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Technical Specifications

Parameter	Min	Max	Units	Reference Document
VIN supply voltage

-0.3	7.0	V	EN63A0QI, TPS82085SIL datasheets.
3.3VIN supply voltage	-0.1	3.75	V	TPS27082, LCMXO2-256HC datasheets.
Supply voltage for HR I/O banks (VCCO)	–0.500	3.400	V

See

Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)	–0.500	2.000	V

See

Xilinx datasheet DS892.
I/O input voltage for HR I/O banks	–0.400	VCCO + 0.550	V

See

Xilinx datasheet DS892.
I/O input voltage for HP I/O banks	–0.550	VCCO + 0.550	V

See

Xilinx datasheet DS892.
GTH and GTY transceiver reference clocks absolute input voltage (MGT_CLK0, MGT_CLK2)	-0.500	1.320	V

See

Xilinx datasheet DS892.
GTH and GTY transceiver receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage	-0.500	1.260	V

See

Xilinx datasheet DS892.
Storage temperature	-40	+85	°C	-

Table 14: Module absolute maximum ratings.

Parameter	Min	Max	Units	Reference Document
VIN supply voltage

V

	2.5	6.0	V	TPS82085SIL datasheet.
3.3VIN supply voltage	2.375	3.6	V	LCMXO2-256HC datasheet.


Supply voltage for HR I/O banks (VCCO)	1.140	3.400	V

See

Xilinx datasheet DS892.
Supply voltage for HP I/O banks (VCCO)	0.950	1.890	V

See

Xilinx datasheet DS892.
I/O input voltage	–0.200	VCCO + 0.20	V

See

Xilinx datasheet DS892.

Table 15: Module recommended operating conditions.

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All dimensions are given in millimeters.

Image Modified Image Modified
Figure 3: Module physical dimensions.

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