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Table of Contents

Table of Contents

Overview

The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ...TEI0016 is a commercial-grade module based on Intel® MAX 10. Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to http://trenz.org/tec0850tei0016-info for the current online version of this manual and other available documentation.

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • ...
  • ....
  • ....

Block Diagram

  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C

    • Package compatible device 10M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

  • 8x User LED 
  • Micro USB Connector

  • 16 Bit Analog to Digital Converter with 1 MSPS or 500 kSPS

  • 2x SMA Female Connector

  • I/O interface: 23x GPIO

  • Power Supply: 5V (from USB)

  • Dimension: 25 mm x 86.5 mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



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titleTEI0016 block diagram
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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

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Main Components

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titleTExxxx TEI0016 main components


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  1. SMA Connector, J5...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module
  1. 6
  2. Amplifier, U12
  3. Analog to Digital Converter, U6
  4. Voltage Reference, U8
  5. Voltage Regulator, U10 - U13 - U16
  6. Switching Voltage Regulator/LDO, U11 - U4
  7. SDRAM Memory, U2
  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)
  10. 12.00 MHz MEMS oscillator, U7
  11. FTDI USB to JTAG/UART/FIFO, U3
  12. User LEDs, D2...9
  13. 4Kb EEPROM, U9
  14. Configuration LED (Red) , D10
  15. Power-on LED (Green), D1
  16. Push button, S1...2
  17. Micro USB Connector, J9
  18. 1x14 pin header, J2 (Not assembled)
  19. 1x6 pin header, J4 (Not assembled)
  20. Jumper, J3
  21. 1x14 pin header, J1 (Not assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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Storage device name

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Content

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Notes

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Quad SPI Flash

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Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.
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MODE Signal State

Boot Mode
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titleReset process.
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Signal

B2BI/ONote

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Storage device name

Content

Notes

Quad SPI Flash

N/A

Not populated

EEPROMProgrammed

FTDI configuration


Configuration Signals

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

FPGA Reconfigration can be triggered by pressing push button S1.

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titleReset process.

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titleGeneral PL I/O to B2B connectors information

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

Signal

Push ButtonPin HeaderNote

RESET

S1J2Connected to nCONFIG


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

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titleGeneral I/Os to Pin Headers and connectors information

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


FPGA I/O Banks

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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JTAG Signal

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B2B Connector

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MIO Pins

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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MIO PinConnected toB2BNotes

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MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

Designator
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FPGA BankI/O Signal CountConnected to
Chip/Interface
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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titleQuad SPI interface MIOs and pins
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


41x14 Pin header, J1D2...5
5ADC, U15ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
112MHz Oscillator, U7CLK12M
2Amplifier, U12nIAMP_A0, nIAMP_A1
Bank 322SDRAM, U2RAM_ADDR_CMD
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
Bank 8



8User Red LEDs, D2...9LED0...7
6SPI Flash, U5F_CS, F_CLK, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-USB Connector

The Micro-USB2 connector J9 provides an interface to access the UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that USB driver is installed on your host PC.

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titleI2C interface MIOs and pins

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titleI2C Address for RTC

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Notes
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titleI2C EEPROM interface MIOs and Micro USB-2 connector pins

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Pins
MIO Pin
Connected to
SchematicU?? Pin
Note
VBUSUSB_VBUS
D+FTDI U3, DP pin
D-FTDI U3, DM pin