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| Power Input Pin | Typical Current |
|---|---|
| VIN | TBD* |
| 3.3VIN | TBD* |
Table 11: Typical power consumption.
* TBD - To be determined.
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Voltages on B2B Connectors | B2B JM1 Pins | B2B JM2 Pins | Input/Output | Notes |
|---|---|---|---|---|
| VIN | 1, 3, 5 | 2, 4, 6, 8 | Input | Supply voltage. |
| 3.3VIN | 13, 15 | - | Input | Supply voltage. |
| B64_VCO | 9, 11 | - | Input | HR (High Range) bank voltage. |
| B66_VCO | - | 1, 3 | Input | HP (High Performance) bank voltage. |
| B67_VCO | - | 7, 9 | Input | HP (High Performance) bank voltage. |
| B68_VCO | - | 5 | Input | HP (High Performance) bank voltage. |
VBAT_IN | 79 | - | Input | RTC battery supply voltage. |
| 3.3V | - | 10, 12, 91 | Output | Module on-board 3.3V voltage level. |
Table 12: Module power rails.
Board to Board Connectors
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Variants Currently In Production
| Module Variant | FPGA Chip | Temperature Range |
|---|---|---|
| TE0841-01-035-1C | XCKU035-1SFVA784C | Commercial |
TE0841-01-035-1I | XCKU035-1SFVA784I | Industrial |
TE0841-01-035-2I | XCKU035-2SFVA784I | Industrial |
| TE0841-01-040-1C | XCKU040-1SFVA784C | Commercial |
| TE0841-01-040-1I | XCKU040-1SFVA784I | Industrial |
Table 13: Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
VIN supply voltage | V | - | ||
| Supply voltage for HR I/O banks (VCCO) | –0.500 | 3.400 | V | See Xilinx datasheet DS892. |
Supply voltage for HP I/O banks (VCCO) | –0.500 | 2.000 | V | See Xilinx datasheet DS892. |
| I/O input voltage for HR I/O banks | –0.400 | VCCO + 0.550 | V | See Xilinx datasheet DS892. |
I/O input voltage for HP I/O banks | –0.550 | VCCO + 0.550 | V | See Xilinx datasheet DS892. |
| GTH and GTY transceiver reference clocks absolute input voltage (MGT_CLK0, MGT_CLK2) | -0.500 | 1.320 | V | See Xilinx datasheet DS892. |
GTH and GTY transceiver receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage | -0.500 | 1.260 | V | See Xilinx datasheet DS892. |
Storage temperature | -40 | +85 | °C | - |
Table 14: Module absolute maximum ratings.
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN supply voltage | V | |||
| Supply voltage for HR I/O banks (VCCO) | 1.140 | 3.400 | V | See Xilinx datasheet DS892. |
Supply voltage for HP I/O banks (VCCO) | 0.950 | 1.890 | V | See Xilinx datasheet DS892. |
I/O input voltage | –0.200 | VCCO + 0.20 | V | See Xilinx datasheet DS892. |
Table 15: Module recommended operating conditions.
| Note |
|---|
| Assembly variants for higher storage temperature range are available on request. |
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| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| 2015-12-09 | 01 | First production revision | - | TE0841-01 |
Table 16: Hardware revision history.
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
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Date | Revision | Contributors | Description | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Jan Kumann | Initial document. |
Table 17: Document change history.
Disclaimer
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|---|---|---|---|---|
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