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All MIO banks are powered from on-module DC-DC power rail. All PL I/O Banks banks have separate VCCO input pins in the B2B connectors, valid VCCO should be supplied from the baseboardcarrier board.

For detailed information about the B2B pin-out, please refer to the Pin-out table. 

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SignalB2B Connector PinFunction
DONEJ2-116PL configuration completed
PROG_BJ2-100PL configuration reset signal
INIT_BJ2-98PS is initialized after a power-on reset
SRST_BJ2-96System reset
MODE0 ... MODE3J2-109/J2-107/J2-105/J2-103

4-bit boot mode pins

For further information about the boot-modes refer to the Xilinx Zynq UltrascaleUltraScale+ MPSoC TRM
section 'Boot and Configuration'.

ERR_STATUS / ERR_OUTJ2-86 / J2-88

ERR_OUT signal is asserted for accidental loss of
power, an error, or an exception in the MPSoC's Platform Management Unit (PMU)

ERR_STATUS indicates a secure lockdown state

PUDC_BJ2-127Pull-up during configuration (pulled-up to 'PL_1V8')

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The boot source of the Zynq UltraScale+ MPSoC can be selected via 4 dedicated pins, which generate a 4-bit code to select the boot mode. The pins are accessible on B2B connector J2:

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Following boot modes are possible on the TE0803 UltraScale+ MPSoC module by generating the corresponding 4-bit code by the with pins 'PS_MODE0' ... 'PS_MODE3' (little-endian alignment):

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For Functional details see  ug1085 - Zynq UltraScale+ TRM (Boot Modes Section).

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 NameICDesignatorPS7MIONotes
SPI FlashN25Q256A11E1240EU7QSPI0MIO0 ... MIO5dual Dual parallel booting possible, 32 MByte memory per Flash IC at standard configuration
SPI FlashN25Q256A11E1240EU17QSPI0MIO7 ... MIO12as As above

Table 10: Peripherals connected to the PS MIO - pins

DDR4 SDRAM

The TE0803-01 SoM is equipped with with four DDR4-2400 SDRAM modules with up to 8 GByte memory density. The SDRAM modules are connected to the Zynq MPSoC's PS DDR - controller (bank 504) with a 64-bit databus data bus width.

Refer to the Xilinx Zynq UltrascaleUltraScale+ data sheet DS925 to get information, if the specific package of the Zynq UltrascaleUltraScale+ MPSoC equipped on module supports the maximum data transmission rate of 2400 MByte/s.

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Note

Si5338A OTP ROM is not programmed by default at delivery, so it is customers responsibility to either configure Si5338A during FSBL or then use SiLabs Silicon Labs programmer and burn the OTP ROM with customer fixed clock setup.

Si5338A OTP can only be programmed two times, as different user configurations may required different setup TE0803 is normally shipped with blank OTP.
For Refer to Si5338A datasheet for more informationSi5338A at SiLabs.

Clocking

The TE0803-01 SoM is equipped with two on-board oscillators to provide the Zynq MPSoC's PS configuration bank 503 with reference clock - signals.

ClockFrequencyBank 503 PinConnected to
PS_CLK33.333333 MHzR16MEMS Oscillatoroscillator, U32
PS_PAD (RTC)32.768 kHzN17/N18Quartz crystal, Y2

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LED ColorConnected toDescription and Notes
D1redRedDONE signal (PS Configuration Bank 503)This LED goes ON when power has been applied to the module and
stays ON until MPSoC's programmable logic is configured properly.

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Table 15: Maximum current of power supplies. *to be determined To Be Determined soon with reference design setup.

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The TE0803 module equipped with the Xilinx Zynq UltrascaleUltraScale+ MPSoC delivers a heterogeneous multi-processing system with integrated programmable logic and independently operable elements and is designed to meet embedded system power management requirement by advanced power management features. This features allow to offset the power and heat constraints against overall performance and operational efficiency.

This features allowing highly flexible power management are achieved by establishing Power Domains for power isolation. The Zynq UltraScale+ MPSoC has multiple power domains, whereby each power domain requires its own particular extern DCDC external DC-DC converters.

The Processing System contains three Power Domains:

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Enable-SignalB2B Connector PinMax. VoltageNote Power-Good-SignalB2B Connector PinPull-up ResistorNote
EN_LPDJ2-1086VTPS82085SIL data sheet LP_GOODJ2-1064K7, pulled up to LP_DCDC-
EN_FPDJ2-102DCDCINNC7S08P5X data sheet PG_FPDJ2-1104K7, pulled up to DCDCIN-
EN_PLJ2-101max PL_DCINleft Left floating for logic high
(drive to GND for logic low)
 PG_PLJ2-104external External pull-up needed (max. voltage 'GT_DCDC'),
maxMax. sink current 1 mA

TPS82085SIL /
NC7S08P5X data sheetdatasheet

EN_DDRJ2-112DCDCINNC7S08P5X data sheet PG_DDRJ2-1144K7, pulled up to DCDCIN-
EN_PSGTJ2-84DCDCINNC7S08P5X data sheet PG_PSGTJ2-82external External pull-up needed (max. 5.5V),
maxMax. sink current 1 mA
TPS74801 data sheetdatasheet
EN_GT_RJ2-95GT_DCDCNC7S08P5X data sheet PG_GT_RJ2-91external External pull-up needed (max. 5.5V),
maxMax. sink current 1 mA
TPS74401 data sheetdatasheet
---- PG_VCU_1V0J2-97

external External pull-up needed (max. 5.5V),
maxMax. sink current 1 mA

TPS82085SIL data sheetdatasheet

Table 16: Recommended operation conditions of DC-DC converter control signals

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All dimensions are given in millimeters.

Image Modified   Image Modified

Revision History

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 DateRevisionNotesLink to PCNDocumentation Link
2016-12-2301First production release-TE0803-01

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