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The TEF1001 FPGA board is a PCI Express card designed to fit into systems with PCI Express x8 slots and has a data transmission capability which meets PCIe Gen. 2 with 4 GTX lanes connected to the PCIe interface.
See next section for the overview of FPGA MGT lanes routed to the PCIe interface.
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Table below describes the functionalities of the switches of DIP-switches S3 and S4 at their each positions:
DIP-switch S3 | Signal Schematic Name | Connected to | Functionality | Notes |
---|---|---|---|---|
S1-1 | JTAG_EN | SC CPLD U5, bank 1, pin 82 | enables JTAG interface of SC CPLD U5 | SC CPLD programmable through JTAG connector, J8 |
S1-2 | VID0_FMC_VADJ_CTRL | SC CPLD U5, bank 1, pin 71 | set 3-bit code to set FMC_VADJ voltage | The FMC_VADJ voltage is provided by DCDC U7 EN5365QI, the voltage can be set from 0.8V to 3.3V in 7 steps, see |
S1-3 | VID1_FMC_VADJ_CTRL | SC CPLD U5, bank 1, pin 63 | ||
S1-4 | VID2_FMC_VADJ_CTRL | SC CPLD U5, bank 1, pin 62 |
Table 13: DIP-switch S1 functionality description
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Bank Voltages
Bank | Schematic Name | Voltage | Range | Notes |
---|---|---|---|---|
0 | 1V8 | 1.8V |
- | Config bank |
0 fixed to 1.8V |
12 |
FMC_VADJ | user | HR |
: 1.2V to |
3. |
3V | FMC_VADJ voltage ajustable by DIP switch S1 | ||
13 | FMC_VADJ | user | HR |
: 1.2V |
to 3. |
3V | FMC_VADJ voltage ajustable by DIP switch S1 |
14 |
1V8 | 1.8V |
HR: 1.2V to 3.3V | PL bank 14 fixed to 1.8V |
15 | FMC_VADJ | user | HR |
: 1.2V |
to 3. |
3V | FMC_VADJ voltage ajustable by DIP switch S1 | ||
16 | VIO_B_FMC | user | HR |
: 1.2V to 3.3V | PL bank 16 fixed to 1.8V |
32 | 1V5 | 1.5V | HP: 1.2V to 1.8V | DDR3 memory interface |
33 |
1V5 | 1.5V | HP: 1.2V to 1.8V | DDR3 memory interface |
34 |
1V5 | 1.5V | HP: 1.2V to 1.8V | DDR3 memory interface |
115 116 |
117
118MGTAVCC_FPGA MGTVCCAUX |
MGTAVTT_FPGA
1.0V
1.8V
1.2V
MGT bank supply voltage
MGT bank auxiliary supply voltage
MGT bank termination circuits voltage
Table 15: Module power rails
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_FPGA MGTAVTT_FPGA | 1.0V 1.8V 1.2V | MGT bank supply voltage MGT bank auxiliary supply voltage MGT bank termination circuits voltage | MGT banks with Xilinx GTX transceiver units |
Table 15: Board I/O bank voltages
Power Rails
Connector / Pin | Voltage | Direction | Notes |
---|---|---|---|
J4, pin 2 | 12V |
Output | 4-wire PWM fan connector supply voltage | |
J6, pin 2 | 5V |
Output | Cooling fan M1 supply voltage | |
J8, pin 6 |
3V3 | Output | VCCIO CPLD JTAG | |
J9, pin 2 | 1V8 | Output | VCCIO FPGA JTAG |
J2, pin C35 / C37 | 12V | Output |
FMC supply voltage |
J2, pin D32 |
3V3 | Output | VCCIO FMC | |
J2, pin D36 / D38 / D39 / D40 | 3V3FMC | Output | VCCIO FMC |
J2, pin H1 | VREF_A_M2C | Input | VREF voltage for bank |
13 / |
15 | |||
J2, pin K1 | VREF_B_M2C | Input | VREF voltage for bank |
16 | |||
J2, pin J39 / J40 | VIO_B_FMC | Input | PL I/O voltage bank |
16 (VCCO) | |
J2, pin H40 / G39 / F40 / E39 | FMC_VADJ |
Output | PL I/O voltage bank 12 / 13 / 15 (VCCO) | |
J1, pin |
B1 / B2 / B3 / A2 / A3 | 12V_input_B |
Input |
12V main power supply from PCIe connector | |||
J5, pin 1 / 2 / 3 | 12V_input_A | Input | Main power supply connector |
Table 16: Module PL I/O bank voltages Board power rails
Variants Currently In Production
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Parameter | Min | Max | Units | Reference Document | |||||
---|---|---|---|---|---|---|---|---|---|
VIN supply voltage | 11.4 | 12.6 | V | 12V nominal, ANSI/VITA 57.1 power specification for FMC connector | |||||
Supply voltage for HR I/O banks (VCCO) | 1.140 | 3.465 | V | Xilinx datasheet DS182 | |||||
Supply voltage for HP I/O banks (VCCO) | 1.140 | 1.890 | V | Xilinx datasheet DS182 | |||||
I/O input voltage for HR I/O banks | –0-0.500 | VCCO + 0.20 | V | Xilinx datasheet DS182 | |||||
I/O input voltage for HP I/O banks | –0-0.500 | VCCO + 0.20 | V | Xilinx datasheet DS182 | |||||
Differential input voltage | -0.2 | 2.625 | V | Xilinx datasheet DS182 | |||||
I/O input voltage for SC CPLD U5 | -0.3 | 3.6 | V | Lattice MachXO2 Family datasheet | |||||
Voltages on LTM4676 I²C pins (LTM_SCL, LTM_SDA), header J10 | 0 | 3.3V | V | LTM4676A datasheet | |||||
Industrial Module Board Operating Temperature Range | -40 | 85 | °C | Xilinx datasheet DS182 | Commercial Module Operating Temperature Range | 0 | 85°C | Xilinx DS182, Silicon Labs Si5338 datasheets |
Table 18: Module recommended operating conditions
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Board size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
PCB thickness: ca. 1.55 mm.
The board meets the PCIe standard specifications for the dimensions of a PCIe cardCard Electromechanical specifications Revision 1.1
All dimensions are given in millimeters.
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