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Variants Currently In Production
Designator / Module Variant | U1 |
|---|
U2 | U3 | R5 | R36 | R38-325-2CB1XC7K325T2FBG676C- | SiT8209AI | EN63A0QI | 10R | - | - | TE0741-SI5338A | SiT8208AI | -- | - | | TE0741-160-2CF | XC7K160T-2FBG676C |
|---|
SI5338A | SiT8208AI | - | - | - | - |
| TE0741-325-2CF | XC7K325T-2FBG676C |
|---|
SI5338ASiT8208AI | -- | - | | TE0741-410-2CF | XC7K325T-2FBG676C |
|---|
SI5338A | SiT8208AI-- | - | | TE0741-070-2IF | XC7K70T-2FBG676I |
|---|
SI5338A | SiT8208AI | - | - | - | - |
| TE0741-160-2IF | XC7K160T-2FBG676I |
|---|
SI5338A | SiT8208AI | - | - | - | - |
| TE0741-325-2IF | XC7K325T-2FBG676I |
|---|
SI5338A | SiT8208AI-- | - | | TE0741-160-2C1 | XC7K160T-2FFG676C |
|---|
SI5338A | SiT8208AI | - | - | -Table 11: Differences between variants of Module TE0741
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| Parameter | Min | Max | Units | Notes |
|---|
VIN supply voltage | -0.3 | 6.5 | V | - |
| 3.3VIN supply voltage | -0.1 | 3.6 | V | - |
| PL IO bank supply voltage for HR I/O Banks (VCCO) | -0.5 | 3.6 | V | - |
| I/O input voltage for HR I/O banks | -0.5 | VCCO_X+0.5 | V | - |
| GT receiver (RXP/RXN) and transmitter (TXP/TXN) | (*) | –0.5 | 1.26(*) | V | * check Xilinx datasheet DS182 |
| Voltage on module JTAG pins | -0.5 | VCCO_0+0.45 | V | VCCO_0 is 3.3V nominal. |
| Storage temperature | -40 | +85 | °C | - |
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Recommended Operation Conditions
| Parameter | Min | Max | Units | Notes | Reference Document |
|---|
| VIN supply voltage | 2.4 | 5.5 | V |
| - | EP53F8QI data sheet |
| 3.3VIN supply voltage |
11145 | Xilinx datasheet DS182| - | MachX02 Family data sheet |
| PL I/O bank supply voltage for HR I/O banks (VCCO) | 1. |
1145 | - | Xilinx datasheet DS182 |
| I/O input voltage for HR I/O Banks |
GND | - | Xilinx datasheet DS182 |
| GT receiver (RXP/RXN) andtransmitter (TXP/TXN) | (*) | (*) | - | - | * check |
| | Xilinx datasheet DS182 |
| Voltage on Module JTAG pins |
114 | - | MachX02 Family data sheet |
Table 13: Recommended operation conditions
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