 5 %, 620 mOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#33 Changed power inductor (L2, L6, L13, L14) from 1 µH, 1.7 A, 55 mOhm to 3.3 µH, 1.5 A, 162 mOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#34 Changed power inductor (L8, L9, L11, L12) from 1 µH, 1.7 A, 55 mOhm to 4.7 µH, 1.5 A, 84 mOhm.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#35 Changed ferrid bead (L16, L17) from BKP0603HS121-T to MPZ0603S121HT000.

Type: BOM Change

Reason:EOL of component.

Impact: None.

#36 Changed 33 nF capacitor (C192) from 50 V, 0603 to 25 V, 0402.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#37 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#38 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#23 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").

Type: Schematic Change

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Impact: None. For assembled fan controller I2C address 0x4C is used.

#24 Changed pin header (J19) from two pins to four pins.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None. Consider to use correct pins.

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.

Type: Schematic Change

Reason: Use external pull-up resistorFollow SATA recommendation.

Impact: None.

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#39 Changed capacitor (C69, C70) from 100 nF, 6.3 V, 0201 to 220 nF, 50 V, 0402.

Type: Schematic Change

Reason: Improve button behaviourFollow PCIe recommendation.

Impact: None.

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#40 Changed 220 nF capacitor (C170) from 16 V, X7R to 50 V, X5R.

Type: Schematic Change

Reason:  Harmonize with TEBF0818 seriesBOM Optimization.

Impact: None.

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#41 Changed capacitor (C47, C50, C52, C57, C60, C62) from 470 nF, 6.3 V, 0402 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason:Use external pull-up resistor Follow SFP+ recommendation.

Impact: None.

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#42 Changed 470 nF capacitor (C220) from 0201 to 0402.

Type: Schematic Change

Reason:Harmonize with TEBF0818 series BOM Optimization.

Impact: None.

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#43 Changed

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capacitor (

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C39, C82,

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C207) from

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4.7 µF, 6.3 V to 10 µF, 10 V.

Type:  Schematic Change

Reason: BOM OptimizationHarmonize with TEBF0818 series.

Impact: None.

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#44 Changed

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capacitor (

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C49,

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C51,

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C59,

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C61) from

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10 µF,

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6.

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3 V, 0603 to 22 µF, 25 V, 0805.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

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#45 Changed capacitor (

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C48, C58) from 10 µF, 6.3 V,

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0603 to

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100 nF, 10 V,

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0201.

Type: Schematic Change

Reason: Follow AMD SFP+ recommendation.

Impact: None.

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#46 Changed 10 µF capacitor (

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C11, C12, C13, C15, C18, C20, C34, C63, C136, C204, C239) from 6.3 V

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to

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10 V

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.

Type: Schematic Change

Reason:Follow SATA recommendation Harmonize with TEBF0818 series.

Impact: None.

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#47 Changed capacitor (

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C42,

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C67) from

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47 µF, 6.3 V,

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1206 to

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22 µF,

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25 V,

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0805.

Type: Schematic Change

Reason:Follow PCIe recommendation Harmonize with TEBF0818 series.

Impact: None.

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#48 Changed capacitor

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(C72, C73) from 100 µF, 6.3 V,

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20 % to 22 µF, 25 V, 10 %.

Type: Schematic Change

Reason:  Follow SFP+ recommendationIncreased voltage rating.

Impact: None.

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#49 Changed

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33 Ohm resistor (R7, R13, R19, R68, R103, R112, R128, R151, R168, R189) from 63 mW, 0402 to 50 mW, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendationImprove signal integrity.

Impact: None.

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#50 Changed

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resistor (

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R101, R102,

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R104,

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R105) from

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249 Ohm to 240 Ohm.

Type: Schematic Change

Reason:Harmonize with TEBF0818 series BOM Optimization.

Impact: None.

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#51 Changed

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resistor (R40) from 4.99 kOhm to 0 Ohm.

Type: Schematic Change

Reason:  Follow SFP+ recommendationSet HDMI Hot Plug level properly.

Impact: None.

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#52 Changed

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resistor (

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R27,

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R196) from

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4.99 kOhm to 100 Ohm.

Type: Schematic Change

Reason:Increased voltage rating Harmonize with TEBF0818 series.

Impact: None.

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#53 Changed resistor (

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R14) from 4.99 kOhm to

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2 kOhm.

Type: Schematic ChangeBOM Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#54 Changed pull-up resistor (

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R18, R21, R86, R87, R113, R114, R115, R121 ... R123) from 4.99 kOhm to

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7.5 kOhm.

Type: Schematic Change

Reason: BOM optimizationHarmonize with TEBF0818 series.

Impact: None.

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#55 Changed resistor (

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R41) from 4.99

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kOhm to

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200 kOhm.

Type:BOM Change Schematic Change

Reason:Harmonize with TEBF0818 series Set HDMI Hot Plug level properly.

Impact: None.

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#56 Changed

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resistor (

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R65) from

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8.

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06 kOhm to

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1 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 seriesEnable OTG capability.

Impact: None.

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#57 Added ferrid bead (L25) for fan power supply.

Type: Schematic Change

Reason: Harmonize with TEBF0818 seriesImprove power quality.

Impact: None.

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#58 Added additional decoupling capacitor (C244, C254, C262, C263, C281 ... C287).

Type: Schematic Change

Reason: Enable OTG capabilityImprove power supply.

Impact: None. (???)

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#59 Added

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termination resistor (R277 ... R292).

Type: Schematic Change

Reason: Improve power qualitysignal integrity for FireFly connector (J6, J21).

Impact: None.

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#60 Set LDO TPS79901DRV (U47) and LDO related components, ferrid bead (L20), capacitor (C127) and resistor (R181) to not fitted.

Type: Schematic Change

Reason:Improve power supply  BOM Optimization.

Impact: None.

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#61 Set capacitor (C16, C17) to not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#62 Set resistor (R98, R198)

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to not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#63 Changed net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#64 Changed net name from "

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5VSBIN" to "

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5VSB".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#65 Changed net name from "

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3.3V_MOD" to "

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VCC_MOD".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#66 Added testpoint (TP14, TP16, TP17, TP20 ...

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TP25).

Type: Schematic Change

Reason: Voltage and system Signal monitoring improvement. (???)

Impact: None.

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#67 Changed impedance controlled routing for differential

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PCIe signals (TX/RX) to 90 Ohm differential impedance.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

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#68 Routed signals which are marked

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in schematics as "D100" with 100 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

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#69 Changed CAN bus

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signal net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

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#70 Updated PCB

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rules,

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PCB layout, and PCB layerstack

...

.

Type: PCB Change

Reason: Improve routingboard quality.

Impact: None.

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#71 Added module orientation mark in silkscreen top side.

Type: PCB change

Reason: Improve module orientation visibilityinsertion process.

Impact: None.

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#72 Added UKCA logo.

Type: PCB Change

Reason: Required for export to UK.

Impact: None.

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#73 Changed fiducials to standard fiducial type.

Type: Documentation UpdateSchematic Change

Reason: Documentation improvementUse standard fiducials.

Impact: None.

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#74 Updated schematic sheets from template.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

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#75 Added legal notices, power overview, I2C address table, and

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power voltage range table. Updated block diagram and revision history. Updated page count and order. 

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

Impact: None.

Method of Identification

Production Shipment Schedule

Method of Identification

Production Shipment Schedule

With immediate effect this change takes placeFrom XXXXX, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

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