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titleTExxxx block diagram


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Main Components

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titleTExxxx main components


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  1. Microsemi Polarfire SoC MPFS250T, U2
  2. 1 GByte LPDDR4 SDRAM, U6
  3. Integrated 10/100/1000 Mbps Energy Efficient Ethernet Transceiver, U7
  4. Highly Integrated Full Featured Hi-Speed USB 2.0 ULPI Transceiver, U11
  5. Lattice Semiconductor MachXO2 System Controller CPLD, U1
  6. B2B Connector Samtec Razor Beam, JM1...3
  7. EEPROM, U10
  8. Serial NOR Flash, U3

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

SPI NOR Flash, U4U3

Not programmed

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EEPROM, U17U10Pre-programmed globally unique MAC

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System Controller CPLD, U1Standard firmware-


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titleGeneral PL SoC I/O to B2B connectors information

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
0JM2
50
181.2 V / 1.35 V / 1.5 V / 1.8 VHSIO dependent on VCCIOD
0JM3161.2 V / 1.35 V / 1.5 V / 1.8 VHSIO dependent on VCCIOD
1
JM2
JM1
18
481.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
HSIO
GPIO dependent on VCCIOB
1
JM3
JM2
20
361.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
HSIO
GPIO dependent on VCCIOB
2
4JM1
62
6 (14)3.3 V
GPIO
MSSIO (14 signals including UART and SDIO)
5JM34-SGMII (1 pairs for TX / 1 pairs for RX)
5
SERDES
JM316-SERDES (4 pairs for TX / 4 pairs for RX)
5JM34-SERDES CLK (2 pairs for RX)



JTAG Interface

JTAG access to the TEM0006 SoM through B2B connector JM2.

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