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The Trenz Electronic TEB0911 UltraRack+ board is an industrial-grade motherboard integrating a Xilinx Zynq Ultrascale+ MPSoC with 4 GByte Flash memory for configuration and operation, DDR4-SDRAM SODIMM SO-DIMM socket with 64-bit wide data bus, 24 22 MGT Lanes lanes and powerful switch-mode power supplies for all on-board voltages.. The motherboard TEB0911 board exposes the pins of the Zynq MPSoC 's pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ MPSoC and for developing purposes. The motherboard board is capable to be fitted to a dedicated enclosure. On , whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT interfaces lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces for , namely USB3.0, SFP+, SSD, GbE, etc.

Key Features

  • Single 24V main power supply
  • 2x USB3 A Connector (Superspeed Host Port (Highspeed in USB2 mode))
  • Gigabit Ethernet RGMII PHY with RJ45 MegJack
  • Dual SFP+ Connector (2x1 Cage)
  • DDR4-SDRAM SODIMM SO-DIMM socket (64bit bus width)
  • SSD (Solid State Disk) ConnectorPCIe connector
  • CAN FD Transceiver (10 Pin IDC interface (D-SUB 9-pin male connector and 6-pin header)
  • 1x DisplayPort (2 lanes)
  • 4x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x  Microchip 24AA025E48T-I/OT)
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • 6x FMC HPC Connectorsconnectors
  • 6x FMC Fans
  • 3x Optional 3x  4-wire PWM fan connectors
  • 10 output programmable PLL clock generator Si5345A
  • Quad programmable PLL clock generator SI5338A
  • 1x SMA coaxial connectors for reference clock signal input
  • MicroSD-Socket SD Card socket (bootable)
  • 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit)
  • System Controller CPLD Lattice MachXO2 7000 HC
  • 2x JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) XMOD header for programming MPSoC and SC CPLD
  • On-board DC-DC PowerSoCs and LDOs

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titleFigure 1: TEB0911-03 block diagram

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Main Components

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titleFigure 2: TEB0911-03 main components

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  1. SFP+ 2x1 cage with integrated LED light pipes, J9
  2. DisplayPort connector, J12
  3. USB3 A 2x , RJ45 1x (stacked), J13
  4. FMC connector (FMC B), J4
  5. FMC B cooling fan, M2
  6. FMC connector (FMC C), J8
  7. FMC C cooling fan, M3
  8. FMC connector (FMC D), J7
  9. FMC D cooling fan, M4
  10. FMC connector (FMC E), J6
  11. FMC E cooling fan, M5
  12. I²C programming header of on-board PLL clock generator U17, J22
  13. 4-Wire PWM fan connector, J23
  14. Main Power Jack 24V, J1
  15. CAN bus D-SUB 9-pin male connector, J3
  16. CAN bus 6-pin header male, J15
  17. XMOD JTAG header for access to System Controller CPLD, J35
  18. XMOD JTAG header for access to Zynq MPSoC, J24
  19. 4-Wire PWM fan connector, J33
  20. Battery Holder CR1220, B1
  21. SMT coaxial connector (PLL Si5345A U17 clock input), J25
  22. Push Button, S1
  23. Push Button, S2
  24. DDR4 SO-DIMM socket, U3
  25. 4-bit DIP-switch, S4
  26. 4-bit DIP-switch, S3
  27. FMC connector (FMC A), J10
  28. FMC A cooling fan, M1
  29. FMC connector (FMC F), J21
  30. FMC F cooling fan, M6
  31. NGFF M.2 PCIe socket (Key M), U2
  32. SD Card socket, J11
  33. User LEDs (3x green, 1x red) with LED light pipe, D13 ... D16
  34. Green LEDs dedicated to USB3 hub U4, D17 ... D19
  35. Red LED indicating FPGAs 'DONE' signal, D6
  36. 4-Wire PWM fan connector, J2
  37. Xilinx Zynq Ultrascale+ MPSoC, U1

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Storage device name

Content

Notes

User configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT)EmptyNot programmed
USB3 HUB Configuration EEPROM (Microchip 24LC128-I/ST)EmptyNot programmed
Si5338A programmable PLL NVM OTPEmptyNot programmed
Si5345A programmable PLL NVM OTPEmptyNot programmed
eMMC Flash memoryEmptyNot programmed
2 QSPI Flash memoryEmptyNot programmed

Table 1: Initial delivery state of programmable devices on the module.

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titleFigure 3: General overview of the FMC connectors

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HTML
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MGT lanes should be listed separately, as they are more specific than just general I/Os.
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titleFigure 7: SFP+ interface

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ConnectorInterface

Signal Schematic Name

Connected toLogicNotes

SFP+ J9A

MGT Lane
  • B129_TX3_P
  • B129_TX3_N
  • B129_RX3_P
  • B129_RX3_N

MGTHTXP3_129, G31
MGTHTXN3_129, G32
MGTHRXP3_129, F33
MGTHRXN3_129, F34

TX: Output

RX: Input

Multi gigabit highspeed
data lane
I²C
  • SFP0_SDA
  • SFP0_SCL
8-channel I²C-switch U37BiDir2-wire Serial Interface
Control Lines
  • SFP0_RS0
I²C 8-bit I/O Port-Expander U86

Output, low active

Full RX bandwidth
  • SFP0_RS1
Output, low activeReduced RX bandwidth
  • SFP0_M-DEF0
Input, low activeModule present / not present
  • SFP0_TX_FAULT
Input, high activeFault / Normal Operation
  • SFP0_LOS
SC CPLD U27, bank 2, pin V8Input, high activeLoss of receiver signal
  • SFP0_TX_DIS
SC CPLD U27, bank 2, pin Y7Output, low activeSFP Enabled / Disabled

SFP+ J9B

MGT Lane
  • B129_TX2_P
  • B129_TX2_N
  • B129_RX2_P
  • B129_RX2_N

MGTHTXP2_129, H29
MGTHTXN2_129, H30
MGTHRXP2_129, H33
MGTHRXN2_129, H34

TX: Output

RX: Input

Multi gigabit highspeed
data lane

I²C
  • SFP1_SDA
  • SFP1_SCL
8-channel I²C-switch U37Bidir2-wire Serial Interface
Control Lines
  • SFP1_RS0
I²C 8-bit I/O Port-Expander U86Output, low activeFull RX bandwidth
  • SFP1_RS1
Output, low activeReduced RX bandwidth
  • SFP1_M-DEF0
Input, low activeModule present / not present
  • SFP1_TX_FAULT
Input, high activeFault / Normal Operation
  • SFP1_LOS
SC CPLD U27, bank 2, pin W7Input, high activeLoss of receiver signal
  • SFP1_TX_DIS
SC CPLD U27, bank 2, pin V7Output. low activeSFP Enabled / Disabled

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titleFigure 16: Power distribution diagram

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Power distribution to the MPSoC PS and PL units:

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The TEB0911 board is capable to be operated at an operational temperatur range of 0 °C ... 85 °C without FMC cooling fans M1 ... M6 and NGFF M.2 PCIe socket U2.

Physical Dimensions

  • Module Board size: ... mm 406mm × 234... mm30mm.  Please download the assembly diagram for exact numbers.Mating height with standard connectors: ... mm.

  • PCB thickness: 1... 65 mm.

  • Highest part on PCB: approx. ... mm. Please download the step model for exact numbers.

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titleFigure 19: Board physical dimensions drawing

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titleFigure 20: Board physical dimensions drawing

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Revision History

Hardware Revision History

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Include Page
IN:Legal Notices
IN:Legal Notices

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