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Overview
The FPGA industrial micromodule integrates a leading edge Xilinx Spartan-3E FPGA, an USB 2.0 microcontroller, configuration Flash, DDR SDRAM and power supplies on a tiny footprint. A large number of configurable I/Os are provided via B2B mini-connectors.
The module is intended to be used as an OEM board, or to be combined with our carrier boards. It is a powerful system widely used for educational and research activities.
Boards with other configurations, larger FPGA's or equipped with industrial temperature grade parts are available on request.
Software for SPI flash programming over USB as well as reference designs for high speed data transfer over USB are included.
Module Options
FPGA options
Module can be ordered with Xilinx Spartan-3E XC3S1200E or XC3S1600E chip.
Module can be ordered with 32, 64 or 128 Mbit SPI Flash chip.
Module can be ordered in commercial or in extended (from -25 C° to +85 C°) temperature grade.
TE0300 Series Overview Chart
model | gates | block-RAM | clock | DDR RAM | temp. |
|---|---|---|---|---|---|
TE0300-01M | 1.2 | 504 | 125 | 512 | comm. |
TE0300-01BM | 1.6 | 648 | 125 | 512 | comm. |
TE0300-01BMLP | 1.6 | 648 | 100 | 512 | comm. |
TE0300-01NR | 1.2 | 504 | 125 | - | comm. |
TE0300-01I | 1.2 | 504 | 125 | 512 | ind. |
TE0300-01IBM | 1.6 | 648 | 125 | 512 | ind. |
TE0300-01IBMLP | 1.6 | 648 | 100 | 512 | ind. |
abbreviations:
- comm. = commercial grade temperature
- ind. = industrial grade temperature
Module Options
FPGA options
Module can be ordered with Xilinx Spartan-3E XC3S1200E or XC3S1600E chip.
- Flash options
Module can be ordered with 32, 64 or 128 Mbit SPI Flash chip. - Temperature grade options
Module can be ordered in commercial or in extended (from -25 C° to +85 C°) temperature grade.
Sample Applications
- Cryptographic hardware module
- Digital signal processing
- Embedded educational platform
- Embedded industrial OEM platform
- Embedded system design
- Emulation platforms
- FPGA graphics
- Image processing
- IP (intellectual property) cores
- Low-power design
- Parallel processing
- Rapid prototyping
- Reconfigurable computing
- System-on-Chip (SoC) development
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Key Features
High-density plug-in Xilinx Spartan-3E module
USB 2.0 interface with high speed (480 Mbit/s) data rate
Large SPI flash for configuration and user storage accessible via USB or SPI connector
Large DDR-SDRAM
FPGA configuration is implemented via JTAG, SPI Flash or USB
3 on-board high-power, high-efficiency, switch-mode DC-DC converters (1 A for each voltage rail: 1.2 V, 2.5 V, 3.3 V)
Power supply via USB or B2B (carrier board)
Flexible expansion via high-density shockproof B2B (board-to-board) connectors
Most I/O's on the B2B connectors are routed as LVDS pairs
Evenly spread supply pins for good signal integrity
Industrial temperature grade available on request
Low-cost, versatile and ruggedized design
Specifications
FPGA: Xilinx Spartan-3E XC3S1200E – XC3S1600E
USB controller: Cypress EZ-USB FX2 USB 2.0 microcontroller CY7C68013A-56LFX
Non volatile memory: 16 MBit - 64 Mbit SPI Flash for FPGA-configuration and user data
Volatile memory: 512 Mbit x 16 DDR SDRAM with up to 666 Mbyte/s
Up to 110 FPGA user I/Os
Supply voltage range: 4.0 V – 5.5 V
1 push-button
1 LED
Small size (only 40.5 mm x 47.5 mm)
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