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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

      -UBGA

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C

      ~

      to 85°C

    • Package compatible device

      10M02

      10M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to

    64Mb, 166MHz

    32 Mbyte (8Mbyte default)

  • USB 2.0

    Dual High Speed USB to

    Multipurpose UART/FIFO IC

  • Quad SPI Flash, 64Mb
  • (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

    EEPROM Memory, 4Kb

  • 8x User LED 
  • Micro USB

    port

    Connector

  • 16 Bit 500kSPS Analog to Digital Converter with 1 MSPS or 500 kSPS

  • 2x SMA Female Connector

  • I/O interface: 23x GPIO

  • Power Supply: 5V (from USB)

  • Dimension: 25 mm x 86.5 mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational

    Others:

    • Dimension: 86m x 25m

    • Instrumentation Amplifier

    • Voltage Feedback

      Amplifier

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTEI0016 block diagram


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Scroll Title
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titleTEI0016 main components


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  1. SMA Connector, J5...6
  2. Amplifier, U12
  3. Analog to Digital ConvertorConverter, U6
  4. Voltage Reference, U8
  5. Voltage Regulator, U10 - U13 - U16
  6. Switching Voltage3 Voltage Regulator/LDO, U11 - U4
  7. SDRAM Memory, U2
  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)
  10. 12.00 MHz MEMS oscillator, U7
  11. FTDI USB2 USB to JTAG/UART adapter/FIFO, U3
  12. User LEDs, D2...9
  13. 4Kb EEPROM, U9
  14. Configuration LED (Red) , D10
  15. Power-on LED (Green), D1
  16. Push button, S1...2
  17. Micro USB2 socket (Receptacle)USB Connector, J9
  18. 1x14 pin header , J2 (Not assembled), J2
  19. 1x6 pin header , J4 (Not assembled), J4
  20. Jumper, J3
  21. 1x14 pin header , J1 (Not assembled), J1

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Scroll Title
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titleInitial delivery state of programmable devices on the module

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SDRAM

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROMProgrammed

FTDI configuration

Not Programmed


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

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titleReset process.

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Signal

Push ButtonPin HeaderNote

RESET

S1J2connected Connected to nCONFIG


Signals, Interfaces and Pins

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titleFPGA I/O Banks

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FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


41x14 Pin header, J1D2...5
5A2DADC, U15ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
112MHz Oscillator, U7CLK12M
2Amplifier, U12nIAMP_A0, nIAMP_A1
Bank 322SDRAM, U2RAM_ADDR_CMD
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
Bank 8



8User Red LEDs, D2...9LED0...7
6SPI Flash, U5F_CS, F_CKCLK, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-

...

USB Connector

The Micro-USB2 connector J9 provides an interface to access the UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that USB driver is installed on your host PC.

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titleMicro USB-2 connector pins

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It is connected to GND
PinsConnected toNote
VBUSUSB_VBUS
D+FTDI U3, DP pin
D-FTDI U3, DM pin


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titleJTAG pins connection

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JTAG Signal

Pin Header Connector

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V.


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
SDRAM
77530151U2
FTDI FT2232HU3JTAG/UART
AdapterSPI Flash Memory
/FIFO
77530151U5
EEPROM

77530151U9
OscillatorU7
12MHz
12 MHz clock source
ADC
77530151U6Analog to Digital
Convertor
Converter
8x User LEDsD2...9Red LEDs

SDRAM


SDRAM

TEI0016 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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titleSDRAM interface IOs and pins

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 USB to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity features of the FT2232H chip.
FTDI FT2232H chip channel A is used in MPPSE mode for JTAG, 6 I/O's of . Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfaces.is configured to be used as in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

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titleFTDI chip interfaces and pins

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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4user User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4user User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5user User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6user User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6user User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7user User configurable

SPI Flash Memory

On-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

BDBUS6BDBUS6FPGA bank 6, pin C11
BDBUS7BDBUS7FPGA bank 3, pin J7
BCBUS0BCBUS0FPGA bank 5, pin J9
BCBUS1BCBUS1FPGA bank 3, pin K5
BCBUS2BCBUS2FPGA bank 3, pin K5
BCBUS3BCBUS3FPGA bank 3, pin K5
BCBUS4BCBUS4FPGA bank 3, pin K5


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

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titleQuad SPI Flash memory interface

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titleQuad SPI Flash memory interface

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3chip Chip select
F_CLKFPGA bank 8, pin A3clockClock
F_DIFPGA bank 8, pin A2data Data in / out
nSTATUS

FPGA bank 8, pin C4

data Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9data Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2data Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed on in the EEPROM U9.

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titleI2C EEPROM interface MIOs and pins

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0016 board is boards with article nuber - TEI0016-03-08-C8A - are equipped with the Analog Devices DevicesADC - ADAQ7988BCCZ , - 16-bit 500kSPS,
boards wit article number TEI0016-03-08-C8B are equipped with the Analog Devices ADC - ADAQ7980BCCZ - 16-bit 1MSPS.

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anchorTable_OBP_A2D
titleA2D converter interface and pins

...

IN+

...

The ADC can be distinguished via its part code:

  • TEI0016-03-08-C8A: ADAQ7988BCCZ - 16-bit 500kSPS - starts with Y6H
  • TEI0016-03-08-C8B: ADAQ7980BCCZ - 16-bit 1.0MSPS - starts with Y6F
Scroll Title
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titleTEI0016 part code variants


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titleOn-board LEDsADC converter interface and pins

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Designator
Pins
Color
Connected to
Active LevelNoteD2...9RedLED1...8Active HighUser LEDsD10RedCONF_DONEActive LowConfiguration DONE LEDD1Green3.3V Power RailActive HighAfter power on it will be on

Clock Sources

Notes

IN+

U8, VOUT
IN-U12, VOUT
SDIBank 2, ADC_SDI
SDOBank 2, ADC_SDO
SCKBank 2, ADC_SCK
CNVBank 2, ADC_CNV


LEDs

Frequency
Scroll Title
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titleOn-board LEDs
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titleOsillators

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Designator
Clock SourceSchematic Name
ColorConnected toActive LevelNote
Microchip MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3

Connected to FPGA SoC bank 2, pin H6

Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Power RailActive HighAfter power on it will be on.


Push Buttons

Scroll Title
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titleOn-board Push Buttons

Power Supply

To power-up the module, power supply with minimum current capability of 1A is recommended.

Power Consumption

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titlePower Consumption

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

...

DesignatorConnected toFunctionalityNote
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.


Clock Sources

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titlePower DistributionOsillators

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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on the Green LED (D1) must be on.

Power Rails

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titleModule power rails.

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Voltage

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Clock SourceSchematic NameFrequencyNote
MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA bank 2, pin H6.


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

The module is supplied from USB (optionally via unpopulated pin header).

Power Consumption

...

J9

...

Bank Voltages

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titleZynq SoC bank voltages.Power Consumption

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Bank          
FPGA
Schematic Name

Voltage

NotesBank 1AVCCIO1A3.3VBank 1B

VCCIO1B

3.3VBank 2VCCIO23.3VBank 3VCCIO33.3VBank 5VCCIO53.3VBank 6VCCIO63.3VBank 8VCCIO83.3V

Technical Specifications

Absolute Maximum Ratings

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anchorTable_TS_AMR
titlePS absolute maximum ratings

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VIN supply voltage (5.0V nominal)

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Storage Temperature

...

Recommended Operating Conditions

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Typical Current
Intel MAX 10 10M08 FPGATBD*


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on, the green LED (D1) will be on.

Power Rails

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titleModule power rails.

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Power Rail Name

Connector

J2 Pin

Connector

J9 Pin

DirectionNotes
VINJ2-13-Input5 V - Pin Header
3.3VJ2-12-Output
5VJ2-14-Output

USB_VBUS

-J9-1Input5 V - USB Connector


Bank Voltages

Scroll Title
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titleRecommended operating conditionsIntel Max 10 SoC bank voltages.

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SymbolsMinMaxUnitReference Document

VIN supply voltage (5.0V nominal)

4.755.25V
I/O Input voltage for FPGA I/O bank-0.54.12VIntel MAX 10 datasheet
Input Voltage on ADC IC U6 pins-0.33.6VADAQ7988 datasheet
Analog reference voltage on IC U62.45.7VADAQ7988 datasheet

Storage Temperature

0+70°C

Physical Dimensions

Module size: 86.5 mm × 25 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.65 mm.

...

hiddentrue
idComments

In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Bank          

Schematic Name

Voltage

Notes
Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V



Technical Specifications

Absolute Maximum Ratings

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titleAbsolute maximum ratings

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SymbolsDescriptionMinMaxUnitReference Document

VIN 

Supply voltage4.755.25V
CH1-, CH1+Analog input voltage on amplifier U12 pin 1, 10-3030VAD8251 datasheet

T_STG

Storage Temperature-40+85°C



Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Scroll Title
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titleRecommended operating conditions.

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SymbolsMinMaxUnitReference Document
VIN supply voltage (5.0V nominal)4.755.25V
Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+)-1010V
T_OP0+70°CW9864G6JT-6 datasheet


Physical Dimensions

Module size: 86.5 mm × 25 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.22 mm.

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anchorFigure_TS_PD
titlePhysical Dimension

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idComments

In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/enfileadmin/Productsdocs/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.

  • https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/

  • https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/

    _Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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    titlePhysical Dimension


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    Currently Offered Variants 

    Page properties
    hiddentrue
    idComments

    Set correct link to the shop page overview table of the product on English and German.

    Example for TE0728:

    ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    if not available, set.


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    titleTrenz Electronic Shop Overview

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    Trenz shop TEI0016 overview page
    English pageGerman page


    Revision History

    Hardware Revision History

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    titleHardware Revision History

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    DateRevisionChangesDocumentation Link
    2019-02-1101-REV01


    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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    titleTrenz Electronic Shop Overview Board hardware revision number.


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    Trenz shop TEI0016 overview pageEnglish pageGerman page

    Revision History

    Hardware Revision History

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    fitWindowfalse
    diagramDisplayName
    lboxtrue
    revision1
    diagramNameTEI0016_RV_HRN
    simpleViewerfalse
    width
    linksauto
    tbstylehidden
    diagramWidth154


    Scroll Only
    scroll-pdftrue
    scroll-officetrue
    scroll-chmtrue
    scroll-docbooktrue
    scroll-eclipsehelptrue
    scroll-epubtrue
    scroll-htmltrue

    Image Added

    ...

    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

    Scroll Title
    anchorFigure_RV_HRN
    titleBoard hardware revision number.
    TODO add screenshot of the revision nu,mber


    Document Change History

    Page properties
    hiddentrue
    idComments
    • Note this list must be only updated, if the document is online on public doc!
    • It's semi automatically, so do following
      • Add new row below first

      • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

      • Metadata is only used of compatibility of older exports

    ...

    Scroll Title
    anchorTable_RH_DCH
    titleDocument change history.

    Scroll Table Layout
    orientationportrait
    sortDirectionASC
    repeatTableHeadersdefault
    style
    widths
    sortByColumn1
    sortEnabledfalse
    cellHighlightingtrue

    DateRevisionContributorDescription

    Page info
    infoTypeModified date
    dateFormatyyyy-MM-dd
    typeFlat

    Page info
    infoTypeCurrent version
    prefixv.
    typeFlat
    showVersionsfalse

    Page info
    infoTypeModified by
    typeFlat
    showVersionsfalse

    change list

    • major cleanup multiply sections

    2019-09-20

    v.56Kilian Jahn
    • update notes for variants
    2019-06-05v.55ED
    • Technical Specifications updated

    • Power Rails updated

    --

    all

    Page info
    infoTypeModified users
    typeFlat
    showVersionsfalse

    • --


    ...