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  • Xilinx Zynq XC7Z010 SoC
  • Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
  • 16 MByte QSPI Flash
  • Micro SD Card socket with card detect signal
  • 34 I/Os on DIP40 header pins
  • System status LED (DONE)
  • RGB LED connected to PL I/O
  • Green user LED connected to ARM CPU GPIO
  • Proximity and ambient light sensor
  • DIP40 form factor (size 18 x 51 mm)

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Figure 3: TE0722-02 PCB bottom side.

  1. Xilinx ZYNQ Zynq XC7Z010 or SoC, U1
  2. Micro SD card socket with card detect, J8
  3. Red LED, D3
  4. Green LED, D2
  5. Red LED, D6
  6. 20-pin connector placeholder, P1
  7. Red LED, D5
  8. Proximity/ambient light sensor, U4
  9. RGB LED, D4
  10. Red LED, D1
  11. 20-pin connector placeholder, P2
  12. Ultra-low supply-current voltage monitor, U4
  13. 2 x 5-pin connector placeholder, J1
  14. 2 x 5-pin connector placeholder, J2
  15. 2 x 5-pin connector placeholder, J3
  16. 16 MByte QSPI Flash memory, U5
  17. Low power programmable oscillator @ 33.333333 MHz, U8
  18. 1A PowerSoC DC-DC converter (1.0V), U2
  19. 1A PowerSoC DC-DC converter (1.8V), U3

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Storage device name

Content

Notes

QSPI Quad SPI Flash

Empty

 

Table 1: .

Boot Process

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Variants Currently in Production

 Module VariantZynq SoCARM Cores

Operating Temperature

Temperature Range
TE0722-02IXC7Z010-1CLG225I
 
Dual-core ARM Cortex-A9

–40°C to +85°C

Industrial
TE0722-02XC7Z010-1CLG225I
 
Dual-core ARM Cortex-A9

0°C to +70°C

Commercial
TE0722-02-07S-1CXC7Z007S-1CLG225C
 
Single-core ARM Cortex-A9

0°C to +70°C

Commercial

Table 8: Module variants.

Technical Specifications

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