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Trenz Electronic TEM0007 module is an industrial-grade FPGA micromodule integrating a Microsemi Polarfire SoC FPGA, Gigabit Ethernet PHY, USB 2.0 PHY, LPDDR4 SDRAM, SPI Flash memory for configuration and operation, and power supply. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.
Refer to http://trenz.org/tem0007-info for the current online version of this manual and other available documentation.
up to 118 FPGA IOs
up to 14 MSSIO
Storage device name | Content | Notes |
---|---|---|
LPDDR4 SDRAM | not programmed | |
SPI NOR Flash | not programmed | |
EEPROM | not programmed besides factory programmed MAC address | |
System Controller CPLD, U1 | Standard firmware | See TEM0007 CPLD. |
Connector Type | Designator | Interface | IO CNT | Notes |
---|---|---|---|---|
B2B | JM1 | GPIO | up to 48 SE / 24 DIFF | only 40 SE / 20 DIFF for MPFS025 variants |
B2B | JM1 | MSSIO | 2 x MSSIO | |
B2B | JM1 | I2C or MSSIO | I2C or 2 x MSSIO | |
B2B | JM1 | SDIO or MSSIO | SDIO or 6 x MSSIO | |
B2B | JM1 | UART or MSSIO | 2 x UART or 4 x MSSIO | |
B2B | JM1 | ETH - MDI | ETH | |
B2B | JM2 | HSIO | 18 SE / 9 DIFF | |
B2B | JM2 | GPIO | up to 36 SE / 18 DIFF | only 8 SE / 4 DIFF for MPFS025 variants |
B2B | JM2 | CFG | JTAG | |
B2B | JM3 | HSIO | 16 SE / 8 DIFF | |
B2B | JM3 | SGMII | 1 x SGMII (RX/TX) | |
B2B | JM3 | MGT FPGA | 4 x MGT (RX/TX) | |
B2B | JM3 | MGT CLK | 2 x MGT CLK | |
B2B | JM3 | USB | USB |
Test Point | Signal | Notes |
---|---|---|
TP1 | +3.3V | |
TP2 | +2.5V | |
TP3 | +2.5V_XCVR | |
TP4 | +1.8V | |
TP5 | - | Signal at U17 pin 3. See schematics. |
TP6 | +1.1V_LPDDR4 | |
TP7 | +1.0V | |
TP8 | VDDAUX1 | |
TP9 | AVDD18 | |
TP10 | AVDD33 | |
TP11 | DVDD1V0 | |
TP12 | VCCIOB_SW | |
TP13 | +2.5V_VDDA | |
TP14 | +1.0V_VDDA | |
TP15 | +2.5V_VDD |
Chip/Interface | Designator | Connected To | Notes |
---|---|---|---|
System Controller CPLD | U1 | B2B | |
Gigabit Ethernet | U7 | SoC - MSS | |
USB PHY | U11 | SoC - MSS | |
LPDDR4 SDRAM | U6 | SoC - MSS | |
EEPROM | U10 | SoC - MSS | |
SPI Flash Memory | U3 | SoC - MSS | |
Oscillator | U4 | SoC - MSS | |
Oscillator | U5 | Soc - FPGA | |
Oscillator | U8 | ETH PHY | |
Oscillator | U12 | USB PHY |
Connector+Pin | Signal Name | Direction1) | Description |
---|---|---|---|
JM1-7 | NOSEQ | IN/OUT | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM1-28 | SC_EN1 | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM1-30 | SC_PGOOD | IN/OUT | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM1-32 | SC_BOOTMODE | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM1-89 | JTAGSEL | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM2-18 | SC_nRST | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
JM2-93 / JM2-95 / JM2-97 / JM2-99 | TMS / TDI / TDO / TCK | Signal-dependent | JTAG configuration and debugging interface. JTAG reference voltage: 3.3VIN |
1) Direction:
Power Rail Name/ Schematic Name | Connector + Pin | Direction1) | Notes |
---|---|---|---|
VIN | JM1.1 / JM1.3 / JM1.5 / JM2.2 / JM2.4 / JM2.6 / JM2.8 | IN | Supply voltage from the carrier board |
3.3VIN | JM1.13 / JM1.15 | IN | Supply voltage from the carrier board |
3.3VIN | JM2.91 | OUT | JTAG reference voltage |
+1.8V | JM1.39 | OUT | Internal +1.8V voltage level |
VCCIOB | JM2.1 / JM2.3 | IN | General purpose I/O bank voltage |
VCCIOD | JM2.7 / JM2.9 | IN | High speed I/O bank voltage (max. +1.8 V) |
+3.3V | JM2.10 / JM2.12 | OUT | Internal +3.3 V voltage level |
1) Direction:
Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
---|---|---|---|---|---|
0 | - | - | - | Configuration signal setup. | See Configuration and System Control Signals. |
1 | 3.3VIN | 3.3 V (± 5 %) | - | Management and SoC power supply. | Main module power supply for management and SoC. 3 A recommended. Power consumption depends mainly on design and cooling solution. |
2 | VIN | 3.3 V (± 5 %) 1) | - | Main module power supply. | Main module power supply for management and SoC. 5.5 A recommended. Power consumption depends mainly on design and cooling solution. |
3 | +1.8V | - | - | 1.8 V on-module power supply. | |
4 | VCCIOB / VCCIOD | 2) | - | Module bank voltages. | Enable bank voltages after 1.8 V are available on carrier. |
1) A higher or lower input voltage may be possible.
2) See DS0147 for additional information.
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
Order number | Connector on baseboard | compatible to | Mating height |
---|---|---|---|
23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
12 mm, Differential | 6.5 GHz / 13 Gbps |
5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
File | Modified | |
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PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | 07 04, 2016 by Thorsten Trenz | |
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PDF File lshm_dv.pdf LSHM catalog page | 07 04, 2016 by Thorsten Trenz | |
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PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File REF-189016-01.pdf Technical Drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File REF-189016-02.pdf Technical Drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File REF-189017-01.pdf Technical Drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File REF-189017-02.pdf Technical Drawing | 07 04, 2016 by Thorsten Trenz | |
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PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | 07 04, 2016 by Thorsten Trenz | |
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PDF File tc0929--2611_qua(1).pdf Shock and vibration report | 07 04, 2016 by Thorsten Trenz | |
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Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
---|---|---|---|---|
VIN | Supply voltage | -0.3 | 6.0 | V |
3.3VIN | Supply voltage | -0.3 | 3.75 | V |
VCCIOB | I/O bank voltage | -0.5 | 3.6 | V |
VCCIOD | I/O bank voltage | -0.5 | 2.0 | V |
*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN | 3.135 | 3.465 | V | |
3.3VIN | 3.135 | 3.465 | V | |
VCCIOB | 1.14 | 3.465 | V | See FPGA datasheet. |
VCCIOD | 1.14 | 1.89 | V | See FPGA datasheet. |
1) Higher and lower values may be possible. For more information consult schematic and according datasheets.
Module size: 40 mm × 50 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.74 mm.
Trenz shop TEM0007 overview page | |
---|---|
English page | German page |
Date | Revision | Changes | Documentation Link |
---|---|---|---|
2020-05-26 | 01 | Inital Release | TEM0007-01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Date | Revision | Contributor | Description |
---|---|---|---|
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2023-11-07 | v.45 | ED | Initial Release |
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Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
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WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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