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Refer to https://wiki.trenz-electronic.de/display/PD/TE0841+TRM for online version of this manual and additional technical documentation of the product.

 

The Trenz Electronic TE0841-01 is an industrial-grade 4 x 5 cm SoM integrating Xilinx Kintex UltraScale KU035 FPGA, 2 banks of 512 MByte DDR4 SDRAM, 32 MByte QSPI Flash for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at very competitive price. All Trenz Electronic 4 x 5 cm SoMs are mechanically compatible.

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For detailed information about the pin out, please refer to the Pin-out Tables. 

I2C Interface

There are two PL bank 65 IO pins (PLL_SCL and PLL_SDA) reserved as I2C bus connected to the Si5338 PLL quad clock generator. Default Si5338 PLL chip I2C bus slave address is 0x70.

Additionally, two PL bank 65 IO pins (B65_SCL and B65_SDA) connected to the B2B connector JM1 can be used for external I2C connectivity, otherwise these pins are ordinary IOs.

JTAG Interface

JTAG access to the Xilinx Kintex UltraScale FPGA is available through B2B connector JM2.

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Pin NameModeFunctionDefault Configuration
JTAGMODEInputJTAG selectLow for normal operation.
NRST_SC0InputReset 
SC1--Not used by default.
SC2--Not used by default.
SC3--Not used by default.
SC4--Not used by default.

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On-board LEDs

LEDColorConnected toDescription and Notes
D1GreenSystem Controller CPLD, bank 3Exact function is defined by SC CPLD firmware.

I2C Interface

There are two PL bank 65 IO pins (PLL_SCL and PLL_SDA) reserved as I2C bus connected to the Si5338 PLL quad clock generator. Default Si5338 PLL chip I2C bus slave address is 0x70.

Additionally, two PL bank 65 IO pins (B65_SCL and B65_SDA) connected to the B2B connector JM1 can be used for external I2C connectivity, otherwise these pins are ordinary IOs.

On-board Peripherals

Processing System (PS) Peripherals

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 * TBD - To be determined soon with reference design setup.

Power-On Sequence

For highest efficiency of the on-board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

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Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

  

V

-
Supply voltage for HR I/O banks (VCCO)
–0.500
3.400
VSee Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)
–0.500
2.000VSee Xilinx datasheet DS892.
I/O input voltage for HR I/O banks
–0.400
VCCO + 0.550
VSee Xilinx datasheet DS892.
I/O input voltage for HP I/O banks
–0.550
VCCO + 0.550
VSee Xilinx datasheet DS892.
GTH and GTY transceivers receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage
-0.500
1.260
VSee Xilinx datasheet DS892.

Storage temperature

-40

+85

°C

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Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage    
Supply voltage for HR I/O banks (VCCO)1.140
3.400
VSee Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)
0.950
1.890
VSee Xilinx datasheet DS892.
I/O input voltage
–0.200
VCCO + 0.20VSee Xilinx datasheet DS892.
Note
Assembly variants for higher storage temperature range are available on request.

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Date

Revision

Contributors

Description

2017-06-1214
Jan Kumann
Initial document.

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