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Table of Contents

Table of Contents

Overview

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Refer to "https://shop.trenz-electronic.de/de/Download/?path=Trenz_Electronic/TE0722/REV02/Documents" for downloadable version of this manual and additional technical documentation of the product.

 

The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx ZYNQ-7000 SoC.

Block Diagram

Main Components

  1. Xilinx ZYNQ XC7Z010 SoC, U1
  2. Micro SD card socket with card detect, J8
  3. Red LED, D3
  4. Green LED, D2
  5. Red LED, D6
  6. 20-pin connector placeholder, P1
  7. Red LED, D5
  8. Proximity/ambient light sensor, U4
  9. RGB LED, D4
  10. Red LED, D1
  11. 20-pin connector placeholder, P2
  12. Ultra-low supply-current voltage monitor, U4
  13. 2 x 5-pin connector placeholder, J1
  14. 2 x 5-pin connector placeholder, J2
  15. 2 x 5-pin connector placeholder, J3
  16. 16 MByte QSPI Flash memory, U5
  17. Low power programmable oscillator @ 33.333333 MHz, U8
  18. 1A PowerSoC DC-DC converter (1.0V), U2
  19. 1A PowerSoC DC-DC converter (1.8V), U3

Key Features

  • Xilinx ZYNQ XC7Z010 SoC
  • 16 MByte QSPI Flash
  • Dual core ARM A9+
  • Micro SD Card socket with card detect signal
  • DIP40 form factor (size 18 x 51 mm)
  • 34 I/Os on DIP40 header pins
  • System status LED (DONE)
  • RGB LED connected to PL I/O
  • Green user LED connected to ARM CPU GPIO
  • Proximity and ambient light sensor

Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

Storage device name

Content

Notes

QSPI Flash

Empty

 

Signals, Interfaces and Pins

I/O Signals

List of signals between PL banks and external connectors:

BankTypeConnectorI/O Signal CountVoltageNotes
34HRP183.3P0 - P7
34HRP283.3P24 - P31
34HRP210, 5 LVDS pairs3.3 
34HRJ163.3X2A - X2F
34HRJ223.3 
34HRJ343.3X1A - X1D
35HRP18, 4 LVDS pairs3.3 

JTAG Interface

JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.

JTAG Signal

J2 Connector Pin

TCK 4
TDI 9
TDO 10
TMS 8

LEDs

LEDColorConnected ToDescription and Notes
D1RedLED2, U4 
D2

Green

MIO7, U1User controlled, default OFF (when PS7 has not been booted).
D3

Red

LED1, U4

 
D4RGB

RGB_R, U1

RGB_G, U1

RGB_B, U1

 
D5RedLED3, U4 

D6

Green

DONE, U1

Reflects inverted DONE signal. ON when FPGA is not configured,

OFF as soon as PL is configured.

Default PS MIO Mapping

MIOFunctionConnector PinNotes
0---
1QSPI-SPI Flash-CS
2QSPI-SPI Flash-DQ0
3QSPI-SPI Flash-DQ1
4QSPI-SPI Flash-DQ2
5QSPI-SPI Flash-DQ3
6QSPI-SPI Flash-SCK
7GPIO-Green LED D2
8---
9---
28SD CARDJ8-5CLK
29SD CARDJ8-3CMD
30SD CARDJ8-7DAT0
31SD CARDJ8-8DAT1
32SD CARDJ8-1DAT2
33SD CARDJ8-2CD/DAT3
36I2C-SCL
37I2C-SDA
39GPIO-Si1143 INT pin
49SD CARDJ8-G4Card detect switch

I2C Interface

On-board I2C interface is provided via ZYNQ SoC PS bank 501 pins MIO36 (SCL) and MIO37 (SDA). I2C addresses for on-board devices are listed in the table below:

I2C DeviceI2C AddressNotes
 Si1143-A11-GMR0x5AProximity and ambient light sensor.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.53.6

V

Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics".

Storage temperature

-40

+85

°C

Silicon Labs Si1141/42/43 datasheet.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
Supply voltage1.143.465 VXilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics".
Note
Assembly variants for higher storage temperature range are available on request.

Physical Dimensions

  • Module size: 18 mm × 51 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 1.6 mm.

  • Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

 

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

... g - Plain module

... g - Set of bolts and nuts

Revision History

Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
2015-10-2302  TE0722-02
 

01

 

  

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.


Document Change History

Date

Revision

Contributors

Description

2017-02-09

Jan Kumann

Initial document.

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