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Refer to https://wiki.trenz-electronic.de/display/PD/TEBA0841TEBB0714+TRM for the current online version of this manual and other available documentation.

The Trenz Electronic TEBA0841 TEBB0714 is a Carrier Board for testing, evaluation and development purposes, especially for the Multi -gigabit transceiver Gigabit Transceiver units of the TE0841 and TE0741 modulesTE0714 module. Although this base-board is dedicated to the modules TE0841 and TE0741TE0714 module, it is also compatible with other Trenz Electronic 4 x 5 3 cm SoMs. See page "4 x 5 3 cm carriers" to get information about the SoMs supported by the TEBA0841 TEBB0714 Carrier Board.

This base-board provides also solder pads as place-holders for pin headers as option to get access to the PL I/O-bank pins and further of the mounted TE 4 x 3 SoM.

Key Features

• SFP+ connector (Enhanced small form-factor pluggable), supports support data transmission rates up to 10 Gbit/s
• Micro USB2.0 Type B Connector (J10)
• Trenz 4x5 module Socket (3 x Samtec LSHM series connectors)
• 4 Hirose Ultra small SMT coaxial connectors, support data transmission rates up to 6 Gbit/s
• TE 4 x 3 cm 4 x 5 SoM programmable by XMOD JTAG/UART header (JX1)
• 2 x user LEDs routed to I/O-pins of the SoM
• Soldering-Solder pads J17 and J20 for optional pin headers for access to SoM's PL I/O-bank - pins, usable as LVDS - pairs
• Soldering-Solder pads J3 and J4 for optional pin headers for access to further interfaces and I/O's of the SoM

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Figure 1: TEBA0841TEBB0714-01 Block Diagram.

Main Components

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Figure 2: TEBA0841TEBB0714-01 Carrier Board.

1. 6-pin header J26 for selecting PL-bank I/O voltage
2. 6-pin header J27 for selecting XMOD/JTAG VCCIO
3. Samtec Razor Beam™
4. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
5. Samtec Razor Beam™ LSHM-150 B2B connector, JB3JM1
6. Samtec Razor Beam™ LSHM-130 B2B 150 B2B connector, JB2JM2
7. 6-pin header J26, for selecting PL I/O-bank voltage
8. 6-pin header J27, for selecting PL I/O-bank voltage
9. Micro USB2.0 Type B Connector J12 (Device or OTG mode)
10. XMOD header, JX1
11. Ultra small SMT coaxial connector, J5
12. Ultra small SMT coaxial connector, J6
13. Ultra small SMT coaxial connector, J7
14. Ultra small SMT coaxial connector, J8JTAG/UART header, JX1 ('XMOD FTDI JTAG Adapter'-compatible pin-assignment)
15. User LED D1 (green)
16. User LED D2 (red)
17. SFP+ Connector, J1
18. 50-pin header soldering-pads J17, for access to PL I/O-bank pins (LVDS-pairs possible)
19. LED D3 (red) indicating FPGA's 'Programming DONE'-signal
20. SFP+ Connector, J1
21. 10-pin header solder pads J4 for access to SoM's 50-pin header soldering-pads J20, for access to PL I/O-bank pins banks (LVDS-pairs possible)
22. 16-pin header soldering-solder pads J3, JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible pin-assignment)
23. 1050-pin header soldering-pads J4, solder pads J20 for access to SoM's PL I/O-banks (LVDS pairs possible)
24. 50-pin header solder pads J17 for access to SoM's SDIO-port, if availablePL I/O-banks (LVDS pairs possible)

Initial Delivery State

Board is shipped in following configuration:

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