<!--
Template Revision 1.63
(HTML comment will not display, it's not needed to remove them. For Template/Skeleton changes, increase Template Revision number. So we can check faster, if the TRM style is up to date)
-->

Overview

Refer to https://wiki.trenz-electronic.de/display/PD/TE0722+TRM for downloadable version of this manual and additional technical documentation of the product.

The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx Zynq-7000 SoC.

Key Features

• Xilinx Zynq XC7Z010 SoC
• Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
• 16 MByte Quad SPI Flash
• Micro SD Card socket with card detect signal
• 34 I/Os on DIP40 header pins
• System status LED (DONE)
• RGB LED connected to PL I/O
• Green user LED connected to ARM CPU GPIO
• Proximity and ambient light sensor
• DIP40 form factor (size 18 x 51 mm)

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE022-02 block diagram.

Main Components

Figure 2: TE0722-02 PCB top side.

Figure 3: TE0722-02 PCB bottom side.

1. Xilinx Zynq XC7Z010 or Zynq XC7Z007S SoC, U1
2. Micro SD card socket with card detect, J8
3. Red LED, D3
4. Green LED, D2
5. Red LED, D6
6. 20-pin connector placeholder, P1
7. Red LED, D5
8. Proximity/ambient light sensor, U4
9. RGB LED, D4
10. Red LED, D1
11. 20-pin connector placeholder, P2
12. Ultra-low supply-current voltage monitor, U4
13. 2 x 5-pin connector placeholder, J1
14. 2 x 5-pin connector placeholder, J2
15. 2 x 5-pin connector placeholder, J3
16. 16 MByte QSPI Flash memory, U5
17. Low-power programmable oscillator @ 33.333333 MHz, U8
18. 1A PowerSoC DC-DC converter (1.0V), U2
19. 1A PowerSoC DC-DC converter (1.8V), U3

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module

Boot Process

The 7 boot mode strapping pins (MIO2 ... MIO8) of the Xiliny Zynq Z-7010 device are hardware programmed on the board. They are evaluated by the Zynq device soon after the 'POR_B'.signal is deasserted to begin the boot process (see section "Boot Mode Pin Settings" of Xilinx manual UG585).

The TE0722 FPGA board is hardware programmed to boot initially from the on-board QSPI Flash memory U5. The JTAG interface of the module is provided for storing the data to the QSPI Flash memory through the Zynq device.

Signals, Interfaces and Pins

I/O Signals on Connectors

Overview of the PL I/O banks signals routed to the external connectors:

Table 2: Zynq SoC PL I/O signals overview

Zynq SoC I/O Banks

Table 3: General overview of Zynq SoC PL/PS I/O banks

JTAG Interface

JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector:

Table 4: JTAG interface signals

Quad SPI Interface

Quad SPI Flash memory (U5) is connected to the Zynq SoC PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6:

Table 5: Quad SPI interface signals and connections

SD Card Interface

TE0722 board has on-board 3.3V SD Card socket (J8) with card detect switch wired to the Zynq SoC PS MIO bank 501, pins MIO28 .. MIO33 and MIO49.

Table 6: SD card interface signals

I²C Interface

I²C interface pins SCL and SDA from the Zynq SoC PS MIO-bank 501 (MIO36, MIO37) are connected to ambient / proximity light sensor (U4).

Table 7: Zynq SoC I²C interface signals

Default PS MIO Mapping

Table 8: Default mapping of Zynq PS MIO-bank pins

On-board Peripherals

Quad SPI Flash Memory

On-board QSPI flash memory (U5) is provided by Cypress Semiconductor Serial Flash Memory S25FL127SABMFV101 with 128 MBit (16 MByte) storage capacity. This non volatile memory is used to store initial configuration data. Besides initial configuration data, remaining free flash memory can be used for user application and data storage.

Proximity and Ambient Light Sensor

The TE0722-02 Zynq SoC board is equipped with the Si1143 infrared proximity and ambient light sensor. On-board three red LEDs D1, D3 and D5 are connected to the light sensor to use the proximity sensing functionality. For more details and how to configure and use this chip, refer to the Si1141/42/43 data sheet.

Oscillator

The Zynq SoC board one reference clocking signal as system clock provided by on-board oscillator U8:

Table 9: Clock sources overview

On-board LEDs

There are 6 LEDs fitted on the Zynq SoC board. The LEDs are user configurable to indicate for example any system status.

Table 10: LEDs of the board

Connectors

All connectors are for 100mil (2.54mm pitch) headers, all connector locations are in 100mil grid. The module's PCB provides footprints to mount and solder optional pin headers, if those are not factory-fitted on module.

Power and Power-On Sequence

To power-up a module, power supply with minimum current capability of 1A is recommended.

Power Supply

TE0722-02 needs one single power supply with nominal of 3.3V at all variants. Following diagram shows the dependencies of the power supply:

Figure 4: Module power supply dependencies

Power Consumption

Table 11: Module power consumption

*TBD - To Be Determined.

The maximum power consumption of the module mainly depends on the design running on the Zynq SoC's FPGA and ambient temperature.

Xilinx provide a power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power-On Sequence

There is no specific or special power-on sequence, single power source is needed as 3.3V as power supply voltage.

Voltage Monitor Circuit

The voltages 1.0V (core voltage) and 3.3V are monitored by the voltage monitor circuit U6, which generates the POR_B reset signal at power-on. A manual reset is also possible by driving the connector pin P1-10 ('NRST') to GND. Leave this pin unconnected or connect to VDD (3.3V) when unused.

Figure 5: Voltage monitor circuit

Power Rails

Table 12: Board power rails

Bank Voltages

Table 13: Board bank voltages

Variants Currently in Production

Table 14: Board variants

Technical Specifications

Absolute Maximum Ratings

Table 15: Board absolute maximum ratings

Recommended Operating Conditions

Table 16: Board recommended operating condition

Physical Dimensions

• Module size: 17.9 mm × 51 mm.  Please download the assembly diagram for exact numbers.

• PCB thickness: 1.65 mm.

• Highest part on PCB approx. 4 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Figure 6: Board physical dimensions

Revision History

Hardware Revision History

Table 17: Board hardware revision history

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Figure 7: TE0722 module hardware revision number

Document Change History

Date	Revision	Contributors	Description
		Ali Naseri, Jan Kumann	First TRM Release

Table 18: Document change history

Disclaimer