Page History

Custom_table_size_100

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Module: TRM Name always "TE Series Name" +TRM
Example: "TE0728 TRM"

Template Change history:

Version	Changes	Author
4.1	Minor changes Notes Tables	ED
4.0	Rework for smaller TRM which can be generated faster Reduce Signal Interfaces Pin Reduce On Board Perihery Reduce Power Move Configuration Signals from Overview to own section	JH
3.12	Version History changed from list to table all changed title-alignment for tables from left to center	ma
3.11	update "Recommended Operating Conditions" section
3.1	New general notes for temperature range to "Recommended Operating Conditions"
3.02	add again fix table of content with workaround to use it for pdf and wiki Export Link for key features examples Notes for different Types (with and without Main FPGA) Export Link for Signals, Interfaces and Pins examples Notes for different Types (Modul, Modul Hypride, Evalboard, Carrier)
3.01	remove fix table of content and page layout ( split page layout make trouble with pdf export) changed and add note to signal and interfaces, to on board periphery section ...(not finished)
3.00	→ separation of Carrier/Module and evaluation kit TRM
2.15	add excerpt macro to key features
2.14	add fix table of content add table size as macro

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Important General Note:

If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable

Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)

Figure template:

Scroll Title

anchor	Figure_anchorname
title-alignment	center
title	Text

Scroll Ignore
Create DrawIO object here: Attention if you copy from other page, objects are only linked.

Scroll Only
image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed

Table template:
- Layout macro can be use for landscape of large tables

Scroll Title

anchor	Table_tablename
title-alignment	center
title	Text

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
widths
sortByColumn	1
sortEnabled	false
cellHighlighting	true

Example	Comment
1	2

The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below
- <type>_<main section>_<name>
  - type: Figure, Table
  - main section:
    - "OV" for Overview
    - "SIP" for Signal Interfaces and Pins,
    - "OBP" for On board Peripherals,
    - "PWR" for Power and Power-On Sequence,
    - "B2B" for Board to Board Connector,
    - "TS" for Technical Specification
    - "VCP" for Variants Currently in Production
    - "RH" for Revision History
  - name: custom, some fix names, see below
- Fix names:
  - "Figure_OV_BD" for Block Diagram
  - "Figure_OV_MC" for Main Components
  - "Table_OV_IDS" for Initial Delivery State
  - "Table_PWR_PC" for Power Consumption
  - "Figure_PWR_PD" for Power Distribution
  - "Figure_PWR_PS" for Power Sequence
  - "Figure_PWR_PM" for Power Monitoring
  - "Table_PWR_PR" for Power Rails
  - "Table_PWR_BV" for Bank Voltages
  - "Table_TS_AMR" for Absolute_Maximum_Ratings
  - "Table_TS_ROC" for Recommended_Operating_Conditions
  - "Figure_TS_PD" for Physical_Dimensions
  - "Table_VCP_SO" for TE_Shop_Overview
  - "Table_RH_HRH" for Hardware_Revision_History
  - "Figure_RH_HRN" for Hardware_Revision_Number
  - "Table_RH_DCH" for Document_Change_History
Use Anchor in the document: add link macro and add "#<anchorname>
Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>

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-----------------------------------------------------------------------

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Note for Download Link of the Scroll ignore macro:

Link to the base folder of the module (remove de/ or en/ from the URL):
Example: https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5_Carriers/TE0728/

Scroll Ignore
Download PDF version of this document.

Overview

The Trenz Electronic TE0813 is an industrial grade MPSoC SOM integrating a Xilinx an AMD Zynq^TM UltraScale+^TM, DDR4 SDRAM with 64-Bit width data bus connection, SPI Boot Flash memory for configuration and operation, transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking connections .All this in a compact 5.2 cm x 7.6 cm form factor, at the most competitive price.

Refer to http://trenz.org/te0813-info for the current online version of this manual and other available documentation.

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Notes :

short description of the PCB
Short Link of the wiki resources reference:
- Use short link the Wiki Resource page, for example: http://trenz.org/te0728-info
- List of available short links: https://wiki.trenz-electronic.de/display/CON/Redirects

Key Features

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Note:
'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

→ See examples fro different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures

Excerpt

SoC
- Device: ZU1 / ZU2 / ZU3 / ZU4 / ZU5 ¹⁾
- Engine: CG / EG / EV ¹⁾
- Speedgrade: -1 / -1L / -2 / -2L / -3 ¹⁾
- Temperature Range: Extended / Industrial ¹⁾
- Package: SFVC784
RAM/Storage
- 4 GByte DDR4 SDRAM ²⁾
- 2 x 64 MByte Serial Flash ³⁾
- EEPROM with MAC address
On Board
- Oscillator
Interface
- 4 x B2B Connector (ADM6)
  - up to 204 PL IO
    - HP: 156
    - HD: 24 0 / 48 ⁴⁾
  - up to 65 PS MIO
  - 4 GTR
  - 4 GTH (with ZU4 and higher)
  - I2C, JTAG
Power
- 3 V ... 5 3 V power supply via B2B Connector needed ⁵⁾.
Dimension
- 76 mm x 52 mm
Notes
¹⁾ Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
²⁾ Up to 32 8 GByte are possible with a maximum bandwidth of 2400 MBit/s.
³⁾ Please, take care of the possible assembly options.
⁴⁾ Please, take care of the possible assembly options.⁵⁾ Dependant on the assembly option a higher input voltage may be possible.

Block Diagram

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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

Note
For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

Note

Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram

Note

All created DrawIOs should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD

Scroll Title

anchor	Figure_OV_BD
title-alignment	center
title	TExxxx TE0813 block diagram

Scroll Ignore

draw.io Diagram

border	true

diagramName	TE0813_OV_BD
simpleViewer	falsetrue
width
links	auto
tbstyle	top
diagramDisplayName
lbox	true
diagramWidth	562
revision	57

Scroll Only

Main Components

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Notes :

Picture of the PCB (top and bottom side) with labels of important components
Add List below

Note
For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

Scroll Title

anchor	Figure_OV_MC
title-alignment	center
title	TExxxx TE0813 main components

draw.io Diagram

border	true

diagramName	Figure_OV_MC
simpleViewer	falsetrue
width
links	auto
tbstyle	top
diagramDisplayName
lbox	true
diagramWidth	742741
revision	45

Scroll Only

SoC, U1
DDR4, U2, U3, U9, U12
Quad SPI Flash, U7, U17
Connector, JM1, JM2, JM3, JM4
EEPROM, U28
Clock Generator, U5
Oscillator, U6, U32
Power Supply, U4, U8, U10, U11, U13 ... U16, U18 ... U24, U26, U27, U29 ...U31, U33, U34, U41

Initial Delivery State

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Note

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

Scroll Title

anchor	Table_OV_IDS
title-alignment	center
title	Initial delivery state of programmable devices on the module

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
widths
sortByColumn	1
sortEnabled	false
cellHighlighting	true

Storage device name	Content	Notes
DDR4 SDRAM	not programmed
Quad SPI Flash	not programmed
EEPROM	not programmed besides factory programmed MAC address
Programmable Clock Generator	not programmed

Signals, Interfaces and Pins

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For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins

Note
Table with all connectors and Designator List of different interfaces per connector IO CNT (for FPGA IOs where functionality can be changed by customer)

Connectors

Scroll Title

anchor	Table_SIP_C
title-alignment	center
title	Board Connectors

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
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sortByColumn	1
sortEnabled	false
cellHighlighting	true

HD

Connector Type	Designator	Interface	IO CNT ¹⁾
B2B	JM1	MGT PL	4 x MGT (RX/TX)
B2B	JM1	HP	52 SE / 24 DIFF
B2B	JM2	MGT PS	2 x MGT CLK
B2B	JM2	MGT PS	4 x MGT (RX/TX)
B2B	JM2	CFG	JTAG
B2B	JM2	CFG	I2C
B2B	JM2	CFG	MODE
B2B	JM3	HD	48 SE / 24 DIFF
B2B	JM3	MGT PL	MGT CLK
B2B	JM3	MIO	65 GPIO
B2B	JM4	HP	104 SE / 48 DIFF

¹⁾ IO CNT depends on assembly variant. E.g. the MGTs are not available for all FPGAs

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test Point	Signal	Notes¹⁾
TP1	PWR_PL_OK

¹⁾ Direction:

- IN (C2M): Carrier to Module, means it's an input : Input from the point of view of this board.
- OUT (M2C): Module to Carrier, means it's output : Output from the point of view of this board.

Scroll Title

anchor	Table_SIP_TPs
title-alignment	center
title	Test Points Information

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
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sortByColumn	1
sortEnabled	false
cellHighlighting	true

TP5

Test Point	Signal	Notes¹⁾
TP1	PLL_SCL	pulled-up to PS_1V8
TP2	PLL_SDA	pulled-up to PS_1V8
TP3	GND	DDR4-TEN	pulled-down to GND
TP4	DCDC_2V0
TP5	GND
TP6	PL_1V8
TP7	GND
TP8	GND
TP9	PL_VCCINT_IO
TP10	GND
TP11	PL_VCCINT
TP12	PL_VCU_0V9
TP13	FP_0V85
TP14	PS_1V8
TP15	GND
TP16	DDR_2V5
TP17	DDR_PLL
TP18	DDR_1V2
TP19	PS_GT_1V0
TP20	MGTAVTT
TP21	VTT
TP22	PL_GT_1V15	was PL_GT_1V05 in REV01.
TP23	VREFA
TP24	MGTVCCAUX
TP25	MGTAVCC
TP26	PL_GT_1V45
TP27	PS_PLL
TP28	PS_AVTT
TP29	LP_0V85
TP30	PS_AUX
TP31	PS_AVCC
TP34	POR_B	pulled-up to PS_1V8

¹⁾ Direction:

- IN (C2M): Carrier to Module, means it's an input : Input from the point of view of this board.
- OUT (M2C): Module to Carrier, means it's output : Output from the point of view of this board.

On-board Peripherals

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example:

Chip/Interface	Designator	Connected To	Notes
ETH PHY	U10	B2B connector J1 SoC MIO	Gigabit ETH PHY

Scroll Title

anchor	Table_OBP
title-alignment	center
title	On board peripherals

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
widths
sortByColumn	1
sortEnabled	false
cellHighlighting	true

Chip/Interface	Designator	Connected To	Notes
DDR4 SDRAM	U2, U3, U9, U12	SoC - PS
Quad SPI Flash	U7, U17	SoC - PS	Booting.
EEPROM	U28	B2B - J2	MAC address
Clock Generator	U5	SoC, B2B
Oscillator	U6	Clock Generator	25 MHz
Oscillator	U32	SoC	33.333333 MHz

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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals

Configuration and System Control Signals

Anchor

	Configuration and System Control Signals
	Configuration and System Control Signals

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Overview all Controller signals, like Reset, Boote Mode, JTAG Interface(Connector or USB In case of FTDI)...
In case it's connected to CPLD always link to CPLD description and add not from the current implementation here(in case it's available)

Scroll Title

anchor	Table_OV_CNTRL
title-alignment	center
title	Controller signal.

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
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sortByColumn	1
sortEnabled	false
cellHighlighting	true

,

Connector+Pin	Signal Name	Direction¹⁾	Description
JM1.A45	POR_OVERRIDE	IN	Override power-on reset delay ²⁾.
JM2.A31	ERR_OUT	OUT	PS error indication ²⁾.
JM2.A34	ERR_STATUS	OUT	PS error status ²⁾.
JM2.A35	LP_GOOD	OUT	Low-power domain powered-up. Pulled up to 3.3VIN
JM2.A36	PLL_SCL	IN	I2C clock
JM2.A37	PLL_SDA	IN/OUT	I2C data
JM2.A40	PG_VCU	OUT	Programmable logic powered-up.
JM2.A41	EN_PSGT	IN	Enable GTR transceiver power-up.
JM2.A44 / JM2.A45 / JM2.A46 / JM2.A47	TCK / TDI / TDO / TMS	Signal-dependent	JTAG configuration and debugging interface. JTAG reference voltage: PS_1V8
JM2.B29	PG_PSGT	OUT	GTR transceivers powered-up.
JM2.B30	PROG_B	IN/OUT	Power-on reset ²⁾. Pulled-up to PS_1V8.
JM2.B33	SRST_B	IN	System reset ²⁾. Pulled-up to PS_1V8.
JM2.B34	INIT_B	IN/OUT	Initialization completion indicator after POR ²⁾. Pulled-up to PS_1V8.
JM2.B37	PG_PL	OUT	VCU powered-up.
JM2.B38	EN_FPD	IN	Enable full-power domain power-up.
JM2	.B41	PG_FPD	OUT	Full-power domain powered-up.
JM2.B42	EN_LPD	IN	Enable low-power domain power-up.
JM2.B45	PG_DDR	OUT	DDR power supply powered-up.
JM2.B46	DONE	OUT	PS done signal ²⁾. Pulled-up to PS_1V8.
JM2.B47	EN_DDR	IN	Enable DDR power-up.
JM2.C31	MR	IN	Manual reset.
JM2.C35	EN_PL	IN	Enable programable logic power-up.
JM2.C36	EN_GT_R	IN	Enable GTH/GTY transceiver power-up.
JM2.C44 / JM2.C45 / JM2.C46 / JM2.C47	MODE3..0	IN	Boot mode selection ²⁾: JTAG QUAD-SPI (32 Bit)	......

¹⁾ Direction:

- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.

Power and Power-On Sequence

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Enter the default value for power supply and startup of the module here.

Order of power provided Voltages and Reset/Enable signals

Link to Schematics, for power images or more details

Power Rails

SD1 (2.0) eMMC (1.8 V) SD1 LS (3.0) Supported Modes depends also on used Carrier.
JM2.D33	PG_GT_R	OUT	GTH/GTY Transceivers powered-up.
JM2.D37	PSBATT	IN	PS RTC Battery supply voltage ^{2) 3)}.
JM2.D38	PUDC_B	IN	Enable/Disable internal pull-ups during configuration on all SelectIO pins.
JM2.D45 / JM2.D46	DX_P / DX_N	-	SoC temperatur sensing diode pins ²⁾.

¹⁾ Direction:

- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.

²⁾ See UG1085 for additional information.

Power and Power-On Sequence

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Enter the default value for power supply and startup of the module here.

Order of power provided Voltages and Reset/Enable signals

Link to Schematics, for power images or more details

Power Rails

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List of all Powerrails which are accessible by the customer

Main Power Rails and Variable Bank Power

List of all Powerrails which are accessible by the customer

Main Power Rails and Variable Bank Power

Scroll Title

anchor	Table_PWR_PR
title-alignment	center
title	Module power rails.

scroll-

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Scroll Title

anchor	Table_PWR_PR
title-alignment	center
title	Module power rails.

scroll-tablelayout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
widths
sortByColumn	1
sortEnabled	false
cellHighlighting	true

Power Rail Name/ Schematic Name	Connector

+

.Pin	Direction¹⁾	Notes

¹⁾ Direction:

- IN (C2M): Carrier to Module, means it's an input from the point of view of this board
- OUT (M2C): Module to Carrier, means it's output from the point of view of this board

Recommended Power up Sequencing

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List baseboard design hints for final baseboard development.

Scroll Title

anchor	Table_BB_DH
title-alignment	center
title	Baseboard Design Hints

Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueSequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes

Board to Board Connectors

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This section is optional and only for modules.

VCCO_66	JM1.A32 / JM1.A33	IN
VREF_66	JM1.A41	IN
3.3VIN	JM1.A54 / JM1.A55 / JM1.B55 / JM1.B56	IN
PL_1V8	JM1.C32 / JM1.C33 / JM1.D33 / JM1.D34	OUT
PL_DCIN	JM1.C56 / JM1.C57 / JM1.C58 / JM1.C59 / JM1.C60 / JM1.D56 / JM1.D57 / JM1.D58 / JM1.D59 / JM1.D60	IN
LP_DCDC	JM2.A50 / JM2.A51 / JM2.A52 / JM2.B50 / JM2.B51 / JM2.B52 / JM2.C50 / JM2.C51 / JM2.C52 / JM2.D50 / JM2.D51 / JM2.D52	IN
DCDCIN	JM2.A57 / JM2.A58 / JM2.A59 / JM2.A60 / JM2.B57 / JM2.B58 / JM2.B59 / JM2.B60 / JM2.C57 / JM2.C58 / JM2.C59 / JM2.C60 / JM2.D57 / JM2.D58 / JM2.D59 / JM2.D60 /	IN
PS_BATT	JM2.D37	IN
DDR_1V2	JM2.D47	OUT
PS_1V8	JM2.C34 / JM2.D34 / JM3.A56 / JM3.B56 / JM3.C56 / JM3.D56	OUT
GT_DCDC	JM3.A59 / JM3.A60 / JM3.B59 / JM3.B60 / JM3.C59 / JM3.C60 / JM3.D59 / JM3.D60 /	IN
VCCO_25	JM3.C7 / JM3.C8 / JM3.D8 / JM3.D9	IN
VCCO_26	JM3.C19 / JM3.C20 / JM3.D20 / JM3.D21	IN
VCCO_64	JM4.B21 / JM4.B39	IN
VREF_64	JM4.B30	IN
VCCO_65	JM4.C21 / JM4.C39	IN
VREF_65	JM4.C30	IN

¹⁾ Direction:

- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.

Recommended Power up Sequencing

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List baseboard design hints for final baseboard development.

The power up sequencing highly depends on the use case. In general, it should be possible to enable/disable the processing system (PS) / programmable logic (PL) independently. Furthermore, within the processing logic it should be possible to enable/disable only low-power domain and/or low-power and full-power domain. Additionally, usage of GTR for PS side and GTH/GTY for PL side should be possible. Because of this flexibility the needed parts of the following table needs to be selected individually. For detailed information take a look into schematics.

Scroll Title

anchor	Table_BB_DH

use "include page" macro and link to the general B2B connector page of the module series,

For example: 6 x 6 SoM LSHM B2B Connectors
Include PagePD:6 x 6 SoM LSHM B2B ConnectorsPD:6 x 6 SoM LSHM B2B Connectors

Technical Specifications

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List of all Powerrails which are accessible by the customer

Main Power Rails and Variable Bank Power add boarder one time maximum Rating (Board will damaged)

Absolute Maximum Ratings ^*)

Scroll Title

anchor	Table_TS_AMR
title-alignment	center
title	PS absolute maximum ratings

Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtruePower Rail Name/ Schematic NameDescriptionMinMaxUnitVVVVVVVV°C

^*) Stresses beyond those listed under TE0813 TRM (more or less equal to TE0803 but other connectors) may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under TE0813 TRM (more or less equal to TE0803 but other connectors). Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Variants of modules are described here: Article Number Information
Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

Scroll Title

anchor	Table_TS_ROC
title-alignment	center
title	Recommended operating conditions.Baseboard Design Hints

Scroll Table Layout

orientation	portrait
sortDirection	ASC
repeatTableHeaders	default
style
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sortByColumn	1
sortEnabled	false
cellHighlighting	true

Parameter

Sequence

Min

Max

Units

Reference Document

V

See ???? datasheets.

V

See ???? datasheet.

V

See ???? datasheet.

V

See ???? datasheet.

V

See ???? datasheet.

V

See ???? datasheet.

V

See ???? datasheet.

°C

See ???? datasheet.

Physical Dimensions

Module size: ?? mm × ?? mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Net name	Recommended Voltage Range	Pull-up/down	Description	Notes
0	-	-	-	Configuration signal setup.	See Configuration and System Control Signals.
1 ¹⁾	PSBATT	1.2 V ... 1.5 V	-	Battery connection.	Battery Power Domain usage. When not used, tie to GND.
1 ²⁾	3.3VIN	3.3 V (± 5 %)	-	Management power supply.	Management module power supply. 0.5 A recommended. Consider note ²⁾ for modules with VCU and/or low-power SoC.
2	Processing System (PS):			Procedure for PS starting.
2.1	Low-power domain:			Bring-up for low-power domain PS.
2.1.1	LP_DCDC	3.3 V (± 3 %) ³⁾	-	Low-power domain power supply.	Main module power supply for low-power domain. 5.5 A recommended. Power consumption depends mainly on design and cooling solution.
2.1.2	EN_LPD	-	PU ⁴⁾, 3.3 V	Low-power domain power enable.
2.1.3	LP_GOOD	-	PU ⁴⁾, 3.3 V	Low-power domain power good status.	Module power-on sequencing for low-power domain finished.
2.2	Full-power domain:			Bring-up for full-power domain PS.	Full-power PS domain needs powered low-power PS domain.
2.2.1	DCDCIN	3.3 V (± 5 %) ³⁾		Full-power domain and GTR transceiver power supply.	Main module power supply for full-power domain. 7 A recommended. Power consumption depends mainly on design and cooling solution.
2.2.2	EN_FPD	3.3 V	-	Full-power domain power enable.
2.2.3	PG_FPD	-	PU ⁴⁾, 3.3 V	Full-power domain power good status.	Module power-on sequencing for full-power domain finished.
2.2.4	EN_DDR	3.3 V	-	DDR memory power enable.
2.2.5	PG_DDR		PU ⁴⁾, 3.3 V	DDR memory power good status.	Module power-on sequencing for DDR memory finished.
2.3	GTR Transceiver			Procedure for GTR transceiver starting.	PS transceiver usage needs powered PS (low- and full-power domain).
2.3.1	EN_PSGT	3.3 V	-	GTR transceiver power enable.
2.3.2	PG_PSGT	-	PU ⁴⁾, 3.3 V	GTR transceiver power good status.	Module power-on sequencing for GTR transceiver finished.
2	Programmable Logic (PL)			Procedure for PL starting.	PS and PL can be started independently.
2.1	PL_DCIN	3.3 V (± 5 %) ³⁾ ⁵⁾	-	Programmable logic power supply.	Main module power supply for programmable logic. 12 A recommended. Power consumption depends mainly on design and cooling solution.
2.2	EN_PL	-	PU ⁴⁾, 3.3 V	Programmable logic power enable.
2.3	PG_PL	-	PU ⁴⁾, 3.3 V	Programmable logic power good status.	Module power-on sequencing for programmable logic finished. Periphery and variable bank voltages can be enabled on carrier.
2.4	VCCO_25 / VCCO_26 / VCCO_64 / VCCO_65 / VCCO_66	⁶⁾	-	Module bank voltages.	Enable bank voltages after PG_PL deassertion.
2.5	PG_VCU	-	PU ⁴⁾, 3.3 V	VCU power good status.
3	GTH / GTY Transceiver			Procedure for GTH / GTY transceiver starting.	PL transceiver usage needs powered PL and low-power PS domain.
3.1	GT_DCDC	3.3 V (± 3 %) ³⁾	-	GTH / GTY transceiver power supply.	Main module power supply for GTH / GTY transceiver. 3 A recommended. Power consumption depends mainly on design and cooling solution.
3.2	EN_GT_R	3.3 V	-	GTH / GTY transceiver power enable.
3.3	PG_GT_R	-	PU ⁴⁾, 3.3 V	GTH / GTY transceiver power good status.

¹⁾ (optional)

²⁾ On TE0813 REV01 boards it is necessary for modules with VCU and/or low-power speedgrade to either connect signal EN_PL to voltage 3.3VIN or to enable EN_PL together with 3.3VIN. This should be changed in a newer revision.

³⁾ Dependent on the assembly option a higher input voltage may be possible.

⁴⁾ (on module)

⁵⁾ This value depends highly on DCDC U4. Higher values may be possible with different DCDCs. For more information consult schematic and according datasheets.

⁶⁾ See DS925 for additional information.

Board to Board Connectors

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use "include page" macro and link to the general B2B connector page of the module series,
For example: 6 x 6 SoM LSHM B2B Connectors
Include Page
6 x 6 SoM LSHM B2B Connectors
6 x 6 SoM LSHM B2B Connectors

Include Page

	5.2 x 7.6 UltraSoM+ ADF6 and ADM6 B2B Connectors
	5.2 x 7.6 UltraSoM+ ADF6 and ADM6 B2B Connectors

Technical Specifications

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List of all Powerrails which are accessible by the customer

Main Power Rails and Variable Bank Power add boarder one time maximum Rating (Board will damaged)

Absolute Maximum Ratings ^*)

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Power Rail Name/ Schematic Name	Description	Min	Max	Unit
LP_DCDC	Micromodule Power	-0.300	6.0	V
DCDCIN	Micromodule Power	-0.300	7.0	V
GT_DCDC	Micromodule Power	-0.300	6.0	V
PL_DCIN ¹⁾	Micromodule Power	-0.300	4.5	V
3.3VIN	Micromodule Power	-0.300	3.600	V
PS_BATT	RTC / BBRAM	-0.500	2.000	V
VCCO_25	HD IO Bank power supply	-0.500	3.400	V
VCCO_26	HD IO Bank power supply	-0.500	3.400	V
VCCO_64	HP IO Bank power supply	-0.500	2.000	V
VCCO_65	HP IO Bank power supply	-0.500	2.000	V
VCCO_66	HP IO Bank power supply	-0.500	2.000	V
VREF_64	Bank input reference voltage	-0.500	2.000	V
VREF_65	Bank input reference voltage	-0.500	2.000	V
VREF_66	Bank input reference voltage	-0.500	2.000	V

¹⁾ This value depends on DCDC U4 circuit. If resistor R133 is fitted and R132 is not fitted (default) 7.0 V is allowed. If resistor R133 is not fitted and R132 is fitted only 4.5 V is allowed. For more information consult schematic and according datasheets.

^*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be different depending on assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Variants of modules are described here: Article Number Information
Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

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Parameter	Min	Max	Units	Reference Document
LP_DCDC ¹⁾	3.201	3.399	V
DCDCIN ¹⁾	3.135	3.465	V
GT_DCDC ¹⁾	3.201	3.399	V
PL_DCIN ¹⁾ ^{2) 3)}	3.135	3.465	V
3.3VIN	3.135	3.465	V
PS_BATT	1.2	1.5	V	See FPGA datasheet.
VCCO_25	1.140	3.400	V	See FPGA datasheet.
VCCO_26	1.140	3.400	V	See FPGA datasheet.
VCCO_64	0.95	1.900	V	See FPGA datasheet.
VCCO_65	0.95	1.900	V	See FPGA datasheet.
VCCO_66	0.95	1.900	V	See FPGA datasheet.
VREF_64	0.6	1.2	V	See FPGA datasheet.
VREF_65	0.6	1.2	V	See FPGA datasheet.
VREF_66	0.6	1.2	V	See FPGA datasheet.

¹⁾ Dependent on the assembly option a higher input voltage may be possible.

²⁾ This value depends on DCDC U4 circuit. If resistor R133 is fitted and R132 is not fitted (default) 7.0 V are allowed. If resistor R133 is not fitted and R132 is fitted only 4.5 V are allowed. For more information consult schematic and according datasheets.

³⁾ For U4 either TPS548A28RWWR or MPQ8633BGLE-Z is assembled which is up to Trenz Electronic GmbH.

Physical Dimensions

Module size: 76 mm × 52 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.

PCB thickness: 1.74 mm (± 10 %).

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

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scroll-html	true

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Currently Offered Variants

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0813

DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0813

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Trenz shop TE0813 overview page
English page	German page

Revision History

Hardware Revision History

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Set correct links to download Carrier, e.g. TE0706 REV02:

TE0706-02 -> https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

Date format: YYYY-MM-DD
Example:
Date Revision Changes Documentation Link
2020-11-25 REV02
Resistors R14 and R15 was replaced by 953R (was 5K1)
Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
REV02

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title	Board hardware revision number.

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Date	Revision	Changes	Documentation Link
-	REV02	Change DCDC U11 from EN6347QI to MPM3860GQW-Z and adapted according circuits. Connected DDR4-TEN signals together for U2, U3, U9, and U12 and pulled them low via 499 Ohm resistor R131. Added a testpoint TP3 for DDR4-TEN. Changed voltage rail from 1.35 V to 1.45 V via adapting voltage divider resistors R33 and R38 and changed according voltage rail name PL_GT_1V35 to PL_GT_1V45. Changed voltage rail from 1.05 V to 1.15 V via adaption voltage divider resistors R44 and R46 and changed according rail name PL_GT_1V05 to PL_GT_1V15. Added diode D2 between U41 pin 3 net MR and voltage rail 3.3VIN. Connected enable signal for U11 and U33 from "3.3VIN" to "PG_PL_VCCINT". Added capacitors C137, C147, and C148 for VTT voltage rail. Added resistors R132 (default: not fitted) and R133 to supply U4 VCC either from "PL_DCIN" or from "3.3VIN". Change resistor R92 from 4.22 kOhm to 9.09 kOhm to set current limit to nearly 14.5 A for U4. Added remote sense option: R134 for U30 R135 for U29 R136 for U31 Added decoupling capacitors: C210 and C211 for U5. C190 for U7. C198, C199, and C213 for U8. C153, C170...172 for U9 C196 C197, and C212 for U10. C156 and C157 for U12 C207 and C208 for U14. C189 for U17. C149...152, C205, and C206 for U18 C209 and C217 for U21. C214...216 for U22. C154 and C155 for U24 C188 and C191 for U26. C187 and C195 for U27. C203 and C204 for U34. C201 for U39. C202 for U40. C178 for U41. C200 for U44. Added testpoints TP4, TP19, TP26. Added UKCA logo. Change 100 nF capacitors C135 and C136 from 6.3 V to 25 V for BOM optimization.	REV02
-	REV01	First Production Release	REV01

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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed

Currently Offered Variants

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706

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anchor	Table_VCP_SO
title-alignment	center
title	Trenz Electronic Shop Overview

Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueTrenz shop TEXXXX overview pageEnglish page German page

Revision History

Hardware Revision History

Set correct links to download Carrier, e.g. TE0706 REV02:

TE0706-02 -> https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

Date format: YYYY-MM-DD

Example:

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Date

Revision

Changes

Documentation Link

2020-11-25

REV02

Resistors R14 and R15 was replaced by 953R (was 5K1)
Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)

REV02

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title	Board hardware revision number.

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DateRevisionChangesDocumentation Link

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

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Note this list must be only updated, if the document is online on public doc!
It's semi automatically, so do following
- Add new row below first
- Copy "Page Information Macro (date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template
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Date

Revision

Contributor

Description

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infoType	Modified by
type	Flat
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Updated TRM to REV02.

2023-03-02

v.43

Martin Rohrmüller

Corrected Note 4 about max DDR4 capacity

2023-01-16

v.41

ED

Fixed issue in absolute maximum rating

2023-01-13

v.39

ED

Initial Document<add TRM change list here>

--

all

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type	Flat
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--

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	IN:Legal Notices

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Trenz Electronic Documentation

Page History

Versions Compared

Old Version 9

New Version Current

Key

Overview

Key Features

Block Diagram

Main Components

Initial Delivery State

Initial Delivery State

Signals, Interfaces and Pins

Connectors

Test Points

On-board Peripherals

DDR4 SDRAM

Quad SPI Flash

EEPROM

Clock Generator

Oscillator

Configuration and System Control Signals

Power and Power-On Sequence

Power Rails

Power and Power-On Sequence

Power Rails

Recommended Power up Sequencing

Board to Board Connectors

Recommended Power up Sequencing

Technical Specifications

Absolute Maximum Ratings *)

Recommended Operating Conditions

Physical Dimensions

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings *)

Recommended Operating Conditions

Physical Dimensions

Currently Offered Variants

Revision History

Hardware Revision History

Currently Offered Variants

Revision History

Hardware Revision History

Document Change History

Disclaimer

Table of contents

Absolute Maximum Ratings ^*)

Absolute Maximum Ratings ^*)