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Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

  
-0.37.0

V

EN63A0QI, TPS82085SIL datasheets.
3.3VIN supply voltage-0.13.75VTPS27082, LCMXO2-256HC datasheets.
Supply voltage for HR I/O banks (VCCO)
–0.500
3.400
V
See
Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)
–0.500
2.000V
See
Xilinx datasheet DS892.
I/O input voltage for HR I/O banks
–0.400
VCCO + 0.550
V
See
Xilinx datasheet DS892.
I/O input voltage for HP I/O banks
–0.550
VCCO + 0.550
V
See
Xilinx datasheet DS892.
GTH and GTY transceiver reference clocks absolute input voltage (MGT_CLK0, MGT_CLK2)-0.5001.320V
See
Xilinx datasheet DS892.
GTH and GTY transceiver receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage
-0.500
1.260
V
See
Xilinx datasheet DS892.

Storage temperature

-40

+85

°C

-

Table 14: Module absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage
  V 
2.56.0VTPS82085SIL datasheet.
3.3VIN supply voltage2.3753.6VLCMXO2-256HC datasheet.
Supply voltage for HR I/O banks (VCCO)1.140
3.400
V
See
Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)
0.950
1.890
V
See
Xilinx datasheet DS892.
I/O input voltage
–0.200
VCCO + 0.20V
See
Xilinx datasheet DS892.

Table 15: Module recommended operating conditions.

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 All dimensions are given in millimeters.

 Image Modified       Image Modified
Figure 3: Module physical dimensions.

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