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The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx ZYNQZynq-7000 SoC.

Key Features

  • Xilinx Zynq XC7Z010 SoC
  • Dual core ARM A9+
  • 16 MByte QSPI Flash
  • Micro SD Card socket with card detect signal
  • 34 I/Os on DIP40 header pins
  • System status LED (DONE)
  • RGB LED connected to PL I/O
  • Green user LED connected to ARM CPU GPIO
  • Proximity and ambient light sensor
  • DIP40 form factor (size 18 x 51 mm)

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Main Components

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  1. Xilinx ZYNQ XC7Z010 SoC, U1
  2. Micro SD card socket with card detect, J8
  3. Red LED, D3
  4. Green LED, D2
  5. Red LED, D6
  6. 20-pin connector placeholder, P1
  7. Red LED, D5
  8. Proximity/ambient light sensor, U4
  9. RGB LED, D4
  10. Red LED, D1
  11. 20-pin connector placeholder, P2
  12. Ultra-low supply-current voltage monitor, U4
  13. 2 x 5-pin connector placeholder, J1
  14. 2 x 5-pin connector placeholder, J2
  15. 2 x 5-pin connector placeholder, J3
  16. 16 MByte QSPI Flash memory, U5
  17. Low power programmable oscillator @ 33.333333 MHz, U8
  18. 1A PowerSoC DC-DC converter (1.0V), U2
  19. 1A PowerSoC DC-DC converter (1.8V), U3

Key Features

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Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

Storage device name

Content

Notes

QSPI Flash

Empty

 

Signals, Interfaces and Pins

I/O Signals

List Overview of the signals between PL I/O banks and external connectors:

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MIOFunctionConnector PinNotes
0---
1QSPI-SPI Flash-CS
2QSPI-SPI Flash-DQ0
3QSPI-SPI Flash-DQ1
4QSPI-SPI Flash-DQ2
5QSPI-SPI Flash-DQ3
6QSPI-SPI Flash-SCK
7GPIO-Green LED D2
8---
9---
28SD CARDJ8-5CLK
29SD CARDJ8-3CMD
30SD CARDJ8-7DAT0
31SD CARDJ8-8DAT1
32SD CARDJ8-1DAT2
33SD CARDJ8-2CD/DAT3
36I2C-SCL
37I2C-SDA
39GPIO-Si1143 INT pin
49SD CARDJ8-G4Card detect switch

I2C Interface

On-board I2C I2C interface is provided via ZYNQ Zynq SoC's PS bank 501 pins MIO36 (SCL) and MIO37 (SDA). I2C addresses for on-board devices are listed in the table below:

I2C I2C DeviceI2C Slave AddressNotes
 Si1143-A11-GMR0x5AProximity and ambient light sensor.

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  • Module size: 18 mm × 51 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 1.6 mm.

  • Highest part on PCB : approx. 4 mm. Please download the step model for exact numbers.

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Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

... g - Plain module

... g - Set of bolts and nuts

Revision History

Hardware Revision History

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