Page History

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1. Xilinx Zynq UltraScale+ ZU3EG MPSoC, U1
2. 4A power system on a chip (PowerSoC) DC-DC converter, U5
3. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.9V), U9
4. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U13

5. 3A PFET load switch with configurable slew rate, fast transient isolation and hysteresis control, Q1

6. Ultralow supply-current voltage monitor with optional watchdog, U19
7. Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
8. Low power programmable oscillator @ 12.000000 MHz, U11
9. Miniature traceability S/N pad for low-cost, unique product identification
10. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (2.5V), U4
11. 4 Gbit (256 x 16) DDR4 SDRAM, U3
12. 4 Gbit (256 x 16) DDR4 SDRAM, U2
13. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.2V), U15
14. 1.8V, 256 Mbit multiple I/O serial flash memory, U17
15. 1.8V, 256 Mbit multiple I/O serial flash memory, U7
16. Low power programmable oscillator @ 33.333333 MHz, U32
17. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.85V), U12
18. 350 mA, ultra-low VIN, RF low-dropout linear regulator with bias pin, U23
19. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U20
20. B2B connector Samtec Razor Beam™ LSHM-150, JM2
21. 2A peak sink / source DDR termination regulator with VTTREF buffered reference for DDR2, DDR3, DDR3L, and DDR4, U16
22. Low power programmable oscillator @ 52.000000 MHz, U14
23. Highly integrated full featured hi-speed USB 2.0 ULPI   transceiver, U18
24. B2B connector Samtec Razor Beam™ LSHM-130, JM3
25.  I²C programmable, any  frequency , any output  quad clock generator, U10
26. B2B connector Samtec Razor Beam™ LSHM-150, JM1
27. Lattice Semiconductor MachXO2 System Controller CPLD, U21
28. 4 GByte eMMC memory, U6
    

Key features

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• Xilinx Zynq UltraScale+ MPSoC 784 pin package (ZU3EG, option ZU5EV)
• Memory:
  
  • 32-Bit DDR4 - 4 GByte max
  • SPI Boot Flash dual parallel - 512 MByte max
  • 4 GByte eMMC (up to 64 GByte)
• B2B connectors:
  Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips
  
  • 14 x MIO, 132 I/O's x HP (3 banks)
  • Serial transceiver: 4 x serial PS GTR 4transceivers
  • GT Reference clock input
  • PLL for GT Clocks clocks (optional external reference)
  • 1 GBit Gbit Ethernet PHY
  • USB 2.0 OTG PHY
  • Real Time Clock
• Size: 40 x 50 mm
• All power supplies on board.

Initial delivery state

Signals Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the MPSoC's I/O bank and B2B connector:

For detailed information about the pin out, please refer to the Pin-out Table.

JTAG Interface

System Controller I/O Pins

On-board LEDs

Default MIO Mapping

Gigabit Ethernet

USB Interface

I2C Interface

Boot Modes

On-board Peripherals

Processing System (PS) Peripherals

Clocking

Power and Power-on sequence

Power Supply

Power-on sequence

Power Rails

Bank Voltages

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

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Physical Dimensions

• Module size: 40 50 mm × 30 40 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8 mm

• PCB thickness: 1.6 mm

• Highest part on PCB: approximately 2. 5 mm. Please download the step model for exact numbers.

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