Page History

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Products Affected

This change affects all Trenz Electronic TE0820 SoMs of Revision 04: TE0820-04*.

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Reason: Updated decoupling capacitor structure according to Xilinx recommendations.

Impact: None. Minor changes in electrical characteristics.

#5 Insert DDR4 testing option (R116, TP9).

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Reason: Improve power management.

Impact: None.

#9 Changed reset, enable and power-up structure with resistor R95, added transistor T2, and added resistor R128.

Type: Schematic Change

Reason: Improve module reset, enable, and power-up.

Impact: Changed Module reset, enable, and power-up handling is modified. That means that "EN1" signal from B2B connector enables DCDC U5 and can be monitored by CPLD U21 pin 27 (assembly option) (backward compatible mode with assembled resistor R95 and signal "EN1" as enable input), or that signal "EN1" only enables DCDC U5 and CPLD U21 pin 27 is connected to signal "POR_B" via voltage translator T2 (normal mode). Normal mode is standard. Therefore, please, verify that the module meets your requierements.

#10 Added voltage level translator U29 and resistor R129 as assembly option to connect signal "PHY_LED1" to SoC.

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Type: Schematic Change

Reason: Change reset voltage threshold from 0.74 V to 0.775 V.

Impact: None. Improve brown-out detection.

#15 Added resistor R132 as assembly option.

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Reason: Added assembly option for DCI.

Impact: None. Not needed for x16 DDR4.

#16 Change R92 to not assembled.

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Reason: R92 is not needed.

Impact: None. Not needed for x16 DDR4.

#17 Added power diagram page.

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