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Template Revision 2.3

TRM Name always "TE Series Name" +TRM, for example "TE0720 TE0728 TRM"


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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
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        titleText


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      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
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        titleText

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        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A An incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>#<anchor name>
    • Refer to Anchror Anchor from external : <page url>#<pagename URL>#<page name without space characters>-<anchorname><anchor name>



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Note for Download Link of the Scroll ignore macro:


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Download PDF version of this document.


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Table of Contents

Table of Contents

Overview

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Notes :

Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive Zynq-7020 FPGA, two 100 Mbit Ethernet transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. 

Within the complete module only Automotive components are installed.

All this in a compact 6 x 6 cm form factor, at the most competitive price.The Trenz Electronic TEB0728 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 6 x 6 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups. See "6 x 6 SoM" Carriers" page for more information about 6 x 6 cm SoMs. 

Refer to http://trenz.org/te0728TEB0728-info for the current online version of this manual and other available documentation.

Key Features

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    • Note:
  • Samtec Tiger Eye Terminal Socket ( 80 pins, 2 rows)
  • Micro SD card socket
  • 3 User LEDs, Red, Yellow, Green
  • Two RJ45 Gigabit Ethernet socket
  • Trenz 6x6 module connector strips (3 x Samtec TEM Tiger Eye series connectors)
  • Barrel Jack for 12V 5V power supply 
  • One user push button

Block Diagram

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titleTE0728 TEB0728 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below

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Scroll Title
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titleTE0728 TEB0728 main components


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  1. User push-button, S1
  2.  Jumper (Boot Mode), J4
  3. External connector (VG96) placeholder, J5 / J6
  4. LEDs , D1
  5. SD Card Connector, J10
  6. Board to Board Connector, J1-J2-J3
  7. LEDs , D1
  8. CR1220 Backup-Battery holder, B1
  9. SD Card Connector, J10
  10. RJ45 Gigabit Ethernet connector, J7-J8
  11. User push-button, S1
  12.  Jumper, J4
  13. RJ45 Gigabit Ethernet connector, J7-J8
  14. XMOD JTAG- / UART-header, JB1
  15. Barrel jack for 5V Barrel jack for power supply, J9
  16. Jumper Jumper(VCCIO_13), J11
  17. CR1220 Backup-Battery holder, B1

Initial Delivery State

There is no hardware component to be programmed on the carrier.

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Quad SPI Flash

Not Programmed

DDR3 SDRAM

Not Programmed

RTC

Not Programmed

...

---

------


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables,

Boot Process


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titleBoot process.

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Signal

DesignatorB2BJumperMODE Signal StateBoot Mode

High or open

QSPI

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

...

anchorTable_SIP_B2B
titleGeneral PL I/O to B2B connectors information

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JTAG Interface

JTAG access to the Xilinx XXXXXXX FPGA through B2B connector JM2.

...

anchorTable_SIP_JTG
titleJTAG pins connection

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JTAG Signal

...

B2B Pin

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

anchorTable_OBP
titleOn board peripherals

...

Boot_R

J4

J2-11

Open

QSPI

ShortSD Card



There is a user push button which is used for RESET signal.

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titleReset process.

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Signal

DesignatorB2BActive Level

RESET

S1

J2-7

Active High


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

Number of I/O signals FPGA bank numbers connected to the B2B connectors:

Scroll Title
anchorTable_SIP_B2B
titleGeneral overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

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B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O48 singel ended, 24 differentialConnected to Bank 13
4 Single endedMIO10...13
CANH , CANL2 single endedMIO8, MIO9
J2

User I/O22 singel ended, 11 differential
38 single endedMIO16...53
SoM Control Signals5RESET, RST_OUT, BOOT_R,
JTAG Interface4TCK , TDO, TDI, TMS

J3


User I/O20 Single ended, 10 differential


Connected to Bank 35
34 single ended, 17 differentialConnected to Bankd 33
Ethernet 14 single ended, 2 differentialETH_CTREF , ETH_TD+, ETH_TD- , ETH_RD+, ETH_RD-, ETH_LED1, ETH_LED2, ETH_LED3
Ethernet 24 single ended, 2 differentialETH_CTREF , ETH_TD+, ETH_TD- , ETH_RD+, ETH_RD-, ETH_LED1, ETH_LED2, ETH_LED3


On-board Connector

There are two pin placeholder on the board, J5-J6. 

On-board QSPI flash memory S25FL127SABMFV10 is used to store initial FPGA configuration. Datasheet is provided in Texas Instruments. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.

...

anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins

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U7 Pin
Scroll Title
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titleI2C interface MIOs and pinsGeneral information about On-board connectors information

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VGA96 Vertical ConnectorInterfacesNumber of I/O
MIO PinSchematic
Notes
SDASCL

EEPROM

...

anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins
J5

User I/O48 singel ended, 24 differentialConnected to Bank 13
34 single ended, 17 differentialConnected to Bank 33
J6

User I/O42 singel ended, 21 differential
27 single endedMIO16... MIO39 + MIO51...53
4 single endedMIO10...13
SoM Control Signals3RESET, RST_OUT, BOOT_R
JTAG Interface4TCK , TDO, TDI, TMS

CANH , CANL

2 single endedMIO8, MIO9


JTAG Interface Base

JTAG access to the TEB0728 Trenz module is available through B2B connector J2. JTAG Programmer TE0790_02 is provided by Trenz Electronic, More information is available here.

...

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titleOn-board LEDsJTAG interface Base

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SchematicColorConnected toActive LevelIO Standard

...

The TE0728 SoM has XXX GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

...

anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

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Designator

B2B Pin

XMOD Header JB1Note
AJ2-15JB1-3UART Txd - input
BJ2-16JB1-7UART Rxd - Output
CJ2-12JB1-4JTAG-TMS
DJ2-10JB1-8JTAG-TDI
FJ2-8JB1-10JTAG-TDO
HJ2-6JB1-12

JTAG-TCK

GJ2-7JB1-11RESET will be connected to Push Button on JTAG Programmer
3.3V-JB1-5connected to GND
VIOJ2-2/4JB1-6VIO is connected to 3.3V which is supplied by carrier


SD Card Socket

Power supply voltage for SD card holder is 3.3V.

...

CAN Transceiver

Scroll Title
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titleCAN Tranciever interface MIOsOn board peripherals

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MIO PinSchematicU16 PinNotes
DR

Low Quiescent Current Programmable Delay Supervisory Circuit

Low Dropout Linear Regulator

...

SignalsB2BNotes
CMDJ2-29
CLKJ2-34
DAT0J2-37
DAT1J2-40
DAT2J2-32
CD/DAT3J2-31
CDJ2-35
WPJ2-33


RJ45 Connector

Both Ethernet sockets,ETH1 and ETH2, are connected to the Board to Board (B2B) J3 on the carrier.

Scroll Title
anchorTable_OBP_CLKETH
titleOsillatorsEthernet Connections to B2B Connectors

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ICDescriptionFrequencyUsed as
MEMS OscillatorMHzMEMS OscillatorMHzRTC (internal oscillator)KHz

...

Power Supply

Power supply with minimum current capability of 3.5 A for system startup is recommended.

Power Consumption

...

anchorTable_PWR_PC
titlePower Consumption

...

Power Distribution Dependencies

...

anchorFigure_PWR_PD
titlePower Distribution
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SignalETH1ETH2Notes
ETH_TD+J3-58J3-28Transfer
ETH_TD-J3-56J3-26
ETH_RD+J3_52J3-22Receive
ETH_RD-J3-50J3-20
ETH_CTREFJ3_57J3-25
ETH_LED1J3-55J3-23Yellow LED- Activity
ETH_LED3J3-51J3-19Green Green- Link


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

Push button

Power-On Sequence

...

anchorFigure_PWR_PS
titlePower Sequency
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Scroll Title
anchorTable_OBP_PWRPush_PRButton
titleModule power rails.On-board push button

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DesignatorConnected to
Power Rail Name
B2B
Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

...

Active LevelNote
S1-ARESETJ2-7Active highGeneral Input RESET


Jumpers

Scroll Title
anchorTable_PWROBP_BVJumpers
titleZynq SoC bank voltages.On-board Jumpers

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Bank          

Schematic Name

Voltage

Notes

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DesignatorConnected toB2BNote
J4Boot_RJ2-11Open: QSPI
Short: SD Card



...

6 x 6 modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

  • 3 x REF-189018-01 (compatible to SEM-140-02-03.0-H-D-A), (80 pins, "40" per row)

    Operating Temperature:-55°C ~ 125°C
    Current Rating: 2.6A per ContactNumber of Positions: 80
    Number of Rows: 2

Absolute Maximum Ratings

Processing System(PS)

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anchorTable_TSOBP_AMR_PSJumpers
titlePS absolute maximum ratingsOn-board Jumpers

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SymbolsDescriptionMinMaxUnit
VCCPINTPS internal logic supply voltage-0.51.1V
VCCPAUXPS auxiliary supply voltage-0.52.0V
VCCPLLPS PLL supply-0.52.0V
VCCO_DDRPS DDR I/O supply voltage-0.52.0V
VPREFPS input reference voltage-0.52.0V
VCCO_MIO0PS MIO I/O supply voltage for HR I/O banks-0.53.6V
VCCO_MIO1PS MIO I/O supply voltage for HR I/O banks1.713.45V

...

anchorTable_TS_AMR_PL
titlePL absolute maximum ratings

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DesignatorConnected toVoltageNote
J11VCCIO_133.3 VPin 1 and the middle pin are connected
1.8 VPin 3 and the middle pin are connected



LEDs

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titleOn-board LEDs

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DesignatorColorB2BActive LevelNote
D1-ARedJ2-30Active high
D1-BYellowJ2-38Active high
D1-CGreenJ2-36Active high


Power and Power-On Sequence

Power Supply

Note
No power supply protection circuit on the carrier, module will be powered directly

Single 5V power supply with minimum current capability of 2.5A is recommended to operate the board.

  •  5V VIN (inner)
  • GND (outer)

    Scroll Title
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    titlePower Connector

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Power Consumption

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titlePower Consumption

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Power Input PinTypical Current
VIN

TBD*

VBATT

TBD*


* TBD - To Be Determined

Power Rails

Technical Specifications

...

Scroll Title
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titleModule absolute maximum ratingsCarrier Power Rails.

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ParameterMinMaxUnitsReference Document
VIN supply voltage3.560VTPS54260-Q1 datasheets.
Supply voltage for PS MIO banks1.713.465VSee Xilinx DS187 datasheet.
I/O input voltage for PS MIO banks-0.2VCCO_MIO + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for PS DDR1.141.89VSee Xilinx DS187 datasheet.
I/O input voltage for PS DDR-0.20VCCO_DDR + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for HR I/Os banks1.143.465VSee Xilinx DS187 datasheet.
I/O input voltage for HR I/O banks-0.20VCCIO + 0.20VSee Xilinx DS187 datasheet.
Storage Temperature-40125°CSee Xilinx DS187 datasheet.

...

Commercial grade: 0°C to +70°C.

Industrial and automotive grade: -40°C to +85°C.

...

true

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes
JB1

VIN

Output

1, 3

Up to 12V carrier supply voltage
3.3VInput19PL IO-bank VCCIO
VCCO_13Output391.8V or 3.3V over jumper
JB2

3.3V

Input

2, 4

3.3V module supply voltage
1.8VInput5PL IO-bank VCCIO
VBATTOutput1RTC buffer voltage
JB3----


Board to Board Connectors

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  • use "include page" macro and link to the general B2B connector page of the module series, for example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    6 x 6 SoM LSHM B2B Connectors
    6 x 6 SoM LSHM B2B Connectors

Include Page
6 x 6 SoM TEM and SEM B2B Connectors
6 x 6 SoM TEM and SEM B2B Connectors

Absolute Maximum Ratings

Scroll Title
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titleRecommended operating conditionsModule absolute maximum ratings.

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ParameterMinMaxUnitsReference Document
VIN supply voltage3.560VTPS54260-Q1 datasheets.
Supply voltage for PS MIO banks1.713.465VSee Xilinx DS187 datasheet.
I/O input voltage for PS MIO banks-0.2VCCO_MIO + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for PS DDR1.141.89VSee Xilinx DS187 datasheet.
I/O input voltage for PS DDR-0.20VCCO_DDR + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for HR I/Os banks1.143.465VSee Xilinx DS187 datasheet.
I/O input voltage for HR I/O banks-0.20VCCIO + 0.20VSee Xilinx DS187 datasheet.
Storage Temperature-65150°CSee Xilinx DS187 datasheet.
CAN Transceiver Temperature-40125°CSee Texas Instrument sn65hvd230q-q1 datasheet.
SPI Flash Memory-4085°CSee Cypress S25FL127S datasheet.
DDR3 SDRAM Temperature-4095°C

See Nanya NT5CC256M16CP-DIA datasheet.

...

anchorFigure_TS_PD
titlePhysical dimensions drawing

ParameterMinMaxUnitsNote
VIN supply voltage----V
  • Connected directly to the module power supply, see Module TRM
Storage Temperature-25+85°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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titleRecommended operating conditions.

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ParameterMinMaxUnitsNote
VIN supply voltage----V
  • Connected directly to the module power supply, see Module TRM
  • 5V recommended for usage with TE0728
Operating Temperature-25+85°C


Physical Dimensions

  • Module size: 100 mm × 107.7 Module size: 60 mm × 60 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 7 mm.

  • PCB thickness: 1.6 mm.

Physical Dimension
Scroll Title
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titlePhysical Dimension


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Currently Offered Variants

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titleTrenz Electronic Shop Overview

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Trenz shop TE0728 TEB0728 overview page
English pageGerman page


Revision History

Hardware Revision History

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DateRevisionChanges
2018-07-1802
  • changed value R1
  • changed magjack connectors J7, J8
  • changed 2.1mm power jack THT on SMD
  • magjack connectors: pin8 connected to frame (shassis ground)
  • lib component update
  • added thermal bias to mounting holes
  • added visual serial number
  • changed 2.1mm power jack THT on SMD
  • added 2 x 10uF to VIN
2016-11-0201
  • --
DateRevisionNotePCNDocumentation Link
-01Prototypes-
  • -



Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

Document Change History

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    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf PDF export template

    • Metadata is only used of compatibility of older exports

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anchorTable_RH_DCH
titleDocument change history.

Scroll Table Layout
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sortDirectionASC
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style
widths
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cellHighlightingtrue

DateRevisionContributorDescription

Page info
infoTypeModified date
dateFormatyyyy-MM-dd
typeFlat

Page info
infoTypeCurrent version
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Page info
infoTypeModified by
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change list

  • typo table title

  • power rail section
2019-6-25v.132Pedram Babakhani
  • initial release

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all

Page info
infoTypeModified users
typeFlat
showVersionsfalse

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